TWI766645B - 乙氧基/丙氧基改性的吡唑啉有機物、其應用、光固化組合物及光刻膠 - Google Patents

乙氧基/丙氧基改性的吡唑啉有機物、其應用、光固化組合物及光刻膠 Download PDF

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Publication number
TWI766645B
TWI766645B TW110113585A TW110113585A TWI766645B TW I766645 B TWI766645 B TW I766645B TW 110113585 A TW110113585 A TW 110113585A TW 110113585 A TW110113585 A TW 110113585A TW I766645 B TWI766645 B TW I766645B
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TW
Taiwan
Prior art keywords
meth
pyrazoline
acrylate
ethoxy
modified
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Application number
TW110113585A
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English (en)
Chinese (zh)
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TW202140428A (zh
Inventor
錢曉春
Original Assignee
大陸商常州強力電子新材料股份有限公司
大陸商常州強力先端電子材料有限公司
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Publication of TW202140428A publication Critical patent/TW202140428A/zh
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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D231/00Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/06Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D231/00Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW110113585A 2020-04-22 2021-04-15 乙氧基/丙氧基改性的吡唑啉有機物、其應用、光固化組合物及光刻膠 TWI766645B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010323287.7A CN113527207B (zh) 2020-04-22 2020-04-22 乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶
CN202010323287.7 2020-04-22

Publications (2)

Publication Number Publication Date
TW202140428A TW202140428A (zh) 2021-11-01
TWI766645B true TWI766645B (zh) 2022-06-01

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TW110113585A TWI766645B (zh) 2020-04-22 2021-04-15 乙氧基/丙氧基改性的吡唑啉有機物、其應用、光固化組合物及光刻膠

Country Status (6)

Country Link
US (1) US20230167066A1 (https=)
EP (1) EP4140983A4 (https=)
JP (1) JP7465998B2 (https=)
CN (1) CN113527207B (https=)
TW (1) TWI766645B (https=)
WO (1) WO2021213087A1 (https=)

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* Cited by examiner, † Cited by third party
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CN115322086B (zh) * 2022-08-03 2024-02-23 温州医科大学 一种β-紫罗兰酮衍生物及其在制备抗氧化和抗衰老药物中的应用
CN119661436A (zh) * 2023-09-19 2025-03-21 常州强力电子新材料股份有限公司 一种吡唑啉类增感剂、其制备方法、包含其的感光性树脂组合物和应用
CN118993849A (zh) * 2024-08-27 2024-11-22 西安爱德克美新材料有限公司 一种4-异丙烯基苯酚的制备方法

Citations (2)

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TW200740764A (en) * 2005-08-31 2007-11-01 Hoffmann La Roche Pyrazolone derivatives
CN104892512A (zh) * 2015-05-21 2015-09-09 常州强力先端电子材料有限公司 一种吡唑啉类增感剂及其制备方法和应用

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JPH087427B2 (ja) * 1987-11-26 1996-01-29 富士写真フイルム株式会社 熱現像カラー感光材料
CN1195042C (zh) * 2003-05-08 2005-03-30 四川大学 杯芳烃有机电致发光材料
CN1219772C (zh) 2003-06-30 2005-09-21 浙江大学 5位含有酯基的1,3-芳基取代的吡唑啉液相合成法
JP2008116751A (ja) * 2006-11-06 2008-05-22 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
JP4941182B2 (ja) * 2007-08-29 2012-05-30 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
GB0722067D0 (en) 2007-11-09 2007-12-19 Lambson Fine Chemicals Ltd Photoinitiators
JP5117233B2 (ja) * 2008-03-21 2013-01-16 旭化成イーマテリアルズ株式会社 感光性樹脂組成物および積層体
JP2012215787A (ja) * 2011-04-01 2012-11-08 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、並びに、プリント配線板及びその製造方法
JP5416256B2 (ja) * 2012-07-19 2014-02-12 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
KR102281035B1 (ko) * 2012-11-20 2021-07-22 쇼와덴코머티리얼즈가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
JPWO2016104585A1 (ja) * 2014-12-25 2017-10-05 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
CN104892513B (zh) * 2015-05-21 2017-05-03 常州强力先端电子材料有限公司 一种含链烯基吡唑啉类增感剂及其制备方法和应用
WO2016184429A1 (zh) * 2015-05-21 2016-11-24 常州强力先端电子材料有限公司 吡唑啉类增感剂及其制备方法和应用
CN105085718B (zh) 2015-08-21 2017-05-03 常州强力电子新材料股份有限公司 一种吡唑啉肟酯类光引发剂及其制备方法和应用
KR102236533B1 (ko) * 2018-01-23 2021-04-06 주식회사 엘지화학 점착제 조성물 및 이의 용도

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200740764A (en) * 2005-08-31 2007-11-01 Hoffmann La Roche Pyrazolone derivatives
CN104892512A (zh) * 2015-05-21 2015-09-09 常州强力先端电子材料有限公司 一种吡唑啉类增感剂及其制备方法和应用

Also Published As

Publication number Publication date
US20230167066A1 (en) 2023-06-01
CN113527207A (zh) 2021-10-22
TW202140428A (zh) 2021-11-01
EP4140983A4 (en) 2024-04-24
EP4140983A1 (en) 2023-03-01
CN113527207B (zh) 2023-06-06
JP7465998B2 (ja) 2024-04-11
JP2023522232A (ja) 2023-05-29
WO2021213087A1 (zh) 2021-10-28

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