JP7445449B2 - 蒸着マスクの製造方法および製造装置 - Google Patents
蒸着マスクの製造方法および製造装置 Download PDFInfo
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- JP7445449B2 JP7445449B2 JP2020019818A JP2020019818A JP7445449B2 JP 7445449 B2 JP7445449 B2 JP 7445449B2 JP 2020019818 A JP2020019818 A JP 2020019818A JP 2020019818 A JP2020019818 A JP 2020019818A JP 7445449 B2 JP7445449 B2 JP 7445449B2
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- vapor deposition
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- 238000007740 vapor deposition Methods 0.000 title claims description 91
- 238000004519 manufacturing process Methods 0.000 title claims description 58
- 125000006850 spacer group Chemical group 0.000 claims description 99
- 239000010410 layer Substances 0.000 claims description 88
- 238000007747 plating Methods 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 16
- 230000008021 deposition Effects 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 71
- 239000002184 metal Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000005323 electroforming Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 229910001374 Invar Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000012808 vapor phase Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010532 solid phase synthesis reaction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020019818A JP7445449B2 (ja) | 2020-02-07 | 2020-02-07 | 蒸着マスクの製造方法および製造装置 |
KR1020210011235A KR102533404B1 (ko) | 2020-02-07 | 2021-01-27 | 증착 마스크의 제조 방법 및 제조 장치 |
CN202110124821.6A CN113308667B (zh) | 2020-02-07 | 2021-01-29 | 蒸镀掩模的制造方法及蒸镀掩模的制造装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020019818A JP7445449B2 (ja) | 2020-02-07 | 2020-02-07 | 蒸着マスクの製造方法および製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021123777A JP2021123777A (ja) | 2021-08-30 |
JP7445449B2 true JP7445449B2 (ja) | 2024-03-07 |
Family
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Family Applications (1)
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---|---|---|---|
JP2020019818A Active JP7445449B2 (ja) | 2020-02-07 | 2020-02-07 | 蒸着マスクの製造方法および製造装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7445449B2 (ko) |
KR (1) | KR102533404B1 (ko) |
CN (1) | CN113308667B (ko) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004269968A (ja) | 2003-03-10 | 2004-09-30 | Sony Corp | 蒸着用マスク |
JP2019094528A (ja) | 2017-11-21 | 2019-06-20 | 株式会社ジャパンディスプレイ | 蒸着マスク、蒸着マスクの製造方法、及び表示装置の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3678199B2 (ja) | 2001-05-16 | 2005-08-03 | ソニー株式会社 | 半導体装置製造用マスクの作製方法、及び半導体装置の製造方法 |
KR100771532B1 (ko) * | 2001-06-29 | 2007-10-31 | 주식회사 하이닉스반도체 | 포토마스크 제조장치 |
US6878208B2 (en) * | 2002-04-26 | 2005-04-12 | Tohoku Pioneer Corporation | Mask for vacuum deposition and organic EL display manufactured by using the same |
JP4089632B2 (ja) * | 2003-03-07 | 2008-05-28 | セイコーエプソン株式会社 | マスクの製造方法、マスクの製造装置、発光材料の成膜方法 |
JP2009087840A (ja) | 2007-10-02 | 2009-04-23 | Seiko Epson Corp | 蒸着マスク、蒸着マスクの製造方法、有機el素子、電子機器 |
KR100946996B1 (ko) * | 2008-06-27 | 2010-03-10 | 한양대학교 산학협력단 | 마스크 밀착장치 및 이를 구비한 노광 장비 |
JP2010229272A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 接合方法および接合体 |
JP2010229412A (ja) * | 2010-04-27 | 2010-10-14 | Seiko Epson Corp | 接着シート、接合方法および接合体 |
JP2012077328A (ja) * | 2010-09-30 | 2012-04-19 | Mitsubishi Plastics Inc | 蒸着用マスク、その製造方法及び蒸着方法 |
JP5958804B2 (ja) | 2012-03-30 | 2016-08-02 | 株式会社ブイ・テクノロジー | 蒸着マスク、蒸着マスクの製造方法及び有機el表示装置の製造方法 |
CN103668052A (zh) | 2012-09-07 | 2014-03-26 | 昆山允升吉光电科技有限公司 | 一种复合掩模板组件 |
US20190319190A1 (en) * | 2017-07-10 | 2019-10-17 | Sharp Kabushiki Kaisha | Mask sheet frame body bonding apparatus and manufacturing method of vapor deposition mask |
JP7112680B2 (ja) * | 2017-09-05 | 2022-08-04 | 大日本印刷株式会社 | 蒸着マスク装置の製造方法及び蒸着マスク装置の製造装置 |
KR102371176B1 (ko) * | 2018-02-09 | 2022-03-08 | 주식회사 오럼머티리얼 | 프레임에 부착된 마스크의 분리 방법 |
-
2020
- 2020-02-07 JP JP2020019818A patent/JP7445449B2/ja active Active
-
2021
- 2021-01-27 KR KR1020210011235A patent/KR102533404B1/ko active IP Right Grant
- 2021-01-29 CN CN202110124821.6A patent/CN113308667B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004269968A (ja) | 2003-03-10 | 2004-09-30 | Sony Corp | 蒸着用マスク |
JP2019094528A (ja) | 2017-11-21 | 2019-06-20 | 株式会社ジャパンディスプレイ | 蒸着マスク、蒸着マスクの製造方法、及び表示装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20210101139A (ko) | 2021-08-18 |
JP2021123777A (ja) | 2021-08-30 |
KR102533404B1 (ko) | 2023-05-19 |
CN113308667A (zh) | 2021-08-27 |
CN113308667B (zh) | 2023-08-18 |
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