JP7481104B2 - 伸縮性の導電性フルオロエラストマーペースト組成物 - Google Patents
伸縮性の導電性フルオロエラストマーペースト組成物 Download PDFInfo
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- JP7481104B2 JP7481104B2 JP2019189553A JP2019189553A JP7481104B2 JP 7481104 B2 JP7481104 B2 JP 7481104B2 JP 2019189553 A JP2019189553 A JP 2019189553A JP 2019189553 A JP2019189553 A JP 2019189553A JP 7481104 B2 JP7481104 B2 JP 7481104B2
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- polymer thick
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- 239000000203 mixture Substances 0.000 title claims description 59
- 229920001973 fluoroelastomer Polymers 0.000 title claims description 28
- 229920000642 polymer Polymers 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 23
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical group FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 15
- 239000002904 solvent Substances 0.000 claims description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 13
- 229920001897 terpolymer Polymers 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 12
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 7
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 4
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 claims description 4
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 claims description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 4
- RXRIEAKKQPAUKB-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1.CO[Si](OC)(OC)CCCOCC1CO1 RXRIEAKKQPAUKB-UHFFFAOYSA-N 0.000 claims description 4
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
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- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 3
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- -1 ethylene, tetrafluoroethylene Chemical group 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
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- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
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Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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- C09J2427/00—Presence of halogenated polymer
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- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
Description
