CN115918280A - 基板单元及电力变换装置 - Google Patents

基板单元及电力变换装置 Download PDF

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Publication number
CN115918280A
CN115918280A CN202180038542.6A CN202180038542A CN115918280A CN 115918280 A CN115918280 A CN 115918280A CN 202180038542 A CN202180038542 A CN 202180038542A CN 115918280 A CN115918280 A CN 115918280A
Authority
CN
China
Prior art keywords
substrate
substrates
intermediate support
bottom plate
support portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180038542.6A
Other languages
English (en)
Chinese (zh)
Inventor
杷野满
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mitsubishi Electric Industrial Systems Corp
Original Assignee
Toshiba Mitsubishi Electric Industrial Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Mitsubishi Electric Industrial Systems Corp filed Critical Toshiba Mitsubishi Electric Industrial Systems Corp
Publication of CN115918280A publication Critical patent/CN115918280A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14325—Housings specially adapted for power drive units or power converters for cabinets or racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Inverter Devices (AREA)
CN202180038542.6A 2021-04-05 2021-04-05 基板单元及电力变换装置 Pending CN115918280A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/014485 WO2022215113A1 (ja) 2021-04-05 2021-04-05 基板ユニット及び電力変換装置

Publications (1)

Publication Number Publication Date
CN115918280A true CN115918280A (zh) 2023-04-04

Family

ID=83545229

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180038542.6A Pending CN115918280A (zh) 2021-04-05 2021-04-05 基板单元及电力变换装置

Country Status (4)

Country Link
US (1) US12279393B2 (https=)
JP (1) JP7442542B2 (https=)
CN (1) CN115918280A (https=)
WO (1) WO2022215113A1 (https=)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113489U (https=) * 1981-01-05 1982-07-13
JPH07221471A (ja) * 1994-02-05 1995-08-18 Digital:Kk 回路基板の取付構造
JPH09331174A (ja) * 1996-06-13 1997-12-22 Hitachi Ltd 複数のボードを連結して構成される電子回路パッケージ、及び装置
JP2001036267A (ja) * 1999-07-16 2001-02-09 Sharp Corp 基板用カセット
JP2004087910A (ja) * 2002-08-28 2004-03-18 Ricoh Co Ltd プリント基板支持筐体
US20040125575A1 (en) * 2002-12-30 2004-07-01 First International Computer Inc. Fast installation/removal structure for circuit board
CN1665381A (zh) * 2000-11-14 2005-09-07 日本电气株式会社 便携式装置的防变形安装结构
DE102005061825A1 (de) * 2005-12-23 2007-06-28 Fujitsu Siemens Computers Gmbh Computergehäuse
US20070249224A1 (en) * 2006-04-20 2007-10-25 Won-Kyu Bang Fixing structure of circuit board and display module comprising the same
CN101754629A (zh) * 2008-12-19 2010-06-23 群康科技(深圳)有限公司 电路板固定结构
CN209488464U (zh) * 2018-03-27 2019-10-11 松下知识产权经营株式会社 电力转换装置
CN110876247A (zh) * 2018-08-30 2020-03-10 株式会社安川电机 电子设备和电子设备的制造方法
CN212481623U (zh) * 2020-07-02 2021-02-05 广州市瀚科电子有限公司 一种便于安装式的空调电路板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS565351Y2 (https=) * 1972-05-20 1981-02-05
US4299518A (en) * 1980-03-03 1981-11-10 Texas Instruments Incorporated Manufacturing work station
JPS62180991U (https=) * 1986-05-06 1987-11-17
JPH0536306Y2 (https=) * 1986-07-15 1993-09-14
JPH01110484U (https=) * 1988-01-19 1989-07-26
JP2007311593A (ja) * 2006-05-19 2007-11-29 Naigai Denki Kk 電気機器収納キャビネットにおける基板取付構造
US20090141461A1 (en) * 2007-11-30 2009-06-04 Inventec Corporation Circuit board position structure
JP5257992B2 (ja) * 2009-05-28 2013-08-07 岩崎通信機株式会社 プリント基板押さえ構造
JP2010283155A (ja) * 2009-06-04 2010-12-16 Hitachi Ltd 計算機装置
JP6575914B2 (ja) 2016-01-29 2019-09-18 パナソニックＩｐマネジメント株式会社 電力変換装置
JP7247755B2 (ja) 2019-05-30 2023-03-29 株式会社豊田自動織機 半導体装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113489U (https=) * 1981-01-05 1982-07-13
JPH07221471A (ja) * 1994-02-05 1995-08-18 Digital:Kk 回路基板の取付構造
JPH09331174A (ja) * 1996-06-13 1997-12-22 Hitachi Ltd 複数のボードを連結して構成される電子回路パッケージ、及び装置
JP2001036267A (ja) * 1999-07-16 2001-02-09 Sharp Corp 基板用カセット
CN1665381A (zh) * 2000-11-14 2005-09-07 日本电气株式会社 便携式装置的防变形安装结构
JP2004087910A (ja) * 2002-08-28 2004-03-18 Ricoh Co Ltd プリント基板支持筐体
US20040125575A1 (en) * 2002-12-30 2004-07-01 First International Computer Inc. Fast installation/removal structure for circuit board
DE102005061825A1 (de) * 2005-12-23 2007-06-28 Fujitsu Siemens Computers Gmbh Computergehäuse
US20070249224A1 (en) * 2006-04-20 2007-10-25 Won-Kyu Bang Fixing structure of circuit board and display module comprising the same
CN101754629A (zh) * 2008-12-19 2010-06-23 群康科技(深圳)有限公司 电路板固定结构
CN209488464U (zh) * 2018-03-27 2019-10-11 松下知识产权经营株式会社 电力转换装置
CN110876247A (zh) * 2018-08-30 2020-03-10 株式会社安川电机 电子设备和电子设备的制造方法
CN212481623U (zh) * 2020-07-02 2021-02-05 广州市瀚科电子有限公司 一种便于安装式的空调电路板

Also Published As

Publication number Publication date
US20230156949A1 (en) 2023-05-18
JP7442542B2 (ja) 2024-03-04
US12279393B2 (en) 2025-04-15
JPWO2022215113A1 (https=) 2022-10-13
WO2022215113A1 (ja) 2022-10-13

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