WO2022004183A1 - 電子制御装置 - Google Patents

電子制御装置 Download PDF

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Publication number
WO2022004183A1
WO2022004183A1 PCT/JP2021/019180 JP2021019180W WO2022004183A1 WO 2022004183 A1 WO2022004183 A1 WO 2022004183A1 JP 2021019180 W JP2021019180 W JP 2021019180W WO 2022004183 A1 WO2022004183 A1 WO 2022004183A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
housing
control device
connector
electronic control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/019180
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
劉丞 菅原
英司 市川
英之 坂本
大輔 田中
英達 山本
慶仁 渡会
美波 寺西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Astemo Ltd
Original Assignee
Hitachi Ltd
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Astemo Ltd filed Critical Hitachi Ltd
Priority to US18/009,911 priority Critical patent/US12426217B2/en
Priority to JP2022533733A priority patent/JP7397991B2/ja
Publication of WO2022004183A1 publication Critical patent/WO2022004183A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Definitions

  • the present invention relates to an electronic control device.
  • An object of the present invention is to provide an electronic control device capable of achieving both miniaturization and improvement of heat dissipation.
  • the present application includes a plurality of means for solving the above problems, one of which is that a heat radiation fin is formed on one side and an electronic component having the largest heat generation is thermally contacted on the other side. It is an electronic control device including a housing having a region and a second region in which electronic components are thermally contacted on one side and the other side.
  • FIG. 1 It is a perspective view which shows typically the appearance of the electronic control apparatus which concerns on 1st Embodiment. It is an exploded perspective view which looked at the electronic control apparatus which concerns on 1st Embodiment from above. It is an exploded perspective view which looked at the electronic control apparatus which concerns on 1st Embodiment from below. It is a partial cross-sectional view of the electronic control device which concerns on 1st Embodiment. It is sectional drawing which shows the main part of the electronic control apparatus which concerns on 2nd Embodiment. It is a perspective view which shows the main part of the electronic control apparatus which concerns on 3rd Embodiment. It is sectional drawing which shows the main part of the electronic control apparatus which concerns on 4th Embodiment. FIG.
  • FIG. 5 is an exploded perspective view of the electronic control device according to the fifth embodiment as viewed from below. It is sectional drawing which shows the main part of the electronic control apparatus which concerns on 5th Embodiment. It is a bottom view which shows the structure of the 1st substrate provided in the electronic control apparatus which concerns on 6th Embodiment. It is a bottom view which shows the structure of the 1st substrate to be compared with 6th Embodiment.
  • FIG. 1 is a perspective view schematically showing the appearance of the electronic control device according to the first embodiment.
  • FIG. 2 is an exploded perspective view of the electronic control device according to the first embodiment as viewed from above
  • FIG. 3 is an exploded perspective view of the electronic control device according to the first embodiment as viewed from below.
  • the electronic control unit 100 is, for example, an electronic control unit (ECU) used in an automobile.
  • the electronic control device 100 includes a housing 11, a first substrate 21, a second substrate 22, a third substrate 23, a first cover 41, a second cover 42, and a fan cover 52. , Is equipped.
  • the first substrate 21, the second substrate 22, and the third substrate 23 are circuit boards (printed circuit boards) having wiring patterns, respectively.
  • the second substrate 22 corresponds to a motherboard, and the first substrate 21 and the third substrate 23 correspond to a daughter board, respectively.
  • FIGS. 1 and 2 show an example in which the second substrate 22 and the third substrate 23 are divided, but the present invention is not limited to this, and for example, the second substrate 22 and the third substrate 23.
  • the substrate 23 may be configured as one substrate, or the number of divisions of the substrate may be increased to three or more.
  • the side on which the first cover 41 is arranged is described as the upper side and the side on which the second cover 42 is arranged is described as the lower side when viewed from the housing 11, but the vertical direction (vertical direction). ) And the left-right direction (horizontal direction) may change depending on the orientation of the electronic control device 100 when the electronic control device 100 is mounted on the vehicle.
  • the housing 11 is made of a metal material such as aluminum or an aluminum alloy. Therefore, the housing 11 has conductivity and thermal conductivity.
  • the housing 11 has a first region 111 and a second region 112.
