TW202112496A - 研磨裝置、研磨方法、及基板處理裝置 - Google Patents

研磨裝置、研磨方法、及基板處理裝置 Download PDF

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Publication number
TW202112496A
TW202112496A TW109123683A TW109123683A TW202112496A TW 202112496 A TW202112496 A TW 202112496A TW 109123683 A TW109123683 A TW 109123683A TW 109123683 A TW109123683 A TW 109123683A TW 202112496 A TW202112496 A TW 202112496A
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TW
Taiwan
Prior art keywords
substrate
polishing
element surface
wafer
cleaning
Prior art date
Application number
TW109123683A
Other languages
English (en)
Chinese (zh)
Inventor
中西正行
Original Assignee
日商荏原製作所股份有限公司
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Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202112496A publication Critical patent/TW202112496A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B24B55/08—Dust extraction equipment on grinding or polishing machines specially designed for belt grinding machines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW109123683A 2019-09-03 2020-07-14 研磨裝置、研磨方法、及基板處理裝置 TW202112496A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019160218A JP7406943B2 (ja) 2019-09-03 2019-09-03 研磨装置、研磨方法、および基板処理装置
JP2019-160218 2019-09-03

Publications (1)

Publication Number Publication Date
TW202112496A true TW202112496A (zh) 2021-04-01

Family

ID=74847361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109123683A TW202112496A (zh) 2019-09-03 2020-07-14 研磨裝置、研磨方法、及基板處理裝置

Country Status (3)

Country Link
JP (1) JP7406943B2 (https=)
TW (1) TW202112496A (https=)
WO (1) WO2021044694A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849712B (zh) * 2022-01-31 2024-07-21 日商斯庫林集團股份有限公司 基板處理方法以及基板處理裝置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115732369A (zh) * 2022-12-01 2023-03-03 华海清科股份有限公司 一种化学机械抛光系统和抛光方法
CN115870874A (zh) * 2022-12-01 2023-03-31 华海清科股份有限公司 一种化学机械抛光系统和抛光方法
JP2024090389A (ja) * 2022-12-23 2024-07-04 株式会社荏原製作所 基板処理装置、および基板処理方法
US20240408650A1 (en) * 2023-06-06 2024-12-12 Applied Materials, Inc. Method and apparatus to clean substrate with atomizing nozzle
CN117260515B (zh) * 2023-11-22 2024-02-13 北京特思迪半导体设备有限公司 抛光机的动态联动控制方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP4507967B2 (ja) 2005-04-20 2010-07-21 セイコーエプソン株式会社 基板の洗浄装置
JP6210935B2 (ja) 2013-11-13 2017-10-11 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP2017108113A (ja) 2015-11-27 2017-06-15 株式会社荏原製作所 基板処理装置および基板処理方法ならびに基板処理装置の制御プログラム
JP7148349B2 (ja) * 2017-11-14 2022-10-05 株式会社荏原製作所 基板処理装置および基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849712B (zh) * 2022-01-31 2024-07-21 日商斯庫林集團股份有限公司 基板處理方法以及基板處理裝置

Also Published As

Publication number Publication date
JP7406943B2 (ja) 2023-12-28
JP2021040022A (ja) 2021-03-11
WO2021044694A1 (ja) 2021-03-11

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