CN113527207B - 乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶 - Google Patents

乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶 Download PDF

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Publication number
CN113527207B
CN113527207B CN202010323287.7A CN202010323287A CN113527207B CN 113527207 B CN113527207 B CN 113527207B CN 202010323287 A CN202010323287 A CN 202010323287A CN 113527207 B CN113527207 B CN 113527207B
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China
Prior art keywords
meth
acrylate
pyrazoline
modified
ethoxy
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CN202010323287.7A
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Chinese (zh)
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CN113527207A (zh
Inventor
钱晓春
戚伟光
衡京
马丽君
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Changzhou Tronly New Electronic Materials Co Ltd
Changzhou Tronly Advanced Electronic Materials Co Ltd
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Changzhou Tronly New Electronic Materials Co Ltd
Changzhou Tronly Advanced Electronic Materials Co Ltd
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Priority to CN202010323287.7A priority Critical patent/CN113527207B/zh
Priority to JP2022563920A priority patent/JP7465998B2/ja
Priority to EP21793446.2A priority patent/EP4140983A4/en
Priority to US17/996,773 priority patent/US20230167066A1/en
Priority to PCT/CN2021/081187 priority patent/WO2021213087A1/zh
Priority to TW110113585A priority patent/TWI766645B/zh
Publication of CN113527207A publication Critical patent/CN113527207A/zh
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/06—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN202010323287.7A 2020-04-22 2020-04-22 乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶 Active CN113527207B (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN202010323287.7A CN113527207B (zh) 2020-04-22 2020-04-22 乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶
JP2022563920A JP7465998B2 (ja) 2020-04-22 2021-03-16 エトキシ／プロポキシ変性ピラゾリン有機物、その使用、光硬化性組成物及びフォトレジスト
EP21793446.2A EP4140983A4 (en) 2020-04-22 2021-03-16 ETHOXY/PROPOXY-MODIFIED ORGANIC PYRAZOLINE MATERIAL, APPLICATION THEREOF, PHOTO-CURABLE COMPOSITION AND PHOTORESIST
US17/996,773 US20230167066A1 (en) 2020-04-22 2021-03-16 Ethoxy/propoxy modified pyrazoline organic matter, application thereof, photocurable composition, and photoresist
PCT/CN2021/081187 WO2021213087A1 (zh) 2020-04-22 2021-03-16 乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶
TW110113585A TWI766645B (zh) 2020-04-22 2021-04-15 乙氧基/丙氧基改性的吡唑啉有機物、其應用、光固化組合物及光刻膠

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010323287.7A CN113527207B (zh) 2020-04-22 2020-04-22 乙氧基/丙氧基改性的吡唑啉有机物、其应用、光固化组合物及光刻胶

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CN113527207A CN113527207A (zh) 2021-10-22
CN113527207B true CN113527207B (zh) 2023-06-06

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US (1) US20230167066A1 (https=)
EP (1) EP4140983A4 (https=)
JP (1) JP7465998B2 (https=)
CN (1) CN113527207B (https=)
TW (1) TWI766645B (https=)
WO (1) WO2021213087A1 (https=)

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Publication number Priority date Publication date Assignee Title
CN115322086B (zh) * 2022-08-03 2024-02-23 温州医科大学 一种β-紫罗兰酮衍生物及其在制备抗氧化和抗衰老药物中的应用
CN119661436A (zh) * 2023-09-19 2025-03-21 常州强力电子新材料股份有限公司 一种吡唑啉类增感剂、其制备方法、包含其的感光性树脂组合物和应用
CN118993849A (zh) * 2024-08-27 2024-11-22 西安爱德克美新材料有限公司 一种4-异丙烯基苯酚的制备方法

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GB8827616D0 (en) * 1987-11-26 1988-12-29 Fuji Photo Film Co Ltd Heat-developable colour photographic materials
CN1451712A (zh) * 2003-05-08 2003-10-29 四川大学 杯芳烃有机电致发光材料
JP2008116751A (ja) * 2006-11-06 2008-05-22 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
JP2009229655A (ja) * 2008-03-21 2009-10-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物および積層体
JP2012208528A (ja) * 2012-07-19 2012-10-25 Asahi Kasei E-Materials Corp 感光性樹脂積層体
CN104781730A (zh) * 2012-11-20 2015-07-15 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法
CN104892512A (zh) * 2015-05-21 2015-09-09 常州强力先端电子材料有限公司 一种吡唑啉类增感剂及其制备方法和应用
TW201627758A (zh) * 2014-12-25 2016-08-01 Hitachi Chemical Co Ltd 感光性樹脂組成物、及使用其的感光性元件、抗蝕劑圖案的形成方法以及印刷電路板的製造方法
WO2016184429A1 (zh) * 2015-05-21 2016-11-24 常州强力先端电子材料有限公司 吡唑啉类增感剂及其制备方法和应用

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CN1219772C (zh) 2003-06-30 2005-09-21 浙江大学 5位含有酯基的1,3－芳基取代的吡唑啉液相合成法
MY145464A (en) * 2005-08-31 2012-02-15 Hoffmann La Roche Pyrazolone derivatives as 11-beta hsd1 inhibitors
JP4941182B2 (ja) * 2007-08-29 2012-05-30 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
GB0722067D0 (en) 2007-11-09 2007-12-19 Lambson Fine Chemicals Ltd Photoinitiators
JP2012215787A (ja) * 2011-04-01 2012-11-08 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、並びに、プリント配線板及びその製造方法
CN104892513B (zh) * 2015-05-21 2017-05-03 常州强力先端电子材料有限公司 一种含链烯基吡唑啉类增感剂及其制备方法和应用
CN105085718B (zh) 2015-08-21 2017-05-03 常州强力电子新材料股份有限公司 一种吡唑啉肟酯类光引发剂及其制备方法和应用
KR102236533B1 (ko) * 2018-01-23 2021-04-06 주식회사 엘지화학 점착제 조성물 및 이의 용도

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GB8827616D0 (en) * 1987-11-26 1988-12-29 Fuji Photo Film Co Ltd Heat-developable colour photographic materials
CN1451712A (zh) * 2003-05-08 2003-10-29 四川大学 杯芳烃有机电致发光材料
JP2008116751A (ja) * 2006-11-06 2008-05-22 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
JP2009229655A (ja) * 2008-03-21 2009-10-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物および積層体
JP2012208528A (ja) * 2012-07-19 2012-10-25 Asahi Kasei E-Materials Corp 感光性樹脂積層体
CN104781730A (zh) * 2012-11-20 2015-07-15 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法
TW201627758A (zh) * 2014-12-25 2016-08-01 Hitachi Chemical Co Ltd 感光性樹脂組成物、及使用其的感光性元件、抗蝕劑圖案的形成方法以及印刷電路板的製造方法
CN104892512A (zh) * 2015-05-21 2015-09-09 常州强力先端电子材料有限公司 一种吡唑啉类增感剂及其制备方法和应用
WO2016184429A1 (zh) * 2015-05-21 2016-11-24 常州强力先端电子材料有限公司 吡唑啉类增感剂及其制备方法和应用

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Also Published As

Publication number Publication date
US20230167066A1 (en) 2023-06-01
TWI766645B (zh) 2022-06-01
CN113527207A (zh) 2021-10-22
TW202140428A (zh) 2021-11-01
EP4140983A4 (en) 2024-04-24
EP4140983A1 (en) 2023-03-01
JP7465998B2 (ja) 2024-04-11
JP2023522232A (ja) 2023-05-29
WO2021213087A1 (zh) 2021-10-28

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