KR102606056B1 - 플라즈마 기반 반응기 냉각 - Google Patents
플라즈마 기반 반응기 냉각 Download PDFInfo
- Publication number
- KR102606056B1 KR102606056B1 KR1020217036312A KR20217036312A KR102606056B1 KR 102606056 B1 KR102606056 B1 KR 102606056B1 KR 1020217036312 A KR1020217036312 A KR 1020217036312A KR 20217036312 A KR20217036312 A KR 20217036312A KR 102606056 B1 KR102606056 B1 KR 102606056B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat transfer
- transfer fluid
- conical structure
- dielectric window
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/32119—Windows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962830896P | 2019-04-08 | 2019-04-08 | |
| US62/830,896 | 2019-04-08 | ||
| PCT/US2020/027081 WO2020210240A1 (en) | 2019-04-08 | 2020-04-07 | Cooling for a plasma-based reactor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210137585A KR20210137585A (ko) | 2021-11-17 |
| KR102606056B1 true KR102606056B1 (ko) | 2023-11-23 |
Family
ID=72751778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217036312A Active KR102606056B1 (ko) | 2019-04-08 | 2020-04-07 | 플라즈마 기반 반응기 냉각 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11676798B2 (enExample) |
| JP (1) | JP7461965B2 (enExample) |
| KR (1) | KR102606056B1 (enExample) |
| CN (1) | CN113661560B (enExample) |
| TW (2) | TWI834857B (enExample) |
| WO (1) | WO2020210240A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11676798B2 (en) | 2019-04-08 | 2023-06-13 | Lam Research Corporation | Cooling for a plasma-based reactor |
| US11894152B2 (en) * | 2021-05-05 | 2024-02-06 | Westinghouse Electric Company Llc | Modular thermal and radiation shielding with passive heat removal |
| CN116168997A (zh) * | 2021-11-24 | 2023-05-26 | 上海华力集成电路制造有限公司 | 一种改善刻蚀中等离子体分布的方法 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5342266U (enExample) * | 1976-09-17 | 1978-04-12 | ||
| JPS57145167U (enExample) * | 1981-03-03 | 1982-09-11 | ||
| JPH0590214A (ja) * | 1991-09-30 | 1993-04-09 | Tokyo Ohka Kogyo Co Ltd | 同軸型プラズマ処理装置 |
| JPH05256589A (ja) * | 1992-01-14 | 1993-10-05 | Furukawa Electric Co Ltd:The | 筐体のヒ−トパイプ式冷却構造 |
| TW293983B (enExample) * | 1993-12-17 | 1996-12-21 | Tokyo Electron Co Ltd | |
| US5944899A (en) * | 1996-08-22 | 1999-08-31 | Applied Materials, Inc. | Inductively coupled plasma processing chamber |
| US6287435B1 (en) * | 1998-05-06 | 2001-09-11 | Tokyo Electron Limited | Method and apparatus for ionized physical vapor deposition |
| US6326597B1 (en) * | 1999-04-15 | 2001-12-04 | Applied Materials, Inc. | Temperature control system for process chamber |
| US7030335B2 (en) * | 2000-03-17 | 2006-04-18 | Applied Materials, Inc. | Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression |
| US6550531B1 (en) * | 2000-05-16 | 2003-04-22 | Intel Corporation | Vapor chamber active heat sink |
| FR2815888B1 (fr) * | 2000-10-27 | 2003-05-30 | Air Liquide | Dispositif de traitement de gaz par plasma |
| JP2002270599A (ja) | 2001-03-13 | 2002-09-20 | Canon Inc | プラズマ処理装置 |
| US6652711B2 (en) | 2001-06-06 | 2003-11-25 | Tokyo Electron Limited | Inductively-coupled plasma processing system |
| JP4008728B2 (ja) * | 2002-03-20 | 2007-11-14 | 株式会社 液晶先端技術開発センター | プラズマ処理装置 |
| JP4163437B2 (ja) * | 2002-04-17 | 2008-10-08 | 松下電器産業株式会社 | プラズマ処理装置用誘電体窓 |
| US7163603B2 (en) * | 2002-06-24 | 2007-01-16 | Tokyo Electron Limited | Plasma source assembly and method of manufacture |
| JP4381963B2 (ja) * | 2003-11-19 | 2009-12-09 | パナソニック株式会社 | プラズマ処理装置 |
| KR20050079860A (ko) * | 2004-02-07 | 2005-08-11 | 삼성전자주식회사 | 마이크로 웨이브 공급장치, 이를 이용한 플라즈마공정장치 및 플라즈마 공정방법 |
| JP2005322771A (ja) | 2004-05-10 | 2005-11-17 | Matsushita Electric Ind Co Ltd | 熱拡散装置 |
| US7527713B2 (en) * | 2004-05-26 | 2009-05-05 | Applied Materials, Inc. | Variable quadruple electromagnet array in plasma processing |
| US20060222034A1 (en) * | 2005-03-31 | 2006-10-05 | Cymer, Inc. | 6 Khz and above gas discharge laser system |
| US8440049B2 (en) * | 2006-05-03 | 2013-05-14 | Applied Materials, Inc. | Apparatus for etching high aspect ratio features |
