JP7374683B2 - 基板搬送装置および基板搬送装置のハンドの位置補正方法 - Google Patents

基板搬送装置および基板搬送装置のハンドの位置補正方法 Download PDF

Info

Publication number
JP7374683B2
JP7374683B2 JP2019170011A JP2019170011A JP7374683B2 JP 7374683 B2 JP7374683 B2 JP 7374683B2 JP 2019170011 A JP2019170011 A JP 2019170011A JP 2019170011 A JP2019170011 A JP 2019170011A JP 7374683 B2 JP7374683 B2 JP 7374683B2
Authority
JP
Japan
Prior art keywords
substrate
hand
transfer device
section
moving body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019170011A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021048270A (ja
Inventor
光治 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2019170011A priority Critical patent/JP7374683B2/ja
Priority to TW109120689A priority patent/TWI744956B/zh
Priority to PCT/JP2020/032858 priority patent/WO2021054101A1/ja
Publication of JP2021048270A publication Critical patent/JP2021048270A/ja
Application granted granted Critical
Publication of JP7374683B2 publication Critical patent/JP7374683B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Numerical Control (AREA)
  • Manipulator (AREA)
JP2019170011A 2019-09-19 2019-09-19 基板搬送装置および基板搬送装置のハンドの位置補正方法 Active JP7374683B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019170011A JP7374683B2 (ja) 2019-09-19 2019-09-19 基板搬送装置および基板搬送装置のハンドの位置補正方法
TW109120689A TWI744956B (zh) 2019-09-19 2020-06-19 基板搬運裝置以及基板搬運裝置的手部的位置修正方法
PCT/JP2020/032858 WO2021054101A1 (ja) 2019-09-19 2020-08-31 基板搬送装置および基板搬送装置のハンドの位置補正方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019170011A JP7374683B2 (ja) 2019-09-19 2019-09-19 基板搬送装置および基板搬送装置のハンドの位置補正方法

Publications (2)

Publication Number Publication Date
JP2021048270A JP2021048270A (ja) 2021-03-25
JP7374683B2 true JP7374683B2 (ja) 2023-11-07

Family

ID=74878702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019170011A Active JP7374683B2 (ja) 2019-09-19 2019-09-19 基板搬送装置および基板搬送装置のハンドの位置補正方法

Country Status (3)

Country Link
JP (1) JP7374683B2 (zh)
TW (1) TWI744956B (zh)
WO (1) WO2021054101A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024054919A (ja) 2022-10-06 2024-04-18 東京エレクトロン株式会社 基板搬送ユニットおよび基板搬送制御方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019963A (ja) 2003-06-03 2005-01-20 Tokyo Electron Ltd 基板処理装置及び基板受け渡し位置の調整方法
JP2006140350A (ja) 2004-11-12 2006-06-01 Dainippon Screen Mfg Co Ltd 基板処理装置およびティーチング方法
JP2010541200A (ja) 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 一体化されたウェハ受渡し機構
JP2013162029A (ja) 2012-02-07 2013-08-19 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2018523288A (ja) 2015-07-22 2018-08-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ロボットによるウェハ配置の光学式較正のための装置及び方法
JP2018182217A (ja) 2017-04-20 2018-11-15 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、それを備える基板処理装置および基板搬送装置のティーチング方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0643032B2 (ja) * 1988-08-23 1994-06-08 株式会社三協精機製作所 ダイレクトドライブ多関節ロボット
JP3261841B2 (ja) * 1993-12-27 2002-03-04 株式会社日立製作所 マルチ式ウエ−ハ処理装置
JPH07263518A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置
JP6430195B2 (ja) * 2014-09-29 2018-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板収納容器
SG10201603103UA (en) * 2015-04-30 2016-11-29 Canon Kk Imprint device, substrate conveying device, imprinting method, and method for manufacturing article
JP7153848B2 (ja) * 2018-03-16 2022-10-17 株式会社東京精密 プローバ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019963A (ja) 2003-06-03 2005-01-20 Tokyo Electron Ltd 基板処理装置及び基板受け渡し位置の調整方法
JP2006140350A (ja) 2004-11-12 2006-06-01 Dainippon Screen Mfg Co Ltd 基板処理装置およびティーチング方法
JP2010541200A (ja) 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー 一体化されたウェハ受渡し機構
JP2013162029A (ja) 2012-02-07 2013-08-19 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2018523288A (ja) 2015-07-22 2018-08-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ロボットによるウェハ配置の光学式較正のための装置及び方法
JP2018182217A (ja) 2017-04-20 2018-11-15 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、それを備える基板処理装置および基板搬送装置のティーチング方法

Also Published As

Publication number Publication date
TW202112641A (zh) 2021-04-01
TWI744956B (zh) 2021-11-01
JP2021048270A (ja) 2021-03-25
WO2021054101A1 (ja) 2021-03-25

Similar Documents

Publication Publication Date Title
KR101891446B1 (ko) 기판 반송 장치, 기판 반송 방법 및 그 기판 반송 방법을 실행시키기 위한 프로그램을 기록한 기록 매체
KR101485297B1 (ko) 열처리 장치 및 기판 반송 위치 조정 방법
JP4799325B2 (ja) 基板受け渡し装置，基板処理装置，基板受け渡し方法
JP4993614B2 (ja) 搬送手段のティーチング方法、記憶媒体及び基板処理装置
JP5949741B2 (ja) ロボットシステム及び検出方法
KR101446413B1 (ko) 반송 시스템
JP6285275B2 (ja) 基板処理装置および基板処理方法
TWI627693B (zh) 基板處理裝置及基板處理方法
KR101850214B1 (ko) 반송 시스템 및 반송 방법
KR100802526B1 (ko) 진공처리방법 또는 진공처리장치
JP5189370B2 (ja) 基板交換装置及び基板処理装置並びに基板検査装置
CN109923640B (zh) 接合装置、接合系统、接合方法和计算机存储介质
JP2018121007A (ja) 基板搬送装置、検出位置較正方法および基板処理装置
KR20230018449A (ko) 웨이퍼 반송 장치 및 웨이퍼 반송 방법
JP4922915B2 (ja) 基板処理装置および基板の芯合わせ方法
JP7374683B2 (ja) 基板搬送装置および基板搬送装置のハンドの位置補正方法
JP5884624B2 (ja) 基板処理装置、調整方法及び記憶媒体
US20210384058A1 (en) Substrate processing apparatus and substrate processing method
JP2013110444A (ja) 基板搬送装置の位置調整方法
JP4113822B2 (ja) エッジ露光装置、エッジ露光方法およびそれを備える基板処理装置
JP2024058215A (ja) 位置教示装置および位置教示方法
JP2023510411A (ja) 基板搬送方法および基板搬送装置
JP2018056340A (ja) 基板配列装置および基板配列方法
KR101757817B1 (ko) 기판 반송 방법 및 기판 처리 장치
KR20230173007A (ko) 웨이퍼 센터링 능력이 있는 회전 인덱서들

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220617

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230502

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230621

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231010

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231025

R150 Certificate of patent or registration of utility model

Ref document number: 7374683

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150