本出願は、2018年10月16日に出願された、「Stretchable Conductive Fluoroelastomer Paste Composition」という表題の米国仮特許出願第62/746,269号明細書の便益を主張するものであり、その出願は、それの参照によりあらゆる目的のためにその全体が本明細書に援用される。
本発明は、ウェアラブル及びインモールドエレクトロニクス用の伸縮性ポリマー厚膜導電性フルオロエラストマーペースト組成物を指向する。
本発明は、
a)45~65重量%の導電性粉末と;
b)10~20重量%のフルオロエラストマーと;
c)0.1~3重量%のシランカップリング剤と;
d)0~35重量%の、2-(2-エトキシエトキシ)エチルアセテート、ジエチレングリコールモノブチルエーテルアセテート、エチレングリコールジアセテート、二塩基酸エステル及びC11ケトンからなる群から選択される1種以上の溶媒と;
e)1~35重量%の、トリエチルホスフェート、アセトン、4-メチル-2-ペンタノン、2,6-ジメチル-4-ヘプタノン及びシクロヘキサンからなる群から選択される1種以上の溶媒と
を含むポリマー厚膜導電性ペースト組成物であって、
重量%がペースト組成物の総重量を基準とするペースト組成物を提供する。
導電性粉末は、Ag、Cu、Au、Pd、Pt、Sn、Al、Ni、C、それらの合金及びそれらの混合物の1種以上の導電性粉末である。
別の実施形態において、銀粉末は銀フレークの形態にある。
一実施形態において、フルオロエラストマーは、フッ化ビニリデン含有フルオロエラストマーコポリマーである。このコポリマーは、ターポリマー又はジポリマーであってもよい。
典型的なシランカップリング剤は、[3-(2,3-エポキシプロポキシ)プロピル]トリメトキシシラン(3-グリシジルオキシプロピルトリメトキシシラン)、(アミノプロピル)トリメトキシシラン、(メタクリルオキシプロピル)トリメトキシシラン、(ビニル)トリメトキシシラン及び(メルカプトプロピル)トリメトキシシランである。
溶媒は、0~35重量%の、2-(2-エトキシエトキシ)エチルアセテート(ジエチレングリコールモノエチルエーテルアセテート)、ジエチレングリコールモノブチルエーテルアセテート、エチレングリコールジアセテート、二塩基酸エステル及びc11からなる群から選択される1種以上の溶媒と、1~35重量%の、トリエチルホスフェート、アセトン、4-メチル-2-ペンタノン、2,6-ジメチル-4-ヘプタノン及びシクロヘキサンからなる群から選択される1種以上の溶媒とからなる。
以下に、出願時の特許請求の範囲の記載を示す。
[請求項1]
ポリマー厚膜導電性ペースト組成物であって、
a)45~65重量%の導電性粉末と;
b)10~20重量%のフルオロエラストマーと;
c)0.1~3重量%のシランカップリング剤と;
d)0~35重量%の、2-(2-エトキシエトキシ)エチルアセテート、ジエチレングリコールモノブチルエーテルアセテート、エチレングリコールジアセテート、二塩基性酸エステル及びc11からなる群から選択される1種以上の溶媒と;
e)1~35重量%の、トリエチルホスフェート、アセトン、4-メチル-2-ペンタノン、2,6-ジメチル-4-ヘプタノン及びシクロヘキサンからなる群から選択される1種以上の溶媒と、を含み、前記重量%が前記ペースト組成物の総重量を基準とする、ポリマー厚膜導電性ペースト組成物。
[請求項2]
前記フルオロエラストマーが、フッ化ビニリデン含有フルオロエラストマーコポリマーである、請求項1に記載のポリマー厚膜導電性ペースト組成物。
[請求項3]
前記フルオロエラストマーが、フッ化ビニリデン、ヘキサフルオロプロピレンおよびテトラフルオロエチレンのターポリマーである、請求項2に記載のポリマー厚膜導電性ペースト組成物。
[請求項4]
前記フルオロエラストマーが、フッ化ビニリデンとヘキサフルオロプロピレンとのジポリマーである、請求項2に記載のポリマー厚膜導電性ペースト組成物。
[請求項5]
前記導電性粉末が、Ag、Cu、Au、Pd、Pt、Sn、Al、Ni、C、それらの合金及びそれらの混合物の1種以上の導電性粉末である、請求項1に記載のポリマー厚膜導電性ペースト組成物。
[請求項6]
前記導電性粉末が銀粉末である、請求項5に記載のポリマー厚膜導電性ペースト組成物。
[請求項7]
前記銀粉末が銀フレークの形態にある、請求項6に記載のポリマー厚膜導電性ペースト組成物。
[請求項8]
前記シランカップリング剤が、[3-(2,3-エポキシプロポキシ)プロピル]トリメトキシシラン(3-グリシジルオキシプロピルトリメトキシシラン)、(アミノプロピル)トリメトキシシラン、(メタクリルオキシプロピル)トリメトキシシラン、(ビニル)トリメトキシシラン及び(メルカプトプロピル)トリメトキシシランからなる群から選択される、請求項1に記載のポリマー厚膜導電性ペースト組成物。
[請求項9]
前記シランカップリング剤が[3-(2,3-エポキシプロポキシ)プロピル]トリメトキシシランである、請求項8に記載のポリマー厚膜導電性ペースト組成物。
[請求項10]
0~35重量%の2-(2-エトキシエトキシ)エチルアセテートと1~35重量%のトリエチルホスフェートとを含む、請求項1に記載のポリマー厚膜導電性ペースト組成物。
[請求項11]
請求項1に記載のポリマー厚膜導電性ペースト組成物から形成された印刷導体を含む物品。
[請求項12]
前記物品が着用可能な衣類である、請求項11に記載の物品。
[請求項13]
