JP2016524779A - ポリマー厚膜正温度係数カーボン組成物 - Google Patents
ポリマー厚膜正温度係数カーボン組成物 Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 62
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 37
- 229920000642 polymer Polymers 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000002904 solvent Substances 0.000 claims abstract description 15
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920002313 fluoropolymer Polymers 0.000 claims abstract description 13
- 239000004811 fluoropolymer Substances 0.000 claims abstract description 13
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920001577 copolymer Polymers 0.000 claims abstract description 8
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 8
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- 239000003960 organic solvent Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 10
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- 229920006370 Kynar Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
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- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
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- 241000721047 Danaus plexippus Species 0.000 description 1
- 229920006309 Invista Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Abstract
Description
(a)
(i)二フッ化ビニリデンとヘキサフロオロプロピレンとのコポリマーからなるフルオロポリマー樹脂と、
(ii)トリエチルホスフェートからなる有機溶剤と
からなる50〜99重量パーセントの有機媒体であって、フルオロポリマー樹脂が有機媒体の全重量の10〜50重量パーセントであり且つ有機溶剤中に溶解される、有機媒体と、
(b)有機媒体中に分散される、1〜50重量パーセントの導電性カーボン粉末とから本質的になり、有機媒体と導電性カーボン粉末との重量パーセントが、ポリマー厚膜正温度係数カーボン抵抗体組成物の全重量に基づいているポリマー厚膜正温度係数カーボン抵抗体組成物に関する。
ポリマー樹脂を溶剤に添加して、印刷のための適した稠度およびレオロジーを有する「有機媒体」を製造する。有機媒体は、十分な安定度を有して固形分が分散し得る有機媒体でなければならない。媒体のレオロジー性質は、それらが組成物に良好な適用性を与えるものでなければならない。このような性質には、十分な安定度を有する固形分の分散、組成物の良好な適用、適切かつ比較的安定している粘度、チキソトロピー、基材および固形分の適切な湿潤性、良好な乾燥速度、および荒い取扱いに耐える十分な乾燥膜強度などが含まれる。
本発明のPTF PTC組成物において使用される導電性粉末は、目標抵抗(1〜50Kohm/sq)および所望のPTC作用を達成するために必要とされる導電性カーボンまたはカーボンブラックである。他のカーボン粉末および/または黒鉛を用いてもよい。また、銀および金などの一般的な導電性粉末をカーボン粉末と組合せて使用してもよい。
「ペースト」としても知られるポリマー厚膜組成物は典型的に、ガスおよび湿気に対して不透過性であるポリエステルなどの基材上に堆積される。また、基材は、プラスチックシートとその上に堆積された任意選択的である金属または誘電体層との組み合わせから構成された複合材料のシートであり得る。
比較実験A
PTF PTCカーボン抵抗体組成物(ペースト)を調製するために、最初に有機媒体を以下のように調製した:二フッ化ビニリデンとヘキサフロオロプロピレン樹脂とのコポリマー(Kynar(登録商標) ADS2 Arkema Inc.King of Prussia,PA)25.0重量%を75.0重量%の二塩基性エステルDBE(登録商標)−9(Invista(登録商標), Wlmington,DE)有機溶剤と混合した。樹脂の分子量は約20,000であった。上記の混合物を90℃において1〜2時間加熱して全ての樹脂を溶解し、有機媒体を形成した。次に、導電性カーボンブラックMonarch(登録商標)120(Cabot Corp.,Boston,MA)を有機媒体に添加した。
8.18 導電性カーボンブラック粉末
9.10 DBE(登録商標)−9溶剤
この組成物を遊星形ミキサーで30分間混合した。次に、組成物を三本ロール練り機に移し、そこでそれを0psiで1回および150psiで1回送った。その結果、PTF PTCカーボン抵抗体組成物が得られた。
PTC回路を、本質的に比較実験Aにおいて上述したように製造した。比較実験Aとの唯一の相違は、比較実験AのPTF PTCカーボン抵抗体組成物の代わりにDuPont 7282カーボン抵抗体厚膜組成物(本件特許出願人)を使用したことであった。
PTC回路を、本質的に比較実験Aにおいて上述したように製造した。比較実験Aとの唯一の相違は、比較実験AのPTF PTCカーボン抵抗体組成物の代わりに本発明のPTF PTCカーボン抵抗体組成物を使用したことであった。本発明のPTF PTCカーボン抵抗体組成物は、92.0重量パーセントの有機媒体と8.0重量パーセントの導電性カーボン粉末とを使用して製造された。有機媒体は、二フッ化ビニリデンとヘキサフロオロプロピレン樹脂とのコポリマー(Kynar(登録商標) ADS2 Arkema Inc.King of Prussia,PA)35重量パーセントとトリエチルホスフェート65重量パーセントとからなっていた。相違は比較実験Aの二塩基性エステルDBE(登録商標)−9ではなくトリエチルホスフェートが溶剤として使用されたことである。
