JP7442542B2 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

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Publication number
JP7442542B2
JP7442542B2 JP2021552555A JP2021552555A JP7442542B2 JP 7442542 B2 JP7442542 B2 JP 7442542B2 JP 2021552555 A JP2021552555 A JP 2021552555A JP 2021552555 A JP2021552555 A JP 2021552555A JP 7442542 B2 JP7442542 B2 JP 7442542B2
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JP
Japan
Prior art keywords
substrate
base plate
intermediate support
substrates
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021552555A
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English (en)
Japanese (ja)
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JPWO2022215113A5 (https=
JPWO2022215113A1 (https=
Inventor
満 杷野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mitsubishi Electric Industrial Systems Corp
Original Assignee
Toshiba Mitsubishi Electric Industrial Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Mitsubishi Electric Industrial Systems Corp filed Critical Toshiba Mitsubishi Electric Industrial Systems Corp
Publication of JPWO2022215113A1 publication Critical patent/JPWO2022215113A1/ja
Publication of JPWO2022215113A5 publication Critical patent/JPWO2022215113A5/ja
Application granted granted Critical
Publication of JP7442542B2 publication Critical patent/JP7442542B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14325—Housings specially adapted for power drive units or power converters for cabinets or racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Inverter Devices (AREA)
JP2021552555A 2021-04-05 2021-04-05 電力変換装置 Active JP7442542B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/014485 WO2022215113A1 (ja) 2021-04-05 2021-04-05 基板ユニット及び電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2022215113A1 JPWO2022215113A1 (https=) 2022-10-13
JPWO2022215113A5 JPWO2022215113A5 (https=) 2023-03-08
JP7442542B2 true JP7442542B2 (ja) 2024-03-04

Family

ID=83545229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021552555A Active JP7442542B2 (ja) 2021-04-05 2021-04-05 電力変換装置

Country Status (4)

Country Link
US (1) US12279393B2 (https=)
JP (1) JP7442542B2 (https=)
CN (1) CN115918280A (https=)
WO (1) WO2022215113A1 (https=)

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS565351Y2 (https=) * 1972-05-20 1981-02-05
US4299518A (en) * 1980-03-03 1981-11-10 Texas Instruments Incorporated Manufacturing work station
JPS57113489U (https=) * 1981-01-05 1982-07-13
JPS62180991U (https=) * 1986-05-06 1987-11-17
JPH0536306Y2 (https=) * 1986-07-15 1993-09-14
JPH01110484U (https=) * 1988-01-19 1989-07-26
JPH07221471A (ja) * 1994-02-05 1995-08-18 Digital:Kk 回路基板の取付構造
JPH09331174A (ja) * 1996-06-13 1997-12-22 Hitachi Ltd 複数のボードを連結して構成される電子回路パッケージ、及び装置
JP4082825B2 (ja) * 1999-07-16 2008-04-30 シャープ株式会社 基板用カセット
JP2002151866A (ja) * 2000-11-14 2002-05-24 Nec Corp 携帯機器の強度アップ実装構造
JP4053375B2 (ja) * 2002-08-28 2008-02-27 株式会社リコー プリント基板支持筐体
US6761273B1 (en) * 2002-12-30 2004-07-13 First International Computer Inc. Fast installation/removal structure for circuit board
DE102005061825B4 (de) * 2005-12-23 2007-10-31 Fujitsu Siemens Computers Gmbh Computergehäuse
KR100708749B1 (ko) * 2006-04-20 2007-04-17 삼성에스디아이 주식회사 회로 기판 고정 구조 및 이를 구비한 디스플레이 모듈
JP2007311593A (ja) * 2006-05-19 2007-11-29 Naigai Denki Kk 電気機器収納キャビネットにおける基板取付構造
US20090141461A1 (en) * 2007-11-30 2009-06-04 Inventec Corporation Circuit board position structure
CN101754629B (zh) * 2008-12-19 2012-08-29 群康科技(深圳)有限公司 电路板固定结构
JP5257992B2 (ja) * 2009-05-28 2013-08-07 岩崎通信機株式会社 プリント基板押さえ構造
JP2010283155A (ja) * 2009-06-04 2010-12-16 Hitachi Ltd 計算機装置
JP6575914B2 (ja) 2016-01-29 2019-09-18 パナソニックＩｐマネジメント株式会社 電力変換装置
JP2019176571A (ja) * 2018-03-27 2019-10-10 パナソニックＩｐマネジメント株式会社 電力変換装置
JP6644354B1 (ja) * 2018-08-30 2020-02-12 株式会社安川電機 電子機器及び電子機器の製造方法
JP7247755B2 (ja) 2019-05-30 2023-03-29 株式会社豊田自動織機 半導体装置
CN212481623U (zh) * 2020-07-02 2021-02-05 广州市瀚科电子有限公司 一种便于安装式的空调电路板

Also Published As

Publication number Publication date
US20230156949A1 (en) 2023-05-18
US12279393B2 (en) 2025-04-15
JPWO2022215113A1 (https=) 2022-10-13
CN115918280A (zh) 2023-04-04
WO2022215113A1 (ja) 2022-10-13

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