JP7454530B2 - 金属部品 - Google Patents

金属部品 Download PDF

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Publication number
JP7454530B2
JP7454530B2 JP2021123496A JP2021123496A JP7454530B2 JP 7454530 B2 JP7454530 B2 JP 7454530B2 JP 2021123496 A JP2021123496 A JP 2021123496A JP 2021123496 A JP2021123496 A JP 2021123496A JP 7454530 B2 JP7454530 B2 JP 7454530B2
Authority
JP
Japan
Prior art keywords
plating layer
lead frame
shear strength
base material
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021123496A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023019035A (ja
Inventor
公彦 久保
綾太 古野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tec Inc
Original Assignee
Mitsui High Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec Inc filed Critical Mitsui High Tec Inc
Priority to JP2021123496A priority Critical patent/JP7454530B2/ja
Priority to CN202210824388.1A priority patent/CN115692353A/zh
Priority to EP22185760.0A priority patent/EP4124678A1/en
Priority to US17/871,281 priority patent/US20230047332A1/en
Publication of JP2023019035A publication Critical patent/JP2023019035A/ja
Priority to JP2023202508A priority patent/JP7696979B2/ja
Application granted granted Critical
Publication of JP7454530B2 publication Critical patent/JP7454530B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2021123496A 2021-07-28 2021-07-28 金属部品 Active JP7454530B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021123496A JP7454530B2 (ja) 2021-07-28 2021-07-28 金属部品
CN202210824388.1A CN115692353A (zh) 2021-07-28 2022-07-14 金属部件
EP22185760.0A EP4124678A1 (en) 2021-07-28 2022-07-19 Metal component
US17/871,281 US20230047332A1 (en) 2021-07-28 2022-07-22 Metal component
JP2023202508A JP7696979B2 (ja) 2021-07-28 2023-11-30 金属部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021123496A JP7454530B2 (ja) 2021-07-28 2021-07-28 金属部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023202508A Division JP7696979B2 (ja) 2021-07-28 2023-11-30 金属部品

Publications (2)

Publication Number Publication Date
JP2023019035A JP2023019035A (ja) 2023-02-09
JP7454530B2 true JP7454530B2 (ja) 2024-03-22

Family

ID=82656483

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021123496A Active JP7454530B2 (ja) 2021-07-28 2021-07-28 金属部品
JP2023202508A Active JP7696979B2 (ja) 2021-07-28 2023-11-30 金属部品

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023202508A Active JP7696979B2 (ja) 2021-07-28 2023-11-30 金属部品

Country Status (4)

Country Link
US (1) US20230047332A1 (https=)
EP (1) EP4124678A1 (https=)
JP (2) JP7454530B2 (https=)
CN (1) CN115692353A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024101669A (ja) * 2023-01-18 2024-07-30 株式会社三井ハイテック 金属部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155746A (ja) 2019-03-22 2020-09-24 大口マテリアル株式会社 リードフレーム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053277A (ja) 1991-06-25 1993-01-08 Hitachi Ltd 半導体装置
JPH0786484A (ja) * 1993-09-14 1995-03-31 Matsushita Electron Corp 樹脂封止型半導体装置
US6720642B1 (en) * 1999-12-16 2004-04-13 Fairchild Semiconductor Corporation Flip chip in leaded molded package and method of manufacture thereof
JP3841768B2 (ja) * 2003-05-22 2006-11-01 新光電気工業株式会社 パッケージ部品及び半導体パッケージ
JP4887533B2 (ja) * 2006-09-29 2012-02-29 Ｄｏｗａメタルテック株式会社 銀めっき金属部材およびその製造法
US20160204003A1 (en) * 2015-01-08 2016-07-14 Yiu Fai KWAN Method of forming asper-silver on a lead frame
JP6650723B2 (ja) * 2015-10-16 2020-02-19 新光電気工業株式会社 リードフレーム及びその製造方法、半導体装置
JP6733941B1 (ja) * 2019-03-22 2020-08-05 大口マテリアル株式会社 半導体素子搭載用基板
US11629426B1 (en) * 2022-06-29 2023-04-18 Rohm And Haas Electronic Materials Llc Silver electroplating compositions and methods for electroplating rough matt silver

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155746A (ja) 2019-03-22 2020-09-24 大口マテリアル株式会社 リードフレーム

Also Published As

Publication number Publication date
EP4124678A1 (en) 2023-02-01
JP7696979B2 (ja) 2025-06-23
CN115692353A (zh) 2023-02-03
JP2024024647A (ja) 2024-02-22
US20230047332A1 (en) 2023-02-16
JP2023019035A (ja) 2023-02-09

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