  • the first region 111 and the second region 112 are separated by the longitudinal direction X of the housing 11. That is, in the present embodiment, the first region 111 and the second region 112 are separated from each other with a substantially central portion of the housing 11 in the longitudinal direction X as a boundary.
  • the boundary that separates the first region 111 and the second region 112 can be arbitrarily set in the housing 11.
  • the housing 11 may have a predetermined area in addition to the first area 111 and the second area 112.
  • a heat dissipation fin 61 is formed in the first region 111 of the housing 11.
  • the heat radiation fin 61 is a plate-shaped fin formed on the upper surface side (one side) of the first region 111.
  • the heat radiation fin 61 is preferably formed integrally with the housing 11.
  • a peripheral wall 12 is formed on the outer peripheral portion of the housing 11.
  • the peripheral wall 12 has a first peripheral wall 12a formed on the upper surface side of the housing 11 and a second peripheral wall 12b formed on the lower surface side of the housing 11.
  • the first peripheral wall 12a projects upward from the upper surface of the housing 11, and the second peripheral wall 12b projects downward from the lower surface of the housing 11.
  • the holes 15 and 16 are holes through which the BtoB connectors 32 and 33 are inserted in order to electrically connect the first substrate 21 and the second substrate 22 by the BtoB connectors 32 and 33 described later. That is, the holes 15 and 16 are holes for connecting the connector.
  • the holes 15 and 16 are formed so as to penetrate the housing 11 in the thickness direction (vertical direction).
  • the holes 15 and 16 are formed in a rectangular shape in a plan view. At least one of the holes 15 and 16 is formed so that the longitudinal direction of the holes is substantially parallel to the X direction, which is the arrangement direction of the first region 111 and the second region 112. In the present embodiment, as an example, the longitudinal direction of the hole 15 is substantially parallel to the arrangement direction of the first region 111 and the second region 112.
  • the first substrate 21 is a substrate that is fixedly mounted on the upper surface side of the housing 11.
  • the first substrate 21 is arranged at a position adjacent to the heat radiation fin 61 in the first region 111 of the housing 11.
  • two electronic components 25 are mounted on the lower surface of the first substrate 21 by a BGA (Ball Grid Array). "Mounted by BGA” means "surface mounted using solder balls”.
  • the electronic component 25 is an electronic component having a smaller (less) heat generation than the electronic component 26 described later.
  • the electronic component 25 is, for example, an image processing SoC (System on Chip).
  • the electronic component 25 is arranged so as to be in contact with the upper surface of the housing 11 via the heat radiating material 72.
  • the heat radiating material 72 is composed of, for example, heat radiating grease.
  • the thermal contact refers to a contact state in which heat can be smoothly transferred between two objects or two target parts.
  • the connector half body 32a of the BtoB connector 32 and the connector half body 33a of the BtoB connector 33 are mounted by BGA, respectively. That is, the electronic component 25, the connector half body 32a of the BtoB connector 32, and the connector half body 33a of the BtoB connector 33 are mounted on the same surface of the first substrate 21 by BGA.
  • the connector half body 32a is a connector having a male (male) / female (female) relationship with the connector half body 32b of the BtoB connector 32 mounted on the second board 22, and can be fitted with the connector half body 32b. It is configured in.
  • the BtoB connector 32 is composed of a connector semifield 32a and a connector semifield 32b.
  • the connector semifield 33a is a connector having a male / female relationship with the connector semifield 33b of the BtoB connector 33 mounted on the second board 22, and is configured to be matable with the connector semifield 33b.
  • the BtoB connector 33 is composed of a connector semifield 33a and a connector semifield 33b.
  • Each of the BtoB connector 32 and the BtoB connector 33 corresponds to a first BtoB connector that electrically connects the first board 21 and the second board 22.
  • a plurality of connectors 34 are mounted on the lower surface of the first substrate 21.
  • Each connector 34 is a connector for communicating with the outside and corresponds to a first connector.
  • the second substrate 22 is a substrate that is fixedly mounted on the lower surface side (the other side) of the housing 11.
  • the first substrate 21 and the second substrate 22 are arranged so as to be stacked in the vertical direction, which is the direction perpendicular to the respective substrate surfaces.
