JP7470586B2 - 基板搬送システム及び基板搬送方法 - Google Patents
基板搬送システム及び基板搬送方法 Download PDFInfo
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0019—End effectors other than grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J5/00—Manipulators mounted on wheels or on carriages
- B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Description
前記制御部は、前記搬送アームの異なる2点の高さ位置における前記位置ズレ量を検知し、前記2点の高さ位置の差分と検知された前記位置ズレ量とに基づいて、前記搬送アームの高さ位置と水平方向への前記位置ズレ量との相関を算出し、予め算出された前記相関に基づいて、前記搬送アームの高さ位置に応じて当該搬送アームの水平方向位置を補正して、前記搬送アームにより前記基板を搬送する。
71 搬送アーム
73 水平移動機構
74 ダクトアーム
75 垂直移動機構
76 ダクトアーム
100 真空チャンバ
W ウェハ
Claims (9)
- 真空雰囲気で基板を搬送する基板搬送システムであって、
内部を真空雰囲気に設定可能とされた真空チャンバと、
前記真空チャンバの内部に設けられ、前記基板を保持して搬送する搬送アームと、
前記真空チャンバの内部において、前記搬送アームを水平方向に移動させる水平移動機構と、
内部に常圧雰囲気とされた収容部が形成され、前記搬送アームの水平移動に応じて屈伸する水平用ダクトアーム機構と、
前記真空チャンバの内部において、前記搬送アームを垂直方向に移動させる垂直移動機構と、
内部に常圧雰囲気とされた収容部が形成され、前記搬送アームの垂直移動に応じて屈伸する垂直用ダクトアーム機構と、
前記真空チャンバに設けられ、前記搬送アームの垂直移動に伴う水平方向への位置ズレ量を検知する第1の検知機構と、
前記搬送アームの移動を制御する制御部を有し、
前記制御部は、
前記搬送アームの異なる2点の高さ位置における前記位置ズレ量を検知し、
前記2点の高さ位置の差分と検知された前記位置ズレ量とに基づいて、前記搬送アームの高さ位置と水平方向への前記位置ズレ量との相関を算出し、
予め算出された前記相関に基づいて、前記搬送アームの高さ位置に応じて当該搬送アームの水平方向位置を補正して、前記搬送アームにより前記基板を搬送する、基板搬送システム。 - 前記位置ズレ量を検知するための前記2点の高さ位置は、前記搬送アームの垂直方向に対する移動範囲の最上段及び最下段である、請求項1に記載の基板搬送システム。
- 前記垂直移動機構は、前記真空チャンバの内部において垂直方向に伸縮自在に構成される、請求項1または2のいずれか一項に記載の基板搬送システム。
- 前記垂直移動機構は、複数のガイド、複数のボールねじ、及び複数のベルトを備え、
垂直方向に対してスライド移動するテレスコピック構造を有する、請求項3に記載の基板搬送システム。 - 前記真空チャンバに設けられ、前記垂直移動機構の熱伸縮や装置特性の変化に伴う前記搬送アームの垂直方向への位置ズレを検知する第2の検知機構を有する、請求項1~4のいずれか一項に記載の基板搬送システム。
- 前記水平用ダクトアーム機構及び前記垂直用ダクトアーム機構の前記収容部の内部には、電気ケーブル、給排気用チューブ、温調媒体循環用チューブ、熱電対又は加速度計のうちの少なくともいずれか1つが収容される、請求項1~5のいずれか一項に記載の基板搬送システム。
- 真空雰囲気で基板を搬送する基板搬送システムを用いた基板の搬送方法であって、
前記基板搬送システムは、
内部を真空雰囲気に設定可能とされた真空チャンバと、
前記真空チャンバの内部に設けられ、前記基板を保持して搬送する搬送アームと、
前記真空チャンバの内部において、前記搬送アームを水平方向に移動させる水平移動機構と、
内部に常圧雰囲気とされた収容部が形成され、前記搬送アームの水平移動に応じて屈伸する水平用ダクトアーム機構と、
前記真空チャンバの内部において、前記搬送アームを垂直方向に移動させる垂直移動機構と、
内部に常圧雰囲気とされた収容部が形成され、前記搬送アームの垂直移動に応じて屈伸する垂直用ダクトアーム機構と、を有し、
前記搬送方法は、
(a)前記搬送アームの異なる2点の高さ位置における水平方向への位置ズレ量を検知する工程と、
(b)前記2点の高さ位置の差分と検知された前記位置ズレ量とに基づいて、前記搬送アームの高さ位置と水平方向への前記位置ズレ量との相関を算出する工程と、
(c)前記搬送アームを用いて前記基板を搬送する工程と、を有し、
前記(c)工程においては、前記(b)工程で予め算出された前記相関に基づいて、前記搬送アームの高さ位置に応じて当該搬送アームの水平方向位置を補正する、基板搬送方法。 - 前記位置ズレ量を検知するための前記2点の高さ位置は、前記搬送アームの垂直方向に対する移動範囲の最上段及び最下段である、請求項7に記載の基板搬送方法。
- 前記(a)工程を前記搬送アームにより基板を保持した状態で行い、
当該(a)工程においては、前記搬送アームに保持された基板の持ち替えを行わない、請求項7又は8のいずれか一項に記載の基板搬送方法。
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KR1020210088404A KR102577172B1 (ko) | 2020-07-14 | 2021-07-06 | 기판 반송 시스템 및 기판 반송 방법 |
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JP2001300883A (ja) | 2000-04-20 | 2001-10-30 | Kawasaki Heavy Ind Ltd | ロボット |
JP2004265947A (ja) | 2003-02-24 | 2004-09-24 | Tokyo Electron Ltd | 搬送装置及び真空処理装置並びに常圧搬送装置 |
JP2005317656A (ja) | 2004-04-27 | 2005-11-10 | Tokyo Electron Ltd | 真空処理装置 |
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JP5601331B2 (ja) | 2012-01-26 | 2014-10-08 | 株式会社安川電機 | ロボットハンドおよびロボット |
KR102359364B1 (ko) * | 2012-02-10 | 2022-02-07 | 브룩스 오토메이션 인코퍼레이티드 | 기판 프로세싱 장치 |
JP5893072B2 (ja) * | 2014-04-16 | 2016-03-23 | 川崎重工業株式会社 | 基板搬送ロボット |
JP6463227B2 (ja) * | 2015-07-07 | 2019-01-30 | 東京エレクトロン株式会社 | 基板搬送方法 |
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US11335578B2 (en) * | 2020-02-13 | 2022-05-17 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer apparatus and method of measuring positional deviation of substrate |
KR102203917B1 (ko) * | 2020-11-03 | 2021-01-19 | (주)볼타오토메이션 | 케이블암을 갖는 반송장치 |
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JP2001300883A (ja) | 2000-04-20 | 2001-10-30 | Kawasaki Heavy Ind Ltd | ロボット |
JP2004265947A (ja) | 2003-02-24 | 2004-09-24 | Tokyo Electron Ltd | 搬送装置及び真空処理装置並びに常圧搬送装置 |
JP2005317656A (ja) | 2004-04-27 | 2005-11-10 | Tokyo Electron Ltd | 真空処理装置 |
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US20220020622A1 (en) | 2022-01-20 |
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JP2022017846A (ja) | 2022-01-26 |
US11776831B2 (en) | 2023-10-03 |
KR102577172B1 (ko) | 2023-09-08 |
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