CN113661560B - 基于等离子体的反应器的冷却 - Google Patents

基于等离子体的反应器的冷却 Download PDF

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Publication number
CN113661560B
CN113661560B CN202080027205.2A CN202080027205A CN113661560B CN 113661560 B CN113661560 B CN 113661560B CN 202080027205 A CN202080027205 A CN 202080027205A CN 113661560 B CN113661560 B CN 113661560B
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China
Prior art keywords
dielectric window
heat transfer
transfer fluid
heat
tapered structure
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Chinese (zh)
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CN113661560A (zh
Inventor
约翰·斯蒂芬·德雷维瑞
尼尔·马丁·保罗·本杰明
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
CN202080027205.2A 2019-04-08 2020-04-07 基于等离子体的反应器的冷却 Active CN113661560B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962830896P 2019-04-08 2019-04-08
US62/830,896 2019-04-08
PCT/US2020/027081 WO2020210240A1 (en) 2019-04-08 2020-04-07 Cooling for a plasma-based reactor

Publications (2)

Publication Number Publication Date
CN113661560A CN113661560A (zh) 2021-11-16
CN113661560B true CN113661560B (zh) 2023-01-17

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CN202080027205.2A Active CN113661560B (zh) 2019-04-08 2020-04-07 基于等离子体的反应器的冷却

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US (2) US11676798B2 (enExample)
JP (1) JP7461965B2 (enExample)
KR (1) KR102606056B1 (enExample)
CN (1) CN113661560B (enExample)
TW (2) TWI834857B (enExample)
WO (1) WO2020210240A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11676798B2 (en) 2019-04-08 2023-06-13 Lam Research Corporation Cooling for a plasma-based reactor
US11894152B2 (en) * 2021-05-05 2024-02-06 Westinghouse Electric Company Llc Modular thermal and radiation shielding with passive heat removal
CN116168997A (zh) * 2021-11-24 2023-05-26 上海华力集成电路制造有限公司 一种改善刻蚀中等离子体分布的方法

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* Cited by examiner, † Cited by third party
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CN1561534A (zh) * 2001-06-06 2005-01-05 东京毅力科创株式会社 感性耦合的等离子体处理系统
CN102084727A (zh) * 2008-07-04 2011-06-01 东京毅力科创株式会社 一种温度调节构造和使用温度调节构造的半导体制造装置
CN206329930U (zh) * 2016-11-29 2017-07-14 盐城市新亚自控设备股份有限公司 一种led阵列器件的冷却装置

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FR2815888B1 (fr) * 2000-10-27 2003-05-30 Air Liquide Dispositif de traitement de gaz par plasma
JP2002270599A (ja) 2001-03-13 2002-09-20 Canon Inc プラズマ処理装置
JP4008728B2 (ja) * 2002-03-20 2007-11-14 株式会社 液晶先端技術開発センター プラズマ処理装置
JP4163437B2 (ja) * 2002-04-17 2008-10-08 松下電器産業株式会社 プラズマ処理装置用誘電体窓
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JP4381963B2 (ja) * 2003-11-19 2009-12-09 パナソニック株式会社 プラズマ処理装置
KR20050079860A (ko) * 2004-02-07 2005-08-11 삼성전자주식회사 마이크로 웨이브 공급장치, 이를 이용한 플라즈마공정장치 및 플라즈마 공정방법
JP2005322771A (ja) 2004-05-10 2005-11-17 Matsushita Electric Ind Co Ltd 熱拡散装置
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US9978565B2 (en) 2011-10-07 2018-05-22 Lam Research Corporation Systems for cooling RF heated chamber components
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KR102262657B1 (ko) * 2014-10-13 2021-06-08 삼성전자주식회사 플라즈마 처리 장치
KR20180025838A (ko) * 2014-12-23 2018-03-09 시텍 게엠베하 기계적으로 유동화되는 증착 시스템들 및 방법들
GB201619987D0 (en) 2016-11-25 2017-01-11 Iceotope Ltd Fluid cooling system
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1561534A (zh) * 2001-06-06 2005-01-05 东京毅力科创株式会社 感性耦合的等离子体处理系统
CN102084727A (zh) * 2008-07-04 2011-06-01 东京毅力科创株式会社 一种温度调节构造和使用温度调节构造的半导体制造装置
CN206329930U (zh) * 2016-11-29 2017-07-14 盐城市新亚自控设备股份有限公司 一种led阵列器件的冷却装置

Also Published As

Publication number Publication date
US20230274912A1 (en) 2023-08-31
US11676798B2 (en) 2023-06-13
JP7461965B2 (ja) 2024-04-04
TWI834857B (zh) 2024-03-11
TW202106122A (zh) 2021-02-01
KR102606056B1 (ko) 2023-11-23
TW202425717A (zh) 2024-06-16
WO2020210240A1 (en) 2020-10-15
CN113661560A (zh) 2021-11-16
JP2022526980A (ja) 2022-05-27
KR20210137585A (ko) 2021-11-17
TWI899850B (zh) 2025-10-01
US20220139671A1 (en) 2022-05-05

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