  • a second region 112 of the housing 11 is interposed between the first substrate 21 and the second substrate 22.
  • An electronic component 24 is mounted on the upper surface of the second substrate 22 by BGA.
  • the electronic component 24 is an electronic component having a smaller calorific value than the electronic component 26 described later.
  • the electronic component 24 is, for example, a PCIeSW (PCI Express Switch).
  • the electronic component 24 is arranged so as to be in contact with the lower surface of the housing 11 via a heat radiating material (for example, heat radiating grease) (not shown). As a result, the electronic component 24 is in thermal contact with the housing 11 on the lower surface side (the other side) of the second region 112. Therefore, the heat generated by the electronic component 24 during high-speed communication is transferred to the housing 11 via the heat radiating material.
  • the second substrate 22 is arranged so as to face the first substrate 21 in the vertical direction which is the direction perpendicular to the substrate surface. By arranging the first substrate 21 and the second substrate 22 in this way, the dimensions of the entire electronic control device 100 in the left-right direction can be kept smaller than in the case where these substrates are arranged side by side in the left-right direction. Can be done.
  • a connector half body 31b of the BtoB connector 31, a connector half body 32b of the BtoB connector 32, and a connector half body 33b of the BtoB connector 33 are formed on the upper surface of the second substrate 22, in addition to the electronic component 24 described above.
  • Each is implemented by BGA. That is, the electronic component 24, the connector half body 31b of the BtoB connector 31, the connector half body 32b of the BtoB connector 32, and the connector half body 33b of the BtoB connector 33 are mounted on the same surface of the second board 22 by BGA. Has been done.
  • the connector half body 31b is a connector having a male / female relationship with the connector half body 31a of the BtoB connector 31 mounted on the third board 23, and is configured to be matable with the connector half body 31a. That is, the BtoB connector 31 is composed of a connector semifield 31a and a connector semifield 31b.
  • the BtoB connector 31 corresponds to a second BtoB connector that electrically connects the second board 22 and the third board 23.
  • the connector half body 31a is provided on the surface on which the electronic component 26 of the third board 23 is mounted, that is, on the upper surface of the third board 23.
  • the connector half body 31b is provided on the surface on which the electronic component 24 of the second substrate 22 is mounted, that is, on the upper surface of the second substrate 22.
  • the mounting surface of the electronic component 24 on the second substrate 22 and the mounting surface of the electronic component 26 on the third substrate 23 are aligned in the same direction, and the second substrate 22 and the third substrate are aligned. 23 can be connected by the BtoB connector 31.
  • the connector half body 32b is fitted with the connector half body 32a when the electronic control device 100 is assembled.
  • the connector half body 33b is fitted with the connector half body 33a when assembling the electronic control device 100. Further, a plurality of connectors 35 are mounted on the lower surface of the second substrate 22.
  • Each connector 35 is a connector for communicating with the outside and corresponds to a second connector.
  • the connector 34 provided on the first board 21 and the connector 35 provided on the second board 22 are arranged on the same side of the side surface of the housing 11 in the lateral direction Y of the housing 11. Has been done.
  • the connection directions (fitting directions) of the connectors (not shown) having a male / female relationship with the respective connectors 34 and 35 can be aligned in the same direction. can.
  • the third substrate 23 is arranged on the same plane as the second substrate 22.
  • the third substrate 23 is provided on the region where the heat radiation fins 61 are formed.
  • the third substrate 23 is mounted on the lower surface side of the housing 11 together with the second substrate 22.
  • An electronic component 26 is mounted on the upper surface of the third substrate 23 by BGA.
  • the electronic component 26 is an electronic component having the largest (largest) heat generation among the electronic components mounted on the first substrate 21, the second substrate 22, and the third substrate 23.
  • the electronic component 26 is, for example, an accelerator (SoC for an accelerator).
  • the electronic component 26 is composed of a surface mount type package (for example, a BGA package).
  • the electronic component 26 is arranged so as to be in contact with the lower surface of the housing 11 via a heat radiating material (for example, heat radiating grease) (not shown). As a result, the electronic component 26 is in thermal contact with the housing 11 on the lower surface side (the other side) of the first region 111. Therefore, the heat generated by the electronic component 26 during high-speed communication is transferred to the housing 11 via the heat radiating material.
