JP7397991B2 - 電子制御装置 - Google Patents

電子制御装置 Download PDF

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Publication number
JP7397991B2
JP7397991B2 JP2022533733A JP2022533733A JP7397991B2 JP 7397991 B2 JP7397991 B2 JP 7397991B2 JP 2022533733 A JP2022533733 A JP 2022533733A JP 2022533733 A JP2022533733 A JP 2022533733A JP 7397991 B2 JP7397991 B2 JP 7397991B2
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JP
Japan
Prior art keywords
board
control device
electronic control
electronic component
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022533733A
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English (en)
Japanese (ja)
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JPWO2022004183A1 (https=
Inventor
劉丞 菅原
英司 市川
英之 坂本
大輔 田中
英達 山本
慶仁 渡会
美波 寺西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Publication of JPWO2022004183A1 publication Critical patent/JPWO2022004183A1/ja
Application granted granted Critical
Publication of JP7397991B2 publication Critical patent/JP7397991B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)
JP2022533733A 2020-07-01 2021-05-20 電子制御装置 Active JP7397991B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020113710 2020-07-01
JP2020113710 2020-07-01
PCT/JP2021/019180 WO2022004183A1 (ja) 2020-07-01 2021-05-20 電子制御装置

Publications (2)

Publication Number Publication Date
JPWO2022004183A1 JPWO2022004183A1 (https=) 2022-01-06
JP7397991B2 true JP7397991B2 (ja) 2023-12-13

Family

ID=79315971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533733A Active JP7397991B2 (ja) 2020-07-01 2021-05-20 電子制御装置

Country Status (3)

Country Link
US (1) US12426217B2 (https=)
JP (1) JP7397991B2 (https=)
WO (1) WO2022004183A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113891620B (zh) * 2021-09-27 2023-05-23 联想(北京)有限公司 一种散热装置及电子设备
WO2023058442A1 (ja) * 2021-10-07 2023-04-13 日立Astemo株式会社 電子制御装置
US12451817B2 (en) * 2022-06-02 2025-10-21 Sentec E&E Co., Ltd. Power module
WO2025005087A1 (ja) * 2023-06-26 2025-01-02 積水化学工業株式会社 筐体構造及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020107632A (ja) 2018-12-26 2020-07-09 トヨタ自動車株式会社 電気機器

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
JPS516461U (https=) 1974-06-21 1976-01-17
JPH0519998Y2 (https=) 1987-03-06 1993-05-25
JPH10150284A (ja) * 1996-11-20 1998-06-02 Yaskawa Electric Corp 制御ユニット
JP4234259B2 (ja) * 1999-05-14 2009-03-04 富士通テン株式会社 電子機器の組合せ構造
US6778390B2 (en) * 2001-05-15 2004-08-17 Nvidia Corporation High-performance heat sink for printed circuit boards
JP2005093969A (ja) 2003-09-19 2005-04-07 Ts Heatronics Co Ltd 半導体素子冷却装置
JP5501816B2 (ja) 2010-03-19 2014-05-28 日立オートモティブシステムズ株式会社 自動車用電子制御装置
JP5343989B2 (ja) 2011-02-24 2013-11-13 株式会社デンソー 電子制御装置
JP2012199354A (ja) 2011-03-22 2012-10-18 Hitachi Automotive Systems Ltd 電子制御装置
JP2013045914A (ja) * 2011-08-25 2013-03-04 Toyota Motor Corp 冷却装置
JP6012220B2 (ja) 2012-03-29 2016-10-25 古河電気工業株式会社 高周波シールド構造
JP2014146702A (ja) 2013-01-29 2014-08-14 Nec Corp 電子装置および筐体
US20160120019A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Circuit board assembly adapted for fluid cooling
GB2557419B (en) * 2016-10-07 2020-04-01 Jaguar Land Rover Ltd Control unit
CN109219320B (zh) * 2018-10-31 2020-12-29 北京地平线机器人技术研发有限公司 电子设备及其散热装置和车辆设备
KR102767456B1 (ko) * 2018-11-05 2025-02-17 삼성전자주식회사 솔리드 스테이트 드라이브 장치 및 이를 포함하는 컴퓨터 서버 시스템
DE102019219478A1 (de) * 2019-12-12 2021-06-17 Continental Automotive Gmbh Modular erweiterbares elektronisches steuergerät
US12127377B2 (en) * 2020-04-28 2024-10-22 Hitachi Astemo, Ltd. Electronic control device
GB2619743A (en) * 2022-06-15 2023-12-20 Aptiv Tech Ltd An electronic controller unit
US20240196569A1 (en) * 2022-12-13 2024-06-13 Micron Technology, Inc. Thermal isolation for memory systems

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020107632A (ja) 2018-12-26 2020-07-09 トヨタ自動車株式会社 電気機器

Also Published As

Publication number Publication date
US20230232589A1 (en) 2023-07-20
US12426217B2 (en) 2025-09-23
JPWO2022004183A1 (https=) 2022-01-06
WO2022004183A1 (ja) 2022-01-06

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