JP7403874B2 - ウェハ移送ボックス - Google Patents
ウェハ移送ボックス Download PDFInfo
- Publication number
- JP7403874B2 JP7403874B2 JP2022115538A JP2022115538A JP7403874B2 JP 7403874 B2 JP7403874 B2 JP 7403874B2 JP 2022115538 A JP2022115538 A JP 2022115538A JP 2022115538 A JP2022115538 A JP 2022115538A JP 7403874 B2 JP7403874 B2 JP 7403874B2
- Authority
- JP
- Japan
- Prior art keywords
- latch
- housing
- rib
- wafers
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 235000012431 wafers Nutrition 0.000 claims description 55
- 238000010586 diagram Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
図2は、図1の一部切断面を示す図である。
図3は、下部ハウジングの構成を示す図である。
図4は、図3の一部切断面を示す図である。
101 上板
110 上部リブ
115 固定部材
150 ラッチホール
200 下部ハウジング
201 下板
210 下部リブ
215 突出部材
220 支持部材
250 ラッチ
251 第2のラッチ部材
252 第1のラッチ部材
253 第3のラッチ部材
Claims (5)
- 下板(201)と、前記下板(201)の上面に垂直に形成され、弧を描いて壁を形成して内部空間(A)にウェハを積層する1つ以上の下部リブ(210)とを含む下部ハウジング(200)と、
上板(101)と、前記上板(101)の下面に垂直に形成されて弧を描いて壁を形成する上部リブ(110)とを含む上部ハウジング(100)と、を含み、
前記下部リブ(210)は、内側面に突出部材(215)を一定間隔で1つ以上含み、
前記突出部材(215)は、前記上部ハウジング(100)と前記下部ハウジング(200)との嵌合時、前記内部空間(A)に積層されたウェハを固定し、
前記下部リブ(210)は、0.5°~3.0°の抜き勾配を有し、
前記突出部材(215)が結合された部分は、0°の抜き勾配を有するウェハ移送ボックス。 - 前記下部ハウジング(200)は、前記下板(201)の上面の各角に前記上部ハウジング(100)との嵌結時、結合して固定するラッチ(250)を1つ以上含み、
前記上部ハウジング(100)は、前記上板(101)の各角に前記ラッチ(250)に対応する位置に前記ラッチが結合して固定されるラッチホール(150)を1つ以上含む請求項1に記載のウェハ移送ボックス。 - 前記ラッチ(250)は、
前記下板(201)において前記下部リブ(210)の外側に位置し、
前記下板(210)の上面に底部を形成する第1のラッチ部材(252)と、
前記第1のラッチ部材(252)に垂直方向に前記下部リブ(250)と対向するように形成される第2のラッチ部材(251)と、
前記第2のラッチ部材(251)の内側面に突出する第3のラッチ部材(253)と、を含み、
前記上部ハウジング(100)と前記下部ハウジング(200)との嵌合時、前記第3のラッチ部材(253)が前記ラッチホール(150)に固定して結合される請求項2に記載のウェハ移送ボックス。 - 前記下部ハウジング(200)は、
前記下部リブ(210)を支持する支持部材(220)をさらに含み、
前記支持部材(220)は、前記ラッチ(250)と前記下部リブ(210)との間に配置され、前記下部リブ(210)に沿って弧を描いて形成される請求項3に記載のウェハ移送ボックス。 - 前記下部リブ(210)は、0.5°~1.0°の抜き勾配を有する請求項1に記載のウェハ移送ボックス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210119074A KR102595523B1 (ko) | 2021-09-07 | 2021-09-07 | 웨이퍼 이송 박스 |
KR10-2021-0119074 | 2021-09-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023038902A JP2023038902A (ja) | 2023-03-17 |
JP7403874B2 true JP7403874B2 (ja) | 2023-12-25 |
Family
ID=85386447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022115538A Active JP7403874B2 (ja) | 2021-09-07 | 2022-07-20 | ウェハ移送ボックス |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230070524A1 (ja) |
JP (1) | JP7403874B2 (ja) |
KR (1) | KR102595523B1 (ja) |
CN (1) | CN115775759A (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050011809A1 (en) | 2003-07-14 | 2005-01-20 | Pylant James D. | Wafer storage container with wafer positioning posts |
US20050011808A1 (en) | 2003-07-14 | 2005-01-20 | Pylant James D. | Wafer shipper with orientation control |
JP2005508802A (ja) | 2001-07-14 | 2005-04-07 | エンテグリス・インコーポレーテッド | 保護シッパ |
JP2005347734A (ja) | 2004-06-03 | 2005-12-15 | Convey Inc | 集積回路ウェハの梱包システム及び方法 |
JP2013508997A (ja) | 2009-10-27 | 2013-03-07 | テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ.ビーエイチディー. | 凹型ラッチを用いたウェーハコンテナ |
JP2013526011A5 (ja) | 2010-06-28 | 2013-08-15 | ||
JP2017143217A (ja) | 2016-02-12 | 2017-08-17 | アキレス株式会社 | 基板収納容器 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6550619B2 (en) * | 2000-05-09 | 2003-04-22 | Entergris, Inc. | Shock resistant variable load tolerant wafer shipper |
KR20020081929A (ko) | 2001-04-20 | 2002-10-30 | 삼성전자 주식회사 | 웨이퍼 포장 용기 |
KR101150405B1 (ko) * | 2003-06-17 | 2012-06-01 | 일리노이즈 툴 워크스 인코포레이티드 | 움직임이 줄어든 웨이퍼 박스 |
US6988621B2 (en) * | 2003-06-17 | 2006-01-24 | Illinois Tool Works Inc. | Reduced movement wafer box |
KR200342507Y1 (ko) | 2003-11-03 | 2004-02-21 | (주)상아프론테크 | 웨이퍼 보관용기 |
US20070187286A1 (en) * | 2006-02-16 | 2007-08-16 | Pylant James D | Wafer storage container and apparatus |
CN101888957B (zh) * | 2007-10-12 | 2013-01-02 | 大元半导体包装产业有限公司 | 带有交错壁结构的晶圆容器 |
US8556079B2 (en) * | 2009-08-26 | 2013-10-15 | Texchem Advanced Products Incorporated Sdn Bhd | Wafer container with adjustable inside diameter |
KR101547177B1 (ko) * | 2015-04-03 | 2015-08-27 | (주)상아프론테크 | 웨이퍼 보관 용기 |
KR20170076179A (ko) * | 2015-12-24 | 2017-07-04 | 삼성전자주식회사 | 웨이퍼 수납 용기 |
-
2021
- 2021-09-07 KR KR1020210119074A patent/KR102595523B1/ko active IP Right Grant
-
2022
- 2022-07-18 US US17/866,703 patent/US20230070524A1/en not_active Abandoned
- 2022-07-20 CN CN202210858846.3A patent/CN115775759A/zh active Pending
- 2022-07-20 JP JP2022115538A patent/JP7403874B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005508802A (ja) | 2001-07-14 | 2005-04-07 | エンテグリス・インコーポレーテッド | 保護シッパ |
US20050011809A1 (en) | 2003-07-14 | 2005-01-20 | Pylant James D. | Wafer storage container with wafer positioning posts |
US20050011808A1 (en) | 2003-07-14 | 2005-01-20 | Pylant James D. | Wafer shipper with orientation control |
JP2005347734A (ja) | 2004-06-03 | 2005-12-15 | Convey Inc | 集積回路ウェハの梱包システム及び方法 |
JP2013508997A (ja) | 2009-10-27 | 2013-03-07 | テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ.ビーエイチディー. | 凹型ラッチを用いたウェーハコンテナ |
JP2013526011A5 (ja) | 2010-06-28 | 2013-08-15 | ||
JP2017143217A (ja) | 2016-02-12 | 2017-08-17 | アキレス株式会社 | 基板収納容器 |
Also Published As
Publication number | Publication date |
---|---|
CN115775759A (zh) | 2023-03-10 |
JP2023038902A (ja) | 2023-03-17 |
US20230070524A1 (en) | 2023-03-09 |
KR102595523B1 (ko) | 2023-10-30 |
KR20230036337A (ko) | 2023-03-14 |
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