JP7461965B2 - プラズマ系反応器のための冷却 - Google Patents

プラズマ系反応器のための冷却 Download PDF

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Publication number
JP7461965B2
JP7461965B2 JP2021559101A JP2021559101A JP7461965B2 JP 7461965 B2 JP7461965 B2 JP 7461965B2 JP 2021559101 A JP2021559101 A JP 2021559101A JP 2021559101 A JP2021559101 A JP 2021559101A JP 7461965 B2 JP7461965 B2 JP 7461965B2
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Japan
Prior art keywords
heat transfer
transfer fluid
dielectric window
conical structure
heat
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JP2021559101A
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Japanese (ja)
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JP2022526980A5 (enExample
JP2022526980A (ja
Inventor
ドルウェリー・ジョン・スティーブン
ベンジャミン・ニール・マーティン・ポール
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
JP2021559101A 2019-04-08 2020-04-07 プラズマ系反応器のための冷却 Active JP7461965B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962830896P 2019-04-08 2019-04-08
US62/830,896 2019-04-08
PCT/US2020/027081 WO2020210240A1 (en) 2019-04-08 2020-04-07 Cooling for a plasma-based reactor

Publications (3)

Publication Number Publication Date
JP2022526980A JP2022526980A (ja) 2022-05-27
JP2022526980A5 JP2022526980A5 (enExample) 2023-05-02
JP7461965B2 true JP7461965B2 (ja) 2024-04-04

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ID=72751778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021559101A Active JP7461965B2 (ja) 2019-04-08 2020-04-07 プラズマ系反応器のための冷却

Country Status (6)

Country Link
US (2) US11676798B2 (enExample)
JP (1) JP7461965B2 (enExample)
KR (1) KR102606056B1 (enExample)
CN (1) CN113661560B (enExample)
TW (2) TWI834857B (enExample)
WO (1) WO2020210240A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11676798B2 (en) 2019-04-08 2023-06-13 Lam Research Corporation Cooling for a plasma-based reactor
US11894152B2 (en) * 2021-05-05 2024-02-06 Westinghouse Electric Company Llc Modular thermal and radiation shielding with passive heat removal
CN116168997A (zh) * 2021-11-24 2023-05-26 上海华力集成电路制造有限公司 一种改善刻蚀中等离子体分布的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270599A (ja) 2001-03-13 2002-09-20 Canon Inc プラズマ処理装置
JP2005322771A (ja) 2004-05-10 2005-11-17 Matsushita Electric Ind Co Ltd 熱拡散装置
WO2010001890A1 (ja) 2008-07-04 2010-01-07 東京エレクトロン株式会社 温度調節機構および温度調節機構を用いた半導体製造装置
CN102141351A (zh) 2011-04-24 2011-08-03 广州大学 一种热管
WO2018096362A1 (en) 2016-11-25 2018-05-31 Iceotope Limited Fluid cooling system

