JP7355487B2 - カチオン性粒子含有スラリー及びスピンオン炭素膜のcmpのためのその使用方法 - Google Patents
カチオン性粒子含有スラリー及びスピンオン炭素膜のcmpのためのその使用方法 Download PDFInfo
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- JP7355487B2 JP7355487B2 JP2018051445A JP2018051445A JP7355487B2 JP 7355487 B2 JP7355487 B2 JP 7355487B2 JP 2018051445 A JP2018051445 A JP 2018051445A JP 2018051445 A JP2018051445 A JP 2018051445A JP 7355487 B2 JP7355487 B2 JP 7355487B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
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- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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Description
試験した基材は、その上に付着されたTEOS(二酸化ケイ素)層を有する、又は350℃/60秒でベークされたOPTL(商標)タイプ架橋ポリ(アリーレンエーテル)(Dow)の厚さ5000ÅのSOC層をスピンコートされた、直径200mmのベアシリコンウェーハであった。SOC膜を15秒間研磨した。1試行あたり、コーティング又は付着層の各種を有する一つのウェーハを試験した。結果を以下の表3に示す。
スラリーA/ラウリル硫酸アンモニウムスラリーのCMP研磨組成物。研磨した基材は、TEOS又はSiNをその上に付着された直径200mmベアシリコンウェーハ又は80%ノボラック/20%MMA SOC膜をスピンコートされ、240℃/60秒ベークされた直径200mmベアシリコンウェーハであった。SOC有機ポリマー膜を、スラリーAだけで60秒間研磨し、スラリーA/ラウリル硫酸アンモニウムで30秒間研磨した。1試行あたり一つのウェーハを試験した。
Claims (4)
- 半導体ウェーハ又は基材上に有機ポリマー液をスピンコートして、スピンコーティングを形成する工程;
70~375℃の範囲の温度で少なくとも部分的にスピンコーティングを硬化させて、有機ポリマー膜を形成する工程;及び
研磨パッド及び水性CMP研磨組成物によって前記有機ポリマー膜をケミカルメカニカルポリッシング(CMP研磨)する工程
を含む方法であって、
前記有機ポリマー膜の有機ポリマーが、ポリアリーレン類、ポリアリーレンエーテル類、架橋ポリアリーレン類、架橋ポリアリーレンエーテル類、又はノボラック類から選択される有機ポリマーであり、
前記水性CMP研磨組成物が、
全CMP研磨組成物固形分に基づいて0.1~4重量%の、細長い、曲がった、又は、こぶのあるシリカ粒子の砥粒であって、前記シリカ粒子の少なくとも一つの中に一つ以上のカチオン性窒素又はリン原子を含有する砥粒、
全CMP研磨組成物固形分に基づいて0.01~0.1重量%の硫酸基含有界面活性剤であって、C8~C18アルキルもしくはアルケニル基をさらに有する硫酸基含有界面活性剤、及び
pH調節剤を含み、
前記水性CMP研磨組成物が、1.5~4.5の範囲のpHを有し、ここで、前記pHが、前記シリカ粒子の等電点(IEP)未満であり、
前記CMP研磨組成物が実質的に酸化剤を含まず、ここで、前記酸化剤の濃度が50ppm以下である、方法。 - 前記有機ポリマー膜が、リソグラフィー用途に使用されるスピンオンカーボンコーティング(SOC)であり、
方法がさらに、
(a)前記研磨された有機ポリマー膜を、マスクを通して活性化放射線に露光する工程;及び
(b)前記有機ポリマー膜を、現像剤と接触させてリソグラフィーパターンを形成する工程を含み、
前記CMP研磨が(a)露光の前又は後のいずれかで実施される、請求項1記載の方法。 - 前記半導体ウェーハ又は基材がさらに、無機酸化物;無機酸化物と導電層;無機酸化物と絶縁体;又は無機酸化物と絶縁体と導電層を含む、請求項1記載の方法。
- 前記有機ポリマー膜が、無機酸化物及び/又は導電層を含む電子パッケージング基材上にスピンコートされているスピンオン絶縁体(SOD)である、請求項1記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/472,976 US10037889B1 (en) | 2017-03-29 | 2017-03-29 | Cationic particle containing slurries and methods of using them for CMP of spin-on carbon films |
US15/472,976 | 2017-03-29 |
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JP2018170505A JP2018170505A (ja) | 2018-11-01 |
JP7355487B2 true JP7355487B2 (ja) | 2023-10-03 |
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JP2018051445A Active JP7355487B2 (ja) | 2017-03-29 | 2018-03-19 | カチオン性粒子含有スラリー及びスピンオン炭素膜のcmpのためのその使用方法 |
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US (1) | US10037889B1 (ja) |
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US10968366B2 (en) * | 2018-12-04 | 2021-04-06 | Cmc Materials, Inc. | Composition and method for metal CMP |
US11712777B2 (en) * | 2019-06-10 | 2023-08-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cationic fluoropolymer composite polishing pad |
CN111808533A (zh) * | 2020-07-19 | 2020-10-23 | 湖州飞鹿新能源科技有限公司 | 一种Topcon电池专用晶体硅抛光凝胶及其使用方法 |
WO2023171290A1 (ja) * | 2022-03-08 | 2023-09-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
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US10037889B1 (en) | 2018-07-31 |
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