  • a heat radiating material for example, heat radiating grease
  • the connector semifield 31a of the BtoB connector 31 is mounted on the upper surface of the third substrate 23 by BGA. That is, the electronic component 26 and the connector semifield 31a of the BtoB connector 31 are mounted on the same surface of the third substrate 23 by BGA.
  • the connector half body 31a is fitted to the above-mentioned connector half body 31b from the horizontal direction. As a result, the second board 22 and the third board 23 are horizontally connected by the BtoB connector 31.
  • the first cover 41 is a cover provided so as to cover the opening on the upper surface side (one side) of the housing 11 in the vertical direction.
  • the first cover 41 is attached so as to cover the first substrate 21 from the outside.
  • the lower surface of the first cover 41 is arranged to face the upper surface of the first substrate 21, and the upper surface of the housing 11 is arranged to face the lower surface of the first substrate 21. Therefore, the first substrate 21 is arranged in the space formed by the housing 11 and the first cover 41 in the vertical direction.
  • the first cover 41 is formed in a quadrangle in plan view with dimensions larger than the external dimensions of the first substrate 21 so that the entire area of the first substrate 21 can be shielded.
  • the first cover 41 is made of a metal material such as an iron alloy, more specifically, a plated steel plate or the like.
  • a metal material such as an iron alloy, more specifically, a plated steel plate or the like.
  • the second cover 42 is a cover provided so as to cover the opening on the other side (lower surface side) of the housing 11 in the vertical direction.
  • the second cover 42 is attached so as to cover the second substrate 22 and the third substrate 23.
  • the upper surface of the second cover 42 is arranged to face the lower surfaces of the second substrate 22 and the third substrate 23, and the lower surface of the housing 11 is placed on the upper surfaces of the second substrate 22 and the third substrate 23. They are placed facing each other. Therefore, the second substrate 22 and the third substrate 23 are arranged in the space formed by the housing 11 and the second cover 42 in the vertical direction.
  • the second cover 42 is viewed in a plan view with dimensions larger than the dimensions of the outermost peripheral portions of the second substrate 22 and the third substrate 23 so that the entire area of the second substrate 22 and the third substrate 23 can be shielded. It is formed in a quadrangle.
  • the second cover 42 is made of a metal material such as an iron alloy, more specifically, a plated steel plate or the like.
  • the fan cover 52 is a cover provided so as to cover the heat radiation fin 61.
  • the fan cover 52 is formed with three openings 52a.
  • the three openings 52a are openings for ventilation and are formed corresponding to the three fans 51.
  • the fan 51 is a fan for forced air cooling. The number of fans 51 can be changed as needed. Further, the fan 51 may be provided as needed, and the fan cover 52 may be provided as needed.
  • the opening 52a serves as an intake port for taking in air from the outside of the electronic control device 100 to the fan 51 when the fan 51 is driven.
  • the fan 51 is provided on the fin side (upper surface side) of the first region 111 of the housing 11.
  • the intermediate portion on the upper surface side of the first region 111 is formed in a concave groove having no fin structure, and three fans 51 are arranged in a row in the concave groove.
  • the fan 51 is arranged at the center of the heat radiation fin 61.
  • the fan cover 52 is attached to the upper surface side of the housing 11 together with the first cover 41.
  • the fan cover 52 is arranged next to the first cover 41.
  • the fan cover 52 is formed in a rectangular shape in a plan view with dimensions that match the size of the heat radiation fins 61.
  • the fan cover 52 is made of a metal material.
  • the heat generated by the electronic component 26 during high-speed communication is also conducted to the heat radiation fin 61 of the housing 11, the heat generated by the electronic component 26 is transferred to the housing 11 by air-cooling the heat radiation fin 61 with the fan 51. It can be efficiently released to the outside of.
  • the electronic control device 100 having the above configuration is assembled, for example, by the following procedure. First, the connector half body 31b mounted on the second board 22 and the connector half body 31a mounted on the third board 23 are fitted. As a result, the second board 22 and the third board 23 are horizontally connected by the BtoB connector 31. Therefore, a large amount of data can be communicated at high speed between the second substrate 22 and the third substrate 23 through the BtoB connector 31.
  • the second substrate 22 and the third substrate 23 are attached to the lower surface side of the housing 11.
  • the connector semifields 32b and 33b mounted on the second board 22 are arranged inside the corresponding holes 15 and 16, respectively.
  • the second substrate 22 and the housing 11 are fastened with screws 71 (see FIG. 1).
  • the second cover 42 is attached to the lower surface side of the housing 11 so as to cover the second substrate 22 and the third substrate 23.
  • the gap between the second cover 42 and the connector 35 and the gap between the second cover 42 and the housing 11 are filled with the waterproof material 91 (see FIG. 1), respectively.
  • a fan cover 52 is attached to the upper surface side of the housing 11 so as to cover the heat radiation fins 61.
  • the first substrate 21 is attached to the upper surface side of the housing 11.
  • the connector semifields 32a and 33a mounted on the first board 21 are arranged inside the corresponding holes 15 and 16, respectively.
  • the first board 21 and the housing 11 are fastened with screws 71 (see FIG. 1).
  • the connector half body 32a is fitted to the connector half body 32b
  • the connector half body 33a is fitted to the connector half body 33b.
  • the first board 21 and the second board 22 are vertically connected by the BtoB connector 32 and the BtoB connector 33.
  • the connector semifields 33a and 33b constituting the BtoB connector 33 are arranged in the space of the hole 16, and the connector semifields 33a and 33b are connected to each other in this space.
  • the connector semifields 32a and 32b constituting the BtoB connector 32 are arranged in the space of the hole 15, and the connector semifields 32a and 32b are connected to each other in this space. In this way, by connecting the first board 21 and the second board 22 by the BtoB connector 32 and the BtoB connector 33, the BtoB connector is connected between the first board 21 and the second board 22. A large amount of data can be communicated at high speed through the 32 and the BtoB connector 33.
  • the first cover 41 is attached to the upper surface side of the housing 11 so as to cover the first substrate 21.
  • the gap between the first cover 41 and the connector 34 and the gap between the first cover 41 and the housing 11 are filled with the waterproof material 91 (see FIG. 1), respectively.
  • the reason for providing the waterproof material 91 is as described above. This completes the assembly of the electronic control device 100.
  • the assembly procedure of the electronic control device 100 is not limited to the procedure described above, and can be appropriately changed.
  • the heat radiation fin 61 is formed on the upper surface side on one side, and the electronic component 26 having the largest heat generation is thermally contacted on the lower surface side on the other side with the first region 111.
  • a housing having a second region 112 with which the electronic components 24 and 25 are thermally contacted is provided on the upper surface side and the lower surface side.
  • the heat generated by each of the electronic components 24 and 25 can be dissipated to the housing 11 by thermally contacting the components 24 and 25. Therefore, according to the first embodiment, it is possible to prevent the entire housing 11 from spreading in the lateral direction. Further, in the vertical direction, the upper surface side of the first region 111 of the housing 11 is a single-layer region in which the substrates are not laminated and mounted, and the heat radiation fin 61 is formed on the upper surface side of the first region 111, while the back side thereof. An electronic component 26 having a large amount of heat radiation is thermally contacted with the lower surface side of the first region 111 to dissipate heat from the electronic component 26.
  • the second region 112 of the housing 11 is a laminated region in which the first substrate 21 and the second substrate 22 are laminated and mounted, and the electronic components 24 and 25 are placed in the second region 112. It is aggregated and arranged. Therefore, it is possible to realize efficient heat dissipation while downsizing the electronic control device 100. As a result, it is possible to achieve both miniaturization of the electronic control device 100 and improvement of heat dissipation.
  • the first substrate 21 is mounted on the upper surface side of the second region 112 of the housing 11, and the second substrate 22 is mounted on the lower surface side of the second region 112 on the opposite side. is doing.
  • the variation in the thickness dimensions of the respective boards 21 and 22 is absorbed by the connection portion of the BtoB connectors 32 and 33. Can be done.
  • the variation in the thickness dimension of each of the boards 21 and 22 can be removed from the connection tolerance when the first board 21 and the second board 22 are connected by the BtoB connectors 32 and 33.
  • the clearance between the first substrate 21 and the second substrate 22 can be narrowed, and the electronic control device 100 can be miniaturized in the height direction (vertical direction).
  • the first substrate 21 is fixed to the upper surface side of the housing 11, and the second substrate 22 is fixed to the lower surface side of the housing 11.
  • the misalignment of the first substrate 21 with respect to the housing 11 is suppressed, and the misalignment of the second substrate 22 with respect to the housing 11 is suppressed. Therefore, the thermal contact state between the second region 112 and the electronic component 25 and the thermal contact state between the second region 112 and the electronic component 24 can be reliably maintained.
  • the electronic component 26 which is an accelerator and the connector half body 31a of the BtoB connector 31 are mounted on the same surface (upper surface) of the third substrate 23 by BGA.
  • the electronic component 24 which is a PCIeSW, the connector half body 31b of the BtoB connector 31, the connector half body 32b of the BtoB connector 32, and the connector half body 33b of the BtoB connector 33 are on the same surface of the second board 22 by BGA. It is mounted on the top surface).
  • the electronic component 25 which is an image processing SoC, the connector half body 32a of the BtoB connector 32, and the connector half body 33a of the BtoB connector 33 are mounted on the same surface (lower surface) of the first substrate 21 by BGA. There is.
  • each component is mounted.
  • the parts to be mounted by BGA can be integrated on one side. Therefore, when each component mounted on the board by BGA is joined to the board by the solder reflow method, it is not necessary to invert the board. Therefore, it is possible to prevent the components from peeling off from the substrate during solder reflow and improve the yield.
  • the electronic component 26 mounted on the third substrate 23 is an accelerator
  • the electronic component 25 mounted on the first substrate 21 is an image processing SoC 25
  • the second substrate is an image processing SoC 25
  • the electronic component 24 mounted on the 22 is a PCIeSW.
  • the longitudinal direction of the hole 15 for inserting the BtoB connector 32 is substantially parallel to the X direction, which is the arrangement direction of the first region 111 and the second region 112.
  • air exists inside the hole 15.
  • the heat transfer coefficient of air is significantly lower than the heat transfer coefficient of the metal material (substantive portion) constituting the housing 11. Therefore, when the longitudinal direction of the hole 15 is perpendicular to the X direction, the actual size of the housing 11 that contributes to heat transfer between the first region 111 and the second region 112 becomes narrower.
  • the longitudinal direction of the hole 15 is substantially parallel to the X direction, the physical dimensions of the housing 11 that contributes to heat transfer between the first region 111 and the second region 112 are widely secured. be able to. Therefore, when the hole 15 is formed in the housing 11, it is possible to suppress the resistance of heat transfer due to the presence of the hole 15.
  • FIG. 5 is a cross-sectional view showing a main part of the electronic control device according to the second embodiment.
  • a recess 17 is formed on the upper surface of the second region 112 of the housing 11.
  • the recess 17 is formed at a position where the electronic component 25 is arranged when the first substrate 21 is attached to the housing 11.
  • the recess 17 is formed in a rectangular shape along the outer shape of the electronic component 25.
  • the depth dimension of the recess 17 is set according to the height dimension of the electronic component 25.
  • the electronic component 25 is arranged in the recess 17.
  • a recess 17 (see FIG. 3) is formed on the lower surface of the first region 111 of the housing 11, and the electronic component 26 is arranged in the recess 17.
  • a recess (not shown) is also formed on the lower surface of the second region 112 of the housing 11, and the electronic component 24 is arranged in this recess.
  • the electronic component is compared with the configuration shown in FIG. 4 above.
  • the thermal contact area between the 25 and the housing 11 becomes wide. Therefore, the heat generated by the electronic component 25 can be transferred to the housing 11 with higher efficiency. Therefore, the heat dissipation effect can be further improved.
  • Such an effect can be obtained even when the gap between the recess and the electronic component 24 (not shown) is filled with the heat radiating material, or when the gap between the recess 17 and the electronic component 26 is filled with the heat radiating material.
  • FIG. 6 is a perspective view showing a main part of the electronic control device according to the third embodiment.
  • each fan 51 is arranged at the end of the heat dissipation fin 61.
  • each fan 51 is arranged at the end of the housing 11 in the lateral direction Y.
  • the lateral direction Y of the housing 11 is a direction parallel to the longitudinal direction of the heat radiation fin 61.
  • the end of the heat radiating fin 61 in which the fan 51 is arranged is an upstream end in the direction in which air for air cooling flows when the heat radiating fin 61 is air-cooled by blowing air from the fan 51.
  • the fan 51 is arranged at the end of the heat radiating fin 61, the following advantageous effects are obtained as compared with the case where the fan 51 is arranged at the center of the heat radiating fin 61 as shown in FIG. Is obtained.
  • the heat radiation fin 61 is arranged on one side and the other side around the fan 51. Therefore, the air sent out by the fan 51 flows separately into one heat radiation fin 61 and the other heat radiation fin 61. Therefore, on the upper surface side of the first region 111 of the housing 11, the directions of the air flowing through the heat radiation fins 61 are two directions. Further, the air flowing through the heat radiating fins 61 becomes wind containing heat discharged from the heat radiating fins 61, that is, hot air, and the hot air is discharged from both sides of the housing 11 in the lateral direction. The hot air discharged from the housing 11 may adversely affect other electronic control devices mounted on the vehicle.
  • the fan 51 when the fan 51 is arranged at the end of the heat radiation fin 61, the direction of the air flowing through the heat radiation fin 61 is unidirectional due to the fan 51. Therefore, the air containing heat (hot air) emitted from the heat radiating fins 61 is discharged from only one side of the housing 11 in the lateral direction. Therefore, when the fan 51 is arranged at the end of the heat radiation fin 61, the mounting position of the other electronic control device is determined by considering only the influence of the hot air discharged from one side in the lateral direction of the housing 11. Can be done. Therefore, when a plurality of electronic control devices are mounted on the vehicle, it is possible to increase the degree of freedom in layout.
  • the heat radiating fins are used to transfer the heat generated by the electronic components to the radiating fins 61.
  • a recess (not shown) may be formed in the region where the 61 is formed, and the electronic component may be arranged in the recess.
  • the shape and orientation of the heat radiation fin 61 are changed according to the arrangement of the electronic component, so that the recess in which the electronic component can be arranged is formed in the region where the heat radiation fin 61 is formed. Can be secured.
  • FIG. 7 is a cross-sectional view showing a main part of the electronic control device according to the fourth embodiment.
  • the electronic control device according to the fourth embodiment includes a heat pipe 85.
  • the heat pipe 85 transfers the heat generated by the electronic component 25 by the hydraulic fluid.
  • the heat transfer rate by the heat pipe 85 is faster than the heat transfer rate by the metal material constituting the housing 11.
  • One end portion 85a of the heat pipe 85 is in thermal contact with the electronic component 25 via the heat radiating material 72.
  • the other end 85b of the heat pipe 85 is in thermal and physical contact with the heat radiation fin 61. Further, the other end portion 85b of the heat pipe 85 is inserted (fitted) into the through hole 115 provided in the housing 11 in the forming region of the heat radiation fin 61.
  • the heat pipe 85 that thermally contacts the electronic component 25 and the heat radiation fin 61 since the heat pipe 85 that thermally contacts the electronic component 25 and the heat radiation fin 61 is provided, the heat generated by the electronic component 25 can be transferred to the heat radiation fin 61 at a high moving speed. .. Further, a through hole 115 is provided in the forming region of the heat radiation fin 61, and the heat pipe 85 is passed through the through hole 115 so that the heat pipe 85 is thermally brought into contact with the heat radiation fin 61. Therefore, by directly air-cooling the heat radiation fin 61 and the heat pipe 85 by the fan 51, the heat generated by the electronic component 25 can be efficiently released to the outside. Such an effect can be obtained even when a heat pipe that is in thermal contact between the electronic component 24 and the heat radiation fin 61 is provided, or when a heat pipe that is in thermal contact between the electronic component 26 and the heat radiation fin 61 is provided. can get.
  • FIG. 8 is an exploded perspective view of the electronic control device according to the fifth embodiment as viewed from below
  • FIG. 9 is a cross-sectional view showing a main part of the electronic control device according to the fifth embodiment.
  • the notation of the second substrate 22, the third substrate 23, and the second cover 42 is omitted.
  • the fan cover 52 is made of a metal material having high thermal conductivity, and the fins 52b are integrally formed with the fan cover 52. There is.
  • the fin 52b is a plate-shaped fin formed on the upper surface side of the fan cover 52, and releases heat by natural convection.
  • the fin 52b is not limited to the plate type fin, and may be a pin type fin.
  • the fan cover 52 is joined to the heat radiation fin 61 by, for example, a resin having thermal conductivity or a bonding material 82 such as thermal paste.
  • the joining material 82 is provided between the heat radiating fin 61 and the fan cover 52 by being applied to at least one of the protruding end surface of the heat radiating fin 61 and the lower surface of the fan cover 52.
  • the formed region of the heat radiation fin 61 in the housing 11 is in a state of being in thermal contact with the fan cover 52 via the joining material 82.
  • the heat transferred from the electronic components 24, 25, and 26 to the heat dissipation fins 61 is not only discharged from the heat dissipation fins 61, but also. It can also be discharged from the fins 52b of the fan cover 52. Therefore, the heat generated in each of the electronic components 24, 25, and 26 can be efficiently released to the outside.
  • FIG. 10 is a bottom view showing the configuration of the first substrate included in the electronic control device according to the sixth embodiment
  • FIG. 11 shows the configuration of the first substrate to be compared with the sixth embodiment. It is a bottom view.
  • the two electronic components 25 mounted on the lower surface of the first substrate 21 are arranged so as to be offset in the Y direction so that the positions of the two electronic components 25 do not overlap each other in the Y direction. In other words, the two electronic components 25 are arranged in parallel with respect to the X direction.
  • the two electronic components 25 are arranged at the same position in the Y direction so that the positions of the two electronic components 25 overlap each other in the Y direction. In other words, the two electronic components 25 are arranged in series with respect to the X direction.
  • the X direction is the longitudinal direction of the housing 11, and is also the arrangement direction of the first region 111 and the second region 112. Further, heat radiation fins 61 are formed on the upper surface side of the first region 111, and each electronic component 25 is in thermal contact with the upper surface side of the second region 112. Therefore, the heat transferred from each electronic component 25 to the housing 11 moves from the second region 112 toward the first region 111.
  • the heat transferred from one of the electronic components 25 to the housing 11 is transferred to the housing 11 from the movement path R1 that moves from the second region 112 to the first region 111, and from the other electronic component 25 to the housing 11.
  • the movement path R2 in which heat moves from the second region 112 toward the first region 111 is transmitted to the heat radiation fin 61 without merging (interfering) in the middle of the X direction. Therefore, the heat generated in each of the electronic components 25 can be quickly transferred to the heat dissipation fins 61 through the moving paths R1 and R2.
  • the arrangement of the two electronic components 25 mounted on the first substrate 21 has been described, but the present invention is not limited to this, and the two electrons mounted on the first substrate 21 are not limited to this.
  • the electronic components 26 are arranged in parallel with their positions shifted in the Y direction in the same manner as described above. May be good.
  • the number of electronic components arranged in parallel is not limited to two, and may be three or more.
  • the present invention is not limited to the above-described embodiment, and includes various modifications.
  • the contents of the present invention are described in detail so as to be easy to understand, but the present invention is not necessarily limited to those including all the configurations described in the above-described embodiment.
  • the electronic control device used for an automobile (electronic control device for a vehicle) has been described as an example, but the electronic control device according to the present invention is used for applications other than automobiles. It doesn't matter.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)
PCT/JP2021/019180 2020-07-01 2021-05-20 電子制御装置 Ceased WO2022004183A1 (ja)

Priority Applications (2)

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US18/009,911 US12426217B2 (en) 2020-07-01 2021-05-20 Electronic control device
JP2022533733A JP7397991B2 (ja) 2020-07-01 2021-05-20 電子制御装置

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JP2020113710 2020-07-01
JP2020-113710 2020-07-01

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JP7397991B2 (ja) 2023-12-13
JPWO2022004183A1 (https=) 2022-01-06

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