JP7406943B2 - 研磨装置、研磨方法、および基板処理装置 - Google Patents

研磨装置、研磨方法、および基板処理装置 Download PDF

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Publication number
JP7406943B2
JP7406943B2 JP2019160218A JP2019160218A JP7406943B2 JP 7406943 B2 JP7406943 B2 JP 7406943B2 JP 2019160218 A JP2019160218 A JP 2019160218A JP 2019160218 A JP2019160218 A JP 2019160218A JP 7406943 B2 JP7406943 B2 JP 7406943B2
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Japan
Prior art keywords
substrate
polishing
device surface
cleaning
wafer
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JP2019160218A
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English (en)
Japanese (ja)
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JP2021040022A5 (https=
JP2021040022A (ja
Inventor
正行 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Priority to JP2019160218A priority Critical patent/JP7406943B2/ja
Priority to PCT/JP2020/023328 priority patent/WO2021044694A1/ja
Priority to TW109123683A priority patent/TW202112496A/zh
Publication of JP2021040022A publication Critical patent/JP2021040022A/ja
Publication of JP2021040022A5 publication Critical patent/JP2021040022A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B24B55/08—Dust extraction equipment on grinding or polishing machines specially designed for belt grinding machines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2019160218A 2019-09-03 2019-09-03 研磨装置、研磨方法、および基板処理装置 Active JP7406943B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019160218A JP7406943B2 (ja) 2019-09-03 2019-09-03 研磨装置、研磨方法、および基板処理装置
PCT/JP2020/023328 WO2021044694A1 (ja) 2019-09-03 2020-06-15 研磨装置、研磨方法、および基板処理装置
TW109123683A TW202112496A (zh) 2019-09-03 2020-07-14 研磨裝置、研磨方法、及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019160218A JP7406943B2 (ja) 2019-09-03 2019-09-03 研磨装置、研磨方法、および基板処理装置

Publications (3)

Publication Number Publication Date
JP2021040022A JP2021040022A (ja) 2021-03-11
JP2021040022A5 JP2021040022A5 (https=) 2022-08-29
JP7406943B2 true JP7406943B2 (ja) 2023-12-28

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ID=74847361

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JP2019160218A Active JP7406943B2 (ja) 2019-09-03 2019-09-03 研磨装置、研磨方法、および基板処理装置

Country Status (3)

Country Link
JP (1) JP7406943B2 (https=)
TW (1) TW202112496A (https=)
WO (1) WO2021044694A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023111564A (ja) * 2022-01-31 2023-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN115732369A (zh) * 2022-12-01 2023-03-03 华海清科股份有限公司 一种化学机械抛光系统和抛光方法
CN115870874A (zh) * 2022-12-01 2023-03-31 华海清科股份有限公司 一种化学机械抛光系统和抛光方法
JP2024090389A (ja) * 2022-12-23 2024-07-04 株式会社荏原製作所 基板処理装置、および基板処理方法
US20240408650A1 (en) * 2023-06-06 2024-12-12 Applied Materials, Inc. Method and apparatus to clean substrate with atomizing nozzle
CN117260515B (zh) * 2023-11-22 2024-02-13 北京特思迪半导体设备有限公司 抛光机的动态联动控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP2006303143A (ja) 2005-04-20 2006-11-02 Seiko Epson Corp 基板の洗浄装置、及び洗浄方法
JP2015119161A (ja) 2013-11-13 2015-06-25 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP2017108113A (ja) 2015-11-27 2017-06-15 株式会社荏原製作所 基板処理装置および基板処理方法ならびに基板処理装置の制御プログラム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7148349B2 (ja) * 2017-11-14 2022-10-05 株式会社荏原製作所 基板処理装置および基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP2006303143A (ja) 2005-04-20 2006-11-02 Seiko Epson Corp 基板の洗浄装置、及び洗浄方法
JP2015119161A (ja) 2013-11-13 2015-06-25 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP2017108113A (ja) 2015-11-27 2017-06-15 株式会社荏原製作所 基板処理装置および基板処理方法ならびに基板処理装置の制御プログラム

Also Published As

Publication number Publication date
TW202112496A (zh) 2021-04-01
JP2021040022A (ja) 2021-03-11
WO2021044694A1 (ja) 2021-03-11

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