Claims (9)
- ポリマー厚膜正温度係数カーボン抵抗体組成物であって、
(a)50〜99重量パーセントの有機媒体であって、前記有機媒体は、
(i)二フッ化ビニリデンとヘキサフロオロプロピレンとのコポリマーからなるフルオロポリマー樹脂と、
(ii)トリエチルホスフェートからなる有機溶剤と
からなり前記フルオロポリマー樹脂が前記有機媒体の全重量の10〜50重量パーセントであり、かつ前記有機溶剤中に溶解されている、有機媒体と、
(b)1〜50重量パーセントの導電性カーボン粉末と
から本質的になり、
前記導電性カーボン粉末は、前記有機媒体中に分散されており、
前記有機媒体と前記導電性カーボン粉末との前記重量パーセントが、前記ポリマー厚膜正温度係数カーボン抵抗体組成物の全重量に基づいく
ことを特徴とするポリマー厚膜正温度係数カーボン抵抗体組成物。 - 前記導電性カーボン粉末が導電性カーボンブラック粉末であることを特徴とする請求項1に記載のポリマー厚膜正温度係数カーボン抵抗体組成物。
- 前記有機媒体が前記ポリマー厚膜正温度係数カーボン抵抗体組成物全体の80〜95重量パーセントであり、前記フルオロポリマー樹脂が前記有機媒体全体の30〜40重量パーセントであることを特徴とする請求項1に記載のポリマー厚膜正温度係数カーボン抵抗体組成物。
- 請求項1〜3のいずれか一項に記載のポリマー厚膜正温度係数カーボン抵抗体組成物を含み、前記ポリマー厚膜正温度係数カーボン抵抗体組成物は乾燥されて溶剤が除去されていることを特徴とする正温度係数回路。
- 請求項4に記載の正温度回路を含有する物品。
- ミラーヒーターの形態の請求項5に記載の物品。
- シートヒーターの形態の請求項5に記載の物品。
- 正温度係数回路の形成のための方法であって、基材を提供する工程と、請求項1〜3のいずれか一項に記載のポリマー厚膜正温度係数カーボン抵抗体組成物を前記基材上に堆積する工程とを含み、前記ポリマー厚膜正温度係数カーボン抵抗体組成物を乾燥して溶剤を除去することを特徴とする方法。
- 前記基材が、乾燥されたPTF銀組成物を含有する、請求項8に記載の方法。
Applications Claiming Priority (3)
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US13/859,843 US9573438B2 (en) | 2013-04-10 | 2013-04-10 | Polymer thick film positive temperature coefficient carbon composition |
US13/859,843 | 2013-04-10 | ||
PCT/US2014/033249 WO2014168904A1 (en) | 2013-04-10 | 2014-04-08 | Polymer thick film positive temperature coefficient carbon composition |
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JP2016524779A true JP2016524779A (ja) | 2016-08-18 |
JP6412106B2 JP6412106B2 (ja) | 2018-10-24 |
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US (1) | US9573438B2 (ja) |
JP (1) | JP6412106B2 (ja) |
CN (1) | CN105073493B (ja) |
WO (1) | WO2014168904A1 (ja) |
Cited By (2)
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JP2017522421A (ja) * | 2014-07-15 | 2017-08-10 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 逆硬化プロファイル挙動を有するポリマー厚膜銀導体 |
JP7481104B2 (ja) | 2018-10-16 | 2024-05-10 | デュポン チャイナ リミテッド | 伸縮性の導電性フルオロエラストマーペースト組成物 |
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EP3021331A1 (en) * | 2014-11-17 | 2016-05-18 | Henkel AG & Co. KGaA | Positive temperature coefficient composition |
TWI685011B (zh) | 2017-09-22 | 2020-02-11 | 美商力特福斯股份有限公司 | 熔絲元件 |
US10822513B1 (en) | 2019-04-26 | 2020-11-03 | 1-Material Inc | Electrically conductive PTC screen printable ink composition with low inrush current and high NTC onset temperature |
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TW317689B (ja) | 1995-03-10 | 1997-10-11 | Du Pont | |
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JP7481104B2 (ja) | 2018-10-16 | 2024-05-10 | デュポン チャイナ リミテッド | 伸縮性の導電性フルオロエラストマーペースト組成物 |
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US9573438B2 (en) | 2017-02-21 |
US20140305923A1 (en) | 2014-10-16 |
CN105073493A (zh) | 2015-11-18 |
CN105073493B (zh) | 2017-11-14 |
JP6412106B2 (ja) | 2018-10-24 |
WO2014168904A1 (en) | 2014-10-16 |
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