JP7465998B2 - エトキシ/プロポキシ変性ピラゾリン有機物、その使用、光硬化性組成物及びフォトレジスト - Google Patents

エトキシ/プロポキシ変性ピラゾリン有機物、その使用、光硬化性組成物及びフォトレジスト Download PDF

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JP7465998B2
JP7465998B2 JP2022563920A JP2022563920A JP7465998B2 JP 7465998 B2 JP7465998 B2 JP 7465998B2 JP 2022563920 A JP2022563920 A JP 2022563920A JP 2022563920 A JP2022563920 A JP 2022563920A JP 7465998 B2 JP7465998 B2 JP 7465998B2
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JP2023522232A5 (https=
JP2023522232A (ja
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錢暁春
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Changzhou Tronly New Electronic Materials Co Ltd
Changzhou Tronly Advanced Electronic Materials Co Ltd
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Changzhou Tronly New Electronic Materials Co Ltd
Changzhou Tronly Advanced Electronic Materials Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D231/00Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/06Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D231/00Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2022563920A 2020-04-22 2021-03-16 エトキシ/プロポキシ変性ピラゾリン有機物、その使用、光硬化性組成物及びフォトレジスト Active JP7465998B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202010323287.7A CN113527207B (zh) 2020-04-22 2020-04-22 乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶
CN202010323287.7 2020-04-22
PCT/CN2021/081187 WO2021213087A1 (zh) 2020-04-22 2021-03-16 乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶

Publications (3)

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JP2023522232A JP2023522232A (ja) 2023-05-29
JP2023522232A5 JP2023522232A5 (https=) 2024-01-30
JP7465998B2 true JP7465998B2 (ja) 2024-04-11

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JP2022563920A Active JP7465998B2 (ja) 2020-04-22 2021-03-16 エトキシ/プロポキシ変性ピラゾリン有機物、その使用、光硬化性組成物及びフォトレジスト

Country Status (6)

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US (1) US20230167066A1 (https=)
EP (1) EP4140983A4 (https=)
JP (1) JP7465998B2 (https=)
CN (1) CN113527207B (https=)
TW (1) TWI766645B (https=)
WO (1) WO2021213087A1 (https=)

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CN115322086B (zh) * 2022-08-03 2024-02-23 温州医科大学 一种β-紫罗兰酮衍生物及其在制备抗氧化和抗衰老药物中的应用
CN119661436A (zh) * 2023-09-19 2025-03-21 常州强力电子新材料股份有限公司 一种吡唑啉类增感剂、其制备方法、包含其的感光性树脂组合物和应用
CN118993849A (zh) * 2024-08-27 2024-11-22 西安爱德克美新材料有限公司 一种4-异丙烯基苯酚的制备方法

Citations (2)

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CN105085718A (zh) 2015-08-21 2015-11-25 常州强力电子新材料股份有限公司 一种吡唑啉肟酯类光引发剂及其制备方法和应用
JP2018524285A (ja) 2015-05-21 2018-08-30 常州強力先端電子材料有限公司Cahngzhou Tronly Advanced Electronic Materials Co.,Ltd. ピラゾリン類増感剤及びその製造方法並びに使用

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JPH087427B2 (ja) * 1987-11-26 1996-01-29 富士写真フイルム株式会社 熱現像カラー感光材料
CN1195042C (zh) * 2003-05-08 2005-03-30 四川大学 杯芳烃有机电致发光材料
CN1219772C (zh) 2003-06-30 2005-09-21 浙江大学 5位含有酯基的1,3-芳基取代的吡唑啉液相合成法
MY145464A (en) * 2005-08-31 2012-02-15 Hoffmann La Roche Pyrazolone derivatives as 11-beta hsd1 inhibitors
JP2008116751A (ja) * 2006-11-06 2008-05-22 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
JP4941182B2 (ja) * 2007-08-29 2012-05-30 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
GB0722067D0 (en) 2007-11-09 2007-12-19 Lambson Fine Chemicals Ltd Photoinitiators
JP5117233B2 (ja) * 2008-03-21 2013-01-16 旭化成イーマテリアルズ株式会社 感光性樹脂組成物および積層体
JP2012215787A (ja) * 2011-04-01 2012-11-08 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、並びに、プリント配線板及びその製造方法
JP5416256B2 (ja) * 2012-07-19 2014-02-12 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
KR102281035B1 (ko) * 2012-11-20 2021-07-22 쇼와덴코머티리얼즈가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
JPWO2016104585A1 (ja) * 2014-12-25 2017-10-05 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
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JP2018524285A (ja) 2015-05-21 2018-08-30 常州強力先端電子材料有限公司Cahngzhou Tronly Advanced Electronic Materials Co.,Ltd. ピラゾリン類増感剤及びその製造方法並びに使用
CN105085718A (zh) 2015-08-21 2015-11-25 常州强力电子新材料股份有限公司 一种吡唑啉肟酯类光引发剂及其制备方法和应用

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Also Published As

Publication number Publication date
US20230167066A1 (en) 2023-06-01
TWI766645B (zh) 2022-06-01
CN113527207A (zh) 2021-10-22
TW202140428A (zh) 2021-11-01
EP4140983A4 (en) 2024-04-24
EP4140983A1 (en) 2023-03-01
CN113527207B (zh) 2023-06-06
JP2023522232A (ja) 2023-05-29
WO2021213087A1 (zh) 2021-10-28

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