JP7369761B2 - 光半導体素子封止用シート - Google Patents

光半導体素子封止用シート Download PDF

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Publication number
JP7369761B2
JP7369761B2 JP2021210769A JP2021210769A JP7369761B2 JP 7369761 B2 JP7369761 B2 JP 7369761B2 JP 2021210769 A JP2021210769 A JP 2021210769A JP 2021210769 A JP2021210769 A JP 2021210769A JP 7369761 B2 JP7369761 B2 JP 7369761B2
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layer
optical semiconductor
sealing
sheet
light
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Japanese (ja)
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JP2023095090A (ja
Inventor
量子 浅井
武史 仲野
秀平 福富
俊平 田中
大樹 植野
尚輝 長束
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2021210769A priority Critical patent/JP7369761B2/ja
Priority to KR1020220180493A priority patent/KR20230098046A/ko
Priority to TW111149527A priority patent/TW202333393A/zh
Priority to CN202211665044.7A priority patent/CN115863522B/zh
Publication of JP2023095090A publication Critical patent/JP2023095090A/ja
Priority to JP2023137996A priority patent/JP7489532B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Sealing Material Composition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021210769A 2021-12-24 2021-12-24 光半導体素子封止用シート Active JP7369761B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021210769A JP7369761B2 (ja) 2021-12-24 2021-12-24 光半導体素子封止用シート
KR1020220180493A KR20230098046A (ko) 2021-12-24 2022-12-21 광반도체 소자 밀봉용 시트
TW111149527A TW202333393A (zh) 2021-12-24 2022-12-22 光半導體元件密封用片材
CN202211665044.7A CN115863522B (zh) 2021-12-24 2022-12-23 光半导体元件密封用片
JP2023137996A JP7489532B2 (ja) 2021-12-24 2023-08-28 光半導体素子封止用シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021210769A JP7369761B2 (ja) 2021-12-24 2021-12-24 光半導体素子封止用シート

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JP2023137996A Division JP7489532B2 (ja) 2021-12-24 2023-08-28 光半導体素子封止用シート

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JP2023095090A JP2023095090A (ja) 2023-07-06
JP7369761B2 true JP7369761B2 (ja) 2023-10-26

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KR (1) KR20230098046A (zh)
CN (1) CN115863522B (zh)
TW (1) TW202333393A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451815B2 (ja) 2021-12-24 2024-03-18 日東電工株式会社 光半導体素子封止用シート
JP7489532B2 (ja) 2021-12-24 2024-05-23 日東電工株式会社 光半導体素子封止用シート

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JP2003315154A (ja) 2002-04-26 2003-11-06 Minolta Co Ltd 色彩計測方法および装置
US20090267107A1 (en) 2006-12-19 2009-10-29 Sven Weber-Rabsilber Optoelectronic Semiconductor Component
US20110199788A1 (en) 2010-01-18 2011-08-18 Park Joo Hyang Lighting unit and display device having the same
JP2013077811A (ja) 2011-09-14 2013-04-25 Nitto Denko Corp 封止シート、その製造方法、発光ダイオード装置およびその製造方法
JP2018041638A (ja) 2016-09-08 2018-03-15 日東電工株式会社 光半導体素子被覆用シート
JP2018041860A (ja) 2016-09-08 2018-03-15 日東電工株式会社 波長変換シート、シート被覆素子および光半導体装置
CN109254451A (zh) 2018-10-19 2019-01-22 住华科技股份有限公司 背光模块及应用其的面板及其制造方法
WO2019017072A1 (ja) 2017-07-21 2019-01-24 Ａｇｃ株式会社 表示装置用の前面板
US20190155095A1 (en) 2017-11-22 2019-05-23 Shenzhen China Star Optoelectronics Technology Co. Ltd. Color film substrate and method for manufacturing the same, and liquid crystal display panel
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JP2021038365A (ja) 2019-09-05 2021-03-11 リンテック株式会社 粘着シートおよび光学積層体
WO2021118835A1 (en) 2019-12-12 2021-06-17 Corning Incorporated Display devices and articles with color-matched display and non-display areas
WO2021193723A1 (ja) 2020-03-24 2021-09-30 日東電工株式会社 層間シート、剥離ライナー付き層間シートおよび光学積層体
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WO2021193719A1 (ja) 2020-03-24 2021-09-30 日東電工株式会社 粘着剤組成物、粘着剤および粘着シート
JP2021161264A (ja) 2020-03-31 2021-10-11 日東電工株式会社 光学積層体
JP2021161262A (ja) 2020-03-31 2021-10-11 日東電工株式会社 光学用粘着剤組成物及び光学積層体
JP2021161263A (ja) 2020-03-31 2021-10-11 日東電工株式会社 光学積層体
JP2021160242A (ja) 2020-03-31 2021-10-11 日東電工株式会社 光学積層体
JP2021163963A (ja) 2020-03-30 2021-10-11 日東電工株式会社 光半導体素子封止用シート
JP7208435B1 (ja) 2021-08-06 2023-01-18 日東電工株式会社 光半導体素子封止用シート
JP2023095089A (ja) 2021-12-24 2023-07-06 日東電工株式会社 光半導体素子封止用シート

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JP2018041638A (ja) 2016-09-08 2018-03-15 日東電工株式会社 光半導体素子被覆用シート
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451815B2 (ja) 2021-12-24 2024-03-18 日東電工株式会社 光半導体素子封止用シート
JP7489532B2 (ja) 2021-12-24 2024-05-23 日東電工株式会社 光半導体素子封止用シート

Also Published As

Publication number Publication date
JP7489532B2 (ja) 2024-05-23
JP2023095090A (ja) 2023-07-06
TW202333393A (zh) 2023-08-16
JP2023164766A (ja) 2023-11-13
KR20230098046A (ko) 2023-07-03
CN115863522B (zh) 2023-11-03
CN115863522A (zh) 2023-03-28

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