TWI834857B - 熱管冷卻系統 - Google Patents

熱管冷卻系統 Download PDF

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Publication number
TWI834857B
TWI834857B TW109111730A TW109111730A TWI834857B TW I834857 B TWI834857 B TW I834857B TW 109111730 A TW109111730 A TW 109111730A TW 109111730 A TW109111730 A TW 109111730A TW I834857 B TWI834857 B TW I834857B
Authority
TW
Taiwan
Prior art keywords
dielectric window
heat transfer
transfer fluid
heat
cooling system
Prior art date
Application number
TW109111730A
Other languages
English (en)
Chinese (zh)
Other versions
TW202106122A (zh
Inventor
約翰 史蒂芬 朱爾瑞
尼爾 馬汀 保羅 班傑明
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW202106122A publication Critical patent/TW202106122A/zh
Application granted granted Critical
Publication of TWI834857B publication Critical patent/TWI834857B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
TW109111730A 2019-04-08 2020-04-08 熱管冷卻系統 TWI834857B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962830896P 2019-04-08 2019-04-08
US62/830,896 2019-04-08

Publications (2)

Publication Number Publication Date
TW202106122A TW202106122A (zh) 2021-02-01
TWI834857B true TWI834857B (zh) 2024-03-11

Family

ID=72751778

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109111730A TWI834857B (zh) 2019-04-08 2020-04-08 熱管冷卻系統
TW113106270A TWI899850B (zh) 2019-04-08 2020-04-08 熱管冷卻系統、熱管理系統、以及熱虹吸器

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113106270A TWI899850B (zh) 2019-04-08 2020-04-08 熱管冷卻系統、熱管理系統、以及熱虹吸器

Country Status (6)

Country Link
US (2) US11676798B2 (enExample)
JP (1) JP7461965B2 (enExample)
KR (1) KR102606056B1 (enExample)
CN (1) CN113661560B (enExample)
TW (2) TWI834857B (enExample)
WO (1) WO2020210240A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11676798B2 (en) 2019-04-08 2023-06-13 Lam Research Corporation Cooling for a plasma-based reactor
US11894152B2 (en) * 2021-05-05 2024-02-06 Westinghouse Electric Company Llc Modular thermal and radiation shielding with passive heat removal
CN116168997A (zh) * 2021-11-24 2023-05-26 上海华力集成电路制造有限公司 一种改善刻蚀中等离子体分布的方法

Citations (8)

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US5364488A (en) * 1991-09-30 1994-11-15 Tokyo Ohka Kogyo Co., Ltd. Coaxial plasma processing apparatus
TW519856B (en) * 2000-10-27 2003-02-01 Air Liquide Device for the plasma treatment of gases
US7527713B2 (en) * 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
US20120120974A1 (en) * 2005-03-31 2012-05-17 Ujazdowski Richard C 6 khz and above gas discharge laser system
TW201230626A (en) * 2010-09-03 2012-07-16 Nikon Corp Microchannel-cooled coils of electromagnetic actuators exhibiting reduced eddy-current drag
CN103329410A (zh) * 2010-08-19 2013-09-25 Yasa电机有限公司 电机过模制构造
US20150279634A1 (en) * 2014-04-01 2015-10-01 Applied Materials, Inc. Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation
US20170103875A1 (en) * 2011-10-07 2017-04-13 Lam Research Corporation Temperature Control in RF Chamber with Heater and Air Amplifier

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US6287435B1 (en) * 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6326597B1 (en) * 1999-04-15 2001-12-04 Applied Materials, Inc. Temperature control system for process chamber
US7030335B2 (en) * 2000-03-17 2006-04-18 Applied Materials, Inc. Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
US6550531B1 (en) * 2000-05-16 2003-04-22 Intel Corporation Vapor chamber active heat sink
JP2002270599A (ja) 2001-03-13 2002-09-20 Canon Inc プラズマ処理装置
US6652711B2 (en) 2001-06-06 2003-11-25 Tokyo Electron Limited Inductively-coupled plasma processing system
JP4008728B2 (ja) * 2002-03-20 2007-11-14 株式会社 液晶先端技術開発センター プラズマ処理装置
JP4163437B2 (ja) * 2002-04-17 2008-10-08 松下電器産業株式会社 プラズマ処理装置用誘電体窓
US7163603B2 (en) * 2002-06-24 2007-01-16 Tokyo Electron Limited Plasma source assembly and method of manufacture
JP4381963B2 (ja) * 2003-11-19 2009-12-09 パナソニック株式会社 プラズマ処理装置
KR20050079860A (ko) * 2004-02-07 2005-08-11 삼성전자주식회사 마이크로 웨이브 공급장치, 이를 이용한 플라즈마공정장치 및 플라즈마 공정방법
JP2005322771A (ja) 2004-05-10 2005-11-17 Matsushita Electric Ind Co Ltd 熱拡散装置
US8440049B2 (en) * 2006-05-03 2013-05-14 Applied Materials, Inc. Apparatus for etching high aspect ratio features
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JP2010016225A (ja) 2008-07-04 2010-01-21 Tokyo Electron Ltd 温度調節機構および温度調節機構を用いた半導体製造装置
CN102141351B (zh) 2011-04-24 2012-08-08 广州大学 一种热管
US9978565B2 (en) 2011-10-07 2018-05-22 Lam Research Corporation Systems for cooling RF heated chamber components
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KR102262657B1 (ko) * 2014-10-13 2021-06-08 삼성전자주식회사 플라즈마 처리 장치
KR20180025838A (ko) * 2014-12-23 2018-03-09 시텍 게엠베하 기계적으로 유동화되는 증착 시스템들 및 방법들
GB201619987D0 (en) 2016-11-25 2017-01-11 Iceotope Ltd Fluid cooling system
CN206329930U (zh) 2016-11-29 2017-07-14 盐城市新亚自控设备股份有限公司 一种led阵列器件的冷却装置
US11676798B2 (en) 2019-04-08 2023-06-13 Lam Research Corporation Cooling for a plasma-based reactor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5364488A (en) * 1991-09-30 1994-11-15 Tokyo Ohka Kogyo Co., Ltd. Coaxial plasma processing apparatus
TW519856B (en) * 2000-10-27 2003-02-01 Air Liquide Device for the plasma treatment of gases
US7527713B2 (en) * 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
US20120120974A1 (en) * 2005-03-31 2012-05-17 Ujazdowski Richard C 6 khz and above gas discharge laser system
CN103329410A (zh) * 2010-08-19 2013-09-25 Yasa电机有限公司 电机过模制构造
TW201230626A (en) * 2010-09-03 2012-07-16 Nikon Corp Microchannel-cooled coils of electromagnetic actuators exhibiting reduced eddy-current drag
US20170103875A1 (en) * 2011-10-07 2017-04-13 Lam Research Corporation Temperature Control in RF Chamber with Heater and Air Amplifier
US20150279634A1 (en) * 2014-04-01 2015-10-01 Applied Materials, Inc. Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation

Also Published As

Publication number Publication date
US20230274912A1 (en) 2023-08-31
US11676798B2 (en) 2023-06-13
JP7461965B2 (ja) 2024-04-04
TW202106122A (zh) 2021-02-01
KR102606056B1 (ko) 2023-11-23
TW202425717A (zh) 2024-06-16
WO2020210240A1 (en) 2020-10-15
CN113661560A (zh) 2021-11-16
JP2022526980A (ja) 2022-05-27
CN113661560B (zh) 2023-01-17
KR20210137585A (ko) 2021-11-17
TWI899850B (zh) 2025-10-01
US20220139671A1 (en) 2022-05-05

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