前記印刷導体が基板上に印刷されていてこれが続いて前記衣類に積層されたものである、請求項12に記載の物品。
[請求項14]
前記物品が熱成形されていて続いて射出成形に供されたものである、請求項11に記載の物品。
[請求項15]
請求項1に記載のポリマー厚膜導電性ペースト組成物から形成された印刷導電性接着剤を含む物品。
[請求項16]
前記物品が熱成形されていて続いて射出成形に供されたものである、請求項15に記載の物品。
実施例1~4並びに比較実験1及び2
実施例E1~E3並びに比較実験CE1~CE2のそれぞれに使用されるフルオロエラストマーは、フッ化ビニリデンと、ヘキサフルオロプロピレンとテトラフルオロエチレンとのターポリマーであり、各PTFペースト組成物は、次の通り調製した。
接着剤層を含有する熱可塑性ポリウレタンフィルムの基材上へ200~325網目数スクリーンを用いてスクリーン印刷した。基材は、DuPontTM Intexar(登録商標)TE-11C(DuPont Co.,Wilmington,DE)かBemisTM ST-604(Bemis Associates Inc.,Shirley,MA)かのいずれかであった。印刷パターンを、対流炉又はベルト炉において100~130℃で10~20分間乾燥させて印刷導体を形成した。
実施例E5に使用されるフルオロエラストマーは、フッ化ビニリデンと、ヘキサフルオロプロピレンとテトラフルオロエチレンとのターポリマーであった。実施例E6に使用されるフルオロエラストマーは、フッ化ビニリデンとヘキサフルオロプロピレンとのジポリマーであった。各PTFペースト組成物を、本質的に、実施例E1~E4及び比較実験CE1~CE2について記載されたように調製した。
接着剤層を含有する熱可塑性ポリウレタンフィルムの基材上へ200~325網目数スクリーンを用いてスクリーン印刷した。基材は、DuPontTM Intexar(登録商標)TE-11C (DuPont Co.,Wilmington,DE)であった。印刷パターンを、対流炉又はベルト炉において100~130℃で10~20分間乾燥させて印刷導体を形成した。
Claims (16)
- ポリマー厚膜導電性ペースト組成物であって、
a)45~65重量%の導電性粉末と;
b)10~20重量%のフルオロエラストマーと;
c)0.1~3重量%のシランカップリング剤と;
d)35重量%以下の、2-(2-エトキシエトキシ)エチルアセテート、ジエチレングリコールモノブチルエーテルアセテート、エチレングリコールジアセテート、二塩基性酸エステル及びc11からなる群から選択される1種以上の溶媒と;
e)1~35重量%の、トリエチルホスフェート、アセトン、4-メチル-2-ペンタノン、2,6-ジメチル-4-ヘプタノン及びシクロヘキサンからなる群から選択される1種以上の溶媒と、を含み、前記重量%が前記ペースト組成物の総重量を基準とする、ポリマー厚膜導電性ペースト組成物。 - 前記フルオロエラストマーが、フッ化ビニリデン含有フルオロエラストマーコポリマーである、請求項1に記載のポリマー厚膜導電性ペースト組成物。
- 前記フルオロエラストマーが、フッ化ビニリデン、ヘキサフルオロプロピレンおよびテトラフルオロエチレンのターポリマーである、請求項2に記載のポリマー厚膜導電性ペースト組成物。
- 前記フルオロエラストマーが、フッ化ビニリデンとヘキサフルオロプロピレンとのジポリマーである、請求項2に記載のポリマー厚膜導電性ペースト組成物。
- 前記導電性粉末が、Ag、Cu、Au、Pd、Pt、Sn、Al、Ni、C、それらの合金及びそれらの混合物の1種以上の導電性粉末である、請求項1に記載のポリマー厚膜導電性ペースト組成物。
- 前記導電性粉末が銀粉末である、請求項5に記載のポリマー厚膜導電性ペースト組成物。
- 前記銀粉末が銀フレークの形態にある、請求項6に記載のポリマー厚膜導電性ペースト組成物。
- 前記シランカップリング剤が、[3-(2,3-エポキシプロポキシ)プロピル]トリメトキシシラン(3-グリシジルオキシプロピルトリメトキシシラン)、(アミノプロピル)トリメトキシシラン、(メタクリルオキシプロピル)トリメトキシシラン、(ビニル)トリメトキシシラン及び(メルカプトプロピル)トリメトキシシランからなる群から選択される、請求項1に記載のポリマー厚膜導電性ペースト組成物。
- 前記シランカップリング剤が[3-(2,3-エポキシプロポキシ)プロピル]トリメトキシシランである、請求項8に記載のポリマー厚膜導電性ペースト組成物。
- 35重量%以下の2-(2-エトキシエトキシ)エチルアセテートと1~35重量%のトリエチルホスフェートとを含む、請求項1に記載のポリマー厚膜導電性ペースト組成物。
- 請求項1に記載のポリマー厚膜導電性ペースト組成物から形成された印刷導体を含む物品。
- 前記物品が着用可能な衣類である、請求項11に記載の物品。
- 前記印刷導体が基板上に印刷されていてこれが続いて前記衣類に積層されたものである、請求項12に記載の物品。
- 前記物品が熱成形されていて続いて射出成形に供されたものである、請求項11に記載の物品。
- 請求項1に記載のポリマー厚膜導電性ペースト組成物から形成された印刷導電性接着剤を含む物品。
- 前記物品が熱成形されていて続いて射出成形に供されたものである、請求項15に記載の物品。
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