JPWO2022004183A1 - - Google Patents
Info
- Publication number
- JPWO2022004183A1 JPWO2022004183A1 JP2022533733A JP2022533733A JPWO2022004183A1 JP WO2022004183 A1 JPWO2022004183 A1 JP WO2022004183A1 JP 2022533733 A JP2022533733 A JP 2022533733A JP 2022533733 A JP2022533733 A JP 2022533733A JP WO2022004183 A1 JPWO2022004183 A1 JP WO2022004183A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020113710 | 2020-07-01 | ||
| JP2020113710 | 2020-07-01 | ||
| PCT/JP2021/019180 WO2022004183A1 (ja) | 2020-07-01 | 2021-05-20 | 電子制御装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022004183A1 true JPWO2022004183A1 (https=) | 2022-01-06 |
| JP7397991B2 JP7397991B2 (ja) | 2023-12-13 |
Family
ID=79315971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022533733A Active JP7397991B2 (ja) | 2020-07-01 | 2021-05-20 | 電子制御装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12426217B2 (https=) |
| JP (1) | JP7397991B2 (https=) |
| WO (1) | WO2022004183A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113891620B (zh) * | 2021-09-27 | 2023-05-23 | 联想(北京)有限公司 | 一种散热装置及电子设备 |
| CN118056478A (zh) * | 2021-10-07 | 2024-05-17 | 日立安斯泰莫株式会社 | 电子控制装置 |
| US12451817B2 (en) * | 2022-06-02 | 2025-10-21 | Sentec E&E Co., Ltd. | Power module |
| EP4734681A1 (en) * | 2023-06-26 | 2026-04-29 | Sekisui Chemical Co., Ltd. | Housing structure and method for manufacturing same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150284A (ja) * | 1996-11-20 | 1998-06-02 | Yaskawa Electric Corp | 制御ユニット |
| JP2013045914A (ja) * | 2011-08-25 | 2013-03-04 | Toyota Motor Corp | 冷却装置 |
| JP2020107632A (ja) * | 2018-12-26 | 2020-07-09 | トヨタ自動車株式会社 | 電気機器 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS516461U (https=) | 1974-06-21 | 1976-01-17 | ||
| JPH0519998Y2 (https=) | 1987-03-06 | 1993-05-25 | ||
| JP4234259B2 (ja) * | 1999-05-14 | 2009-03-04 | 富士通テン株式会社 | 電子機器の組合せ構造 |
| US6778390B2 (en) * | 2001-05-15 | 2004-08-17 | Nvidia Corporation | High-performance heat sink for printed circuit boards |
| JP2005093969A (ja) | 2003-09-19 | 2005-04-07 | Ts Heatronics Co Ltd | 半導体素子冷却装置 |
| JP5501816B2 (ja) | 2010-03-19 | 2014-05-28 | 日立オートモティブシステムズ株式会社 | 自動車用電子制御装置 |
| JP5343989B2 (ja) | 2011-02-24 | 2013-11-13 | 株式会社デンソー | 電子制御装置 |
| JP2012199354A (ja) | 2011-03-22 | 2012-10-18 | Hitachi Automotive Systems Ltd | 電子制御装置 |
| JP6012220B2 (ja) | 2012-03-29 | 2016-10-25 | 古河電気工業株式会社 | 高周波シールド構造 |
| JP2014146702A (ja) | 2013-01-29 | 2014-08-14 | Nec Corp | 電子装置および筐体 |
| US20160120019A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Circuit board assembly adapted for fluid cooling |
| DE112017005077B4 (de) * | 2016-10-07 | 2026-01-29 | Jaguar Land Rover Limited | Steuereinheit |
| CN109219320B (zh) * | 2018-10-31 | 2020-12-29 | 北京地平线机器人技术研发有限公司 | 电子设备及其散热装置和车辆设备 |
| KR102767456B1 (ko) * | 2018-11-05 | 2025-02-17 | 삼성전자주식회사 | 솔리드 스테이트 드라이브 장치 및 이를 포함하는 컴퓨터 서버 시스템 |
| DE102019219478A1 (de) * | 2019-12-12 | 2021-06-17 | Continental Automotive Gmbh | Modular erweiterbares elektronisches steuergerät |
| US12127377B2 (en) * | 2020-04-28 | 2024-10-22 | Hitachi Astemo, Ltd. | Electronic control device |
| GB2619743A (en) * | 2022-06-15 | 2023-12-20 | Aptiv Tech Ltd | An electronic controller unit |
| US20240196569A1 (en) * | 2022-12-13 | 2024-06-13 | Micron Technology, Inc. | Thermal isolation for memory systems |
-
2021
- 2021-05-20 WO PCT/JP2021/019180 patent/WO2022004183A1/ja not_active Ceased
- 2021-05-20 US US18/009,911 patent/US12426217B2/en active Active
- 2021-05-20 JP JP2022533733A patent/JP7397991B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150284A (ja) * | 1996-11-20 | 1998-06-02 | Yaskawa Electric Corp | 制御ユニット |
| JP2013045914A (ja) * | 2011-08-25 | 2013-03-04 | Toyota Motor Corp | 冷却装置 |
| JP2020107632A (ja) * | 2018-12-26 | 2020-07-09 | トヨタ自動車株式会社 | 電気機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230232589A1 (en) | 2023-07-20 |
| WO2022004183A1 (ja) | 2022-01-06 |
| US12426217B2 (en) | 2025-09-23 |
| JP7397991B2 (ja) | 2023-12-13 |
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