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JPS57145167U (enExample) * 1981-03-03 1982-09-11
JPH0590214A (ja) * 1991-09-30 1993-04-09 Tokyo Ohka Kogyo Co Ltd 同軸型プラズマ処理装置
JPH05256589A (ja) * 1992-01-14 1993-10-05 Furukawa Electric Co Ltd:The 筐体のヒ−トパイプ式冷却構造
TW293983B (enExample) * 1993-12-17 1996-12-21 Tokyo Electron Co Ltd
US5944899A (en) * 1996-08-22 1999-08-31 Applied Materials, Inc. Inductively coupled plasma processing chamber
US6287435B1 (en) * 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6326597B1 (en) * 1999-04-15 2001-12-04 Applied Materials, Inc. Temperature control system for process chamber
US7030335B2 (en) * 2000-03-17 2006-04-18 Applied Materials, Inc. Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
US6550531B1 (en) * 2000-05-16 2003-04-22 Intel Corporation Vapor chamber active heat sink
FR2815888B1 (fr) * 2000-10-27 2003-05-30 Air Liquide Dispositif de traitement de gaz par plasma
US6652711B2 (en) 2001-06-06 2003-11-25 Tokyo Electron Limited Inductively-coupled plasma processing system
JP4008728B2 (ja) * 2002-03-20 2007-11-14 株式会社 液晶先端技術開発センター プラズマ処理装置
JP4163437B2 (ja) * 2002-04-17 2008-10-08 松下電器産業株式会社 プラズマ処理装置用誘電体窓
US7163603B2 (en) * 2002-06-24 2007-01-16 Tokyo Electron Limited Plasma source assembly and method of manufacture
JP4381963B2 (ja) * 2003-11-19 2009-12-09 パナソニック株式会社 プラズマ処理装置
KR20050079860A (ko) * 2004-02-07 2005-08-11 삼성전자주식회사 마이크로 웨이브 공급장치, 이를 이용한 플라즈마공정장치 및 플라즈마 공정방법
US7527713B2 (en) * 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
US20060222034A1 (en) * 2005-03-31 2006-10-05 Cymer, Inc. 6 Khz and above gas discharge laser system
US8440049B2 (en) * 2006-05-03 2013-05-14 Applied Materials, Inc. Apparatus for etching high aspect ratio features
EP2231324B1 (en) * 2007-12-18 2016-06-29 Dow Technology Investments LLC Tube reactor
GB201013881D0 (en) * 2010-08-19 2010-10-06 Oxford Yasa Motors Ltd Electric machine - construction
US20120062866A1 (en) * 2010-09-03 2012-03-15 Nikon Corporation Microchannel-cooled coils of electromagnetic actuators exhibiting reduced eddy-current drag
US9530656B2 (en) 2011-10-07 2016-12-27 Lam Research Corporation Temperature control in RF chamber with heater and air amplifier
US9978565B2 (en) 2011-10-07 2018-05-22 Lam Research Corporation Systems for cooling RF heated chamber components
EP2994926A1 (en) 2013-05-06 2016-03-16 Greatcell Solar S.A. Organic-inorganic perovskite based solar cell
US10249475B2 (en) 2014-04-01 2019-04-02 Applied Materials, Inc. Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation
KR102262657B1 (ko) * 2014-10-13 2021-06-08 삼성전자주식회사 플라즈마 처리 장치
KR20180025838A (ko) * 2014-12-23 2018-03-09 시텍 게엠베하 기계적으로 유동화되는 증착 시스템들 및 방법들
CN206329930U (zh) 2016-11-29 2017-07-14 盐城市新亚自控设备股份有限公司 一种led阵列器件的冷却装置
US11676798B2 (en) 2019-04-08 2023-06-13 Lam Research Corporation Cooling for a plasma-based reactor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270599A (ja) 2001-03-13 2002-09-20 Canon Inc プラズマ処理装置
JP2005322771A (ja) 2004-05-10 2005-11-17 Matsushita Electric Ind Co Ltd 熱拡散装置
WO2010001890A1 (ja) 2008-07-04 2010-01-07 東京エレクトロン株式会社 温度調節機構および温度調節機構を用いた半導体製造装置
CN102141351A (zh) 2011-04-24 2011-08-03 广州大学 一种热管
WO2018096362A1 (en) 2016-11-25 2018-05-31 Iceotope Limited Fluid cooling system

Also Published As

Publication number Publication date
US20230274912A1 (en) 2023-08-31
US11676798B2 (en) 2023-06-13
TWI834857B (zh) 2024-03-11
TW202106122A (zh) 2021-02-01
KR102606056B1 (ko) 2023-11-23
TW202425717A (zh) 2024-06-16
WO2020210240A1 (en) 2020-10-15
CN113661560A (zh) 2021-11-16
JP2022526980A (ja) 2022-05-27
CN113661560B (zh) 2023-01-17
KR20210137585A (ko) 2021-11-17
TWI899850B (zh) 2025-10-01
US20220139671A1 (en) 2022-05-05

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