| EP2231324B1 (en) * | 2007-12-18 | 2016-06-29 | Dow Technology Investments LLC | Tube reactor |
| JP2010016225A (ja) | 2008-07-04 | 2010-01-21 | Tokyo Electron Ltd | 温度調節機構および温度調節機構を用いた半導体製造装置 |
| GB201013881D0 (en) * | 2010-08-19 | 2010-10-06 | Oxford Yasa Motors Ltd | Electric machine - construction |
| US20120062866A1 (en) * | 2010-09-03 | 2012-03-15 | Nikon Corporation | Microchannel-cooled coils of electromagnetic actuators exhibiting reduced eddy-current drag |
| CN102141351B (zh) | 2011-04-24 | 2012-08-08 | 广州大学 | 一种热管 |
| US9530656B2 (en) | 2011-10-07 | 2016-12-27 | Lam Research Corporation | Temperature control in RF chamber with heater and air amplifier |
| US9978565B2 (en) | 2011-10-07 | 2018-05-22 | Lam Research Corporation | Systems for cooling RF heated chamber components |
| EP2994926A1 (en) | 2013-05-06 | 2016-03-16 | Greatcell Solar S.A. | Organic-inorganic perovskite based solar cell |
| US10249475B2 (en) | 2014-04-01 | 2019-04-02 | Applied Materials, Inc. | Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation |
| KR102262657B1 (ko) * | 2014-10-13 | 2021-06-08 | 삼성전자주식회사 | 플라즈마 처리 장치 |
| KR20180025838A (ko) * | 2014-12-23 | 2018-03-09 | 시텍 게엠베하 | 기계적으로 유동화되는 증착 시스템들 및 방법들 |
| GB201619987D0 (en) | 2016-11-25 | 2017-01-11 | Iceotope Ltd | Fluid cooling system |
| CN206329930U (zh) | 2016-11-29 | 2017-07-14 | 盐城市新亚自控设备股份有限公司 | 一种led阵列器件的冷却装置 |
| US11676798B2 (en) | 2019-04-08 | 2023-06-13 | Lam Research Corporation | Cooling for a plasma-based reactor |
-
2020
- 2020-04-07 US US17/601,911 patent/US11676798B2/en active Active
- 2020-04-07 KR KR1020217036312A patent/KR102606056B1/ko active Active
- 2020-04-07 WO PCT/US2020/027081 patent/WO2020210240A1/en not_active Ceased
- 2020-04-07 JP JP2021559101A patent/JP7461965B2/ja active Active
- 2020-04-07 CN CN202080027205.2A patent/CN113661560B/zh active Active
- 2020-04-08 TW TW109111730A patent/TWI834857B/zh active
- 2020-04-08 TW TW113106270A patent/TWI899850B/zh active
-
2023
- 2023-05-02 US US18/142,570 patent/US20230274912A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20230274912A1 (en) | 2023-08-31 |
| US11676798B2 (en) | 2023-06-13 |
| JP7461965B2 (ja) | 2024-04-04 |
| TWI834857B (zh) | 2024-03-11 |
| TW202106122A (zh) | 2021-02-01 |
| TW202425717A (zh) | 2024-06-16 |
| WO2020210240A1 (en) | 2020-10-15 |
| CN113661560A (zh) | 2021-11-16 |
| JP2022526980A (ja) | 2022-05-27 |
| CN113661560B (zh) | 2023-01-17 |
| KR20210137585A (ko) | 2021-11-17 |
| TWI899850B (zh) | 2025-10-01 |
| US20220139671A1 (en) | 2022-05-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20230274912A1 (en) | Cooling for a plasma-based reactor | |
| KR102251209B1 (ko) | 고 전력 플라즈마 에칭 프로세스들을 위한 가스 분배 플레이트 조립체 | |
| CN106463363B (zh) | 底座基于流体的热控制 | |
| JP6100564B2 (ja) | 基板処理装置及び載置台 | |
| TWI776800B (zh) | 具有射頻耦合的高功率靜電吸盤設計 | |
| US9580806B2 (en) | Method of processing a substrate support assembly | |
| KR20200096145A (ko) | 배치대 및 기판 처리 장치 | |
| TWI765892B (zh) | 具有增強邊緣密封的用於高功率之工件載體 | |
| JP4191120B2 (ja) | プラズマ処理装置 | |
| JP2005079539A (ja) | プラズマ処理装置 | |
| WO2012158528A2 (en) | High temperature electrostatic chuck with radial thermal chokes | |
| KR20150130264A (ko) | 증착 챔버용 기판 지지 척 냉각 | |
| JP2019140211A (ja) | 基板載置台及びこれを備えたプラズマ処理装置及びプラズマ処理方法 | |
| KR20190043645A (ko) | 넓은 범위의 온도 제어를 위한 히터 페디스털 어셈블리 | |
| KR20150094712A (ko) | 기판 프로세싱 챔버 컴포넌트들을 위한 열 복사 배리어 | |
| JP7725614B2 (ja) | 高速排熱能力を備えた高温サセプタ | |
| TW202449973A (zh) | 陶器冷卻基座 | |
| KR102854551B1 (ko) | 기판 프로세싱 시스템들을 위한 증기 챔버를 포함하는 페데스탈 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20211105 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20230406 Comment text: Request for Examination of Application |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20230821 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20231121 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20231121 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |