JP7385758B2 - 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物 - Google Patents

樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物 Download PDF

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JP7385758B2
JP7385758B2 JP2022537992A JP2022537992A JP7385758B2 JP 7385758 B2 JP7385758 B2 JP 7385758B2 JP 2022537992 A JP2022537992 A JP 2022537992A JP 2022537992 A JP2022537992 A JP 2022537992A JP 7385758 B2 JP7385758 B2 JP 7385758B2
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JPWO2022019253A1 (zh
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雅臣 牧野
敬史 川島
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14825—Linear CCD imagers

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Structural Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Architecture (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)
JP2022537992A 2020-07-22 2021-07-19 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物 Active JP7385758B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020124896 2020-07-22
JP2020124896 2020-07-22
PCT/JP2021/026919 WO2022019253A1 (ja) 2020-07-22 2021-07-19 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物

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JPWO2022019253A1 JPWO2022019253A1 (zh) 2022-01-27
JP7385758B2 true JP7385758B2 (ja) 2023-11-22

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JP (1) JP7385758B2 (zh)
KR (1) KR20230013086A (zh)
CN (1) CN115768833A (zh)
TW (1) TW202206554A (zh)
WO (1) WO2022019253A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022176788A1 (ja) * 2021-02-18 2022-08-25 富士フイルム株式会社 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および樹脂の製造方法
WO2024090486A1 (ja) * 2022-10-28 2024-05-02 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231281A (ja) 2010-04-30 2011-11-17 Tokyo Metropolitan Univ ポリイミド樹脂およびその利用
JP2013095921A (ja) 2011-11-01 2013-05-20 Chi Mei Corp ポリシロキサングラフト化ポリイミド樹脂組成物及びその応用

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
JPH047333A (ja) * 1990-04-25 1992-01-10 Japan Carlit Co Ltd:The 新規ポリイミド
JP6209499B2 (ja) * 2014-03-18 2017-10-04 富士フイルム株式会社 着色硬化性樹脂組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子、画像表示装置、化合物およびカチオン
JP6589305B2 (ja) 2015-03-13 2019-10-16 東洋インキＳｃホールディングス株式会社 カラーフィルタ用着色組成物、およびカラーフィルタ
JP6686657B2 (ja) * 2015-04-22 2020-04-22 Jsr株式会社 着色組成物、着色硬化膜、カラーフィルタ、表示素子及び固体撮像素子
KR102299736B1 (ko) * 2017-02-23 2021-09-08 후지필름 가부시키가이샤 감광성 조성물, 경화막, 컬러 필터, 고체 촬상 소자 및 화상 표시 장치
WO2019065902A1 (ja) * 2017-09-29 2019-04-04 東レ株式会社 感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び有機ｅｌディスプレイ、並びに有機ｅｌディスプレイの製造方法
JP7229354B2 (ja) * 2019-07-11 2023-02-27 富士フイルム株式会社 樹脂組成物、膜、カラーフィルタ、固体撮像素子、画像表示装置、樹脂および化合物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231281A (ja) 2010-04-30 2011-11-17 Tokyo Metropolitan Univ ポリイミド樹脂およびその利用
JP2013095921A (ja) 2011-11-01 2013-05-20 Chi Mei Corp ポリシロキサングラフト化ポリイミド樹脂組成物及びその応用

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CN115768833A (zh) 2023-03-07
KR20230013086A (ko) 2023-01-26
TW202206554A (zh) 2022-02-16
JPWO2022019253A1 (zh) 2022-01-27
WO2022019253A1 (ja) 2022-01-27

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