JP7344047B2 - 基板の位置合わせ方法 - Google Patents

基板の位置合わせ方法 Download PDF

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Publication number
JP7344047B2
JP7344047B2 JP2019152239A JP2019152239A JP7344047B2 JP 7344047 B2 JP7344047 B2 JP 7344047B2 JP 2019152239 A JP2019152239 A JP 2019152239A JP 2019152239 A JP2019152239 A JP 2019152239A JP 7344047 B2 JP7344047 B2 JP 7344047B2
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JP
Japan
Prior art keywords
substrate
edge
position data
edge position
optical magnification
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JP2019152239A
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English (en)
Japanese (ja)
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JP2021032662A5 (enExample
JP2021032662A (ja
Inventor
剛 古林
徹 結城
樹里 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JEL Corp
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JEL Corp
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Publication date
Priority to JP2019152239A priority Critical patent/JP7344047B2/ja
Application filed by JEL Corp filed Critical JEL Corp
Priority to US17/636,764 priority patent/US12487082B2/en
Priority to PCT/JP2020/019236 priority patent/WO2021033377A1/ja
Priority to CN202080058556.XA priority patent/CN114258474B/zh
Priority to KR1020227007495A priority patent/KR102717443B1/ko
Priority to TW109117818A priority patent/TWI758737B/zh
Publication of JP2021032662A publication Critical patent/JP2021032662A/ja
Publication of JP2021032662A5 publication Critical patent/JP2021032662A5/ja
Application granted granted Critical
Publication of JP7344047B2 publication Critical patent/JP7344047B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2019152239A 2019-08-22 2019-08-22 基板の位置合わせ方法 Active JP7344047B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法
PCT/JP2020/019236 WO2021033377A1 (ja) 2019-08-22 2020-05-14 基板の位置合わせ方法
CN202080058556.XA CN114258474B (zh) 2019-08-22 2020-05-14 基板的位置对准方法
KR1020227007495A KR102717443B1 (ko) 2019-08-22 2020-05-14 기판의 위치 맞춤 방법
US17/636,764 US12487082B2 (en) 2019-08-22 2020-05-14 Method for positioning substrate
TW109117818A TWI758737B (zh) 2019-08-22 2020-05-28 基板之對準方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法

Publications (3)

Publication Number Publication Date
JP2021032662A JP2021032662A (ja) 2021-03-01
JP2021032662A5 JP2021032662A5 (enExample) 2022-08-16
JP7344047B2 true JP7344047B2 (ja) 2023-09-13

Family

ID=74661037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019152239A Active JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法

Country Status (6)

Country Link
US (1) US12487082B2 (enExample)
JP (1) JP7344047B2 (enExample)
KR (1) KR102717443B1 (enExample)
CN (1) CN114258474B (enExample)
TW (1) TWI758737B (enExample)
WO (1) WO2021033377A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025084133A1 (ja) * 2023-10-17 2025-04-24 シンフォニアテクノロジー株式会社 アライナ及び基板処理システム
WO2025085391A1 (en) * 2023-10-18 2025-04-24 Gpd Optoelectronics Corp. Optical detector system having a ring photodetector and an annular beam lens design
WO2025126960A1 (ja) * 2023-12-11 2025-06-19 株式会社東京精密 形状測定装置及び形状測定方法並びにウェーハ加工システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003185419A (ja) 2001-12-20 2003-07-03 Sumitomo Metal Ind Ltd 反り形状計測方法及び装置
JP2008196855A (ja) 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置
JP2008203182A (ja) 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
US20170329241A1 (en) 2016-05-11 2017-11-16 Semiconductor Manufacturing International (Shanghai) Corporation Alignment method and alignment system thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634487B2 (ja) * 1996-02-09 2005-03-30 キヤノン株式会社 位置合せ方法、位置合せ装置、および露光装置
JP4615114B2 (ja) * 2000-11-13 2011-01-19 株式会社ダイヘン ウェハアライナ装置
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
WO2006066207A2 (en) * 2004-12-19 2006-06-22 Ade Corporation System and method for inspecting a workpiece surface using combinations of light collectors
JP4309874B2 (ja) * 2005-08-05 2009-08-05 株式会社ブイ・テクノロジー 露光装置
CN101021489A (zh) * 2006-02-15 2007-08-22 奥林巴斯株式会社 外观检查装置
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
JP4787185B2 (ja) * 2007-02-21 2011-10-05 株式会社トプコン ウエハ表面検査方法及びその装置
WO2012029142A1 (ja) 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
CN107742613B (zh) * 2012-04-25 2021-03-09 应用材料公司 晶片边缘的测量和控制
JP6394220B2 (ja) 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
US10056224B2 (en) * 2015-08-10 2018-08-21 Kla-Tencor Corporation Method and system for edge-of-wafer inspection and review
NL2017860B1 (en) * 2015-12-07 2017-07-27 Ultratech Inc Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry
WO2017170393A1 (ja) * 2016-03-28 2017-10-05 株式会社東京精密 プローバ及びプローバの操作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003185419A (ja) 2001-12-20 2003-07-03 Sumitomo Metal Ind Ltd 反り形状計測方法及び装置
JP2008196855A (ja) 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置
JP2008203182A (ja) 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
US20170329241A1 (en) 2016-05-11 2017-11-16 Semiconductor Manufacturing International (Shanghai) Corporation Alignment method and alignment system thereof

Also Published As

Publication number Publication date
US12487082B2 (en) 2025-12-02
WO2021033377A1 (ja) 2021-02-25
CN114258474B (zh) 2024-08-09
KR102717443B1 (ko) 2024-10-15
US20220299317A1 (en) 2022-09-22
CN114258474A (zh) 2022-03-29
KR20220073733A (ko) 2022-06-03
TW202109724A (zh) 2021-03-01
JP2021032662A (ja) 2021-03-01
TWI758737B (zh) 2022-03-21

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