CN114258474B - 基板的位置对准方法 - Google Patents

基板的位置对准方法 Download PDF

Info

Publication number
CN114258474B
CN114258474B CN202080058556.XA CN202080058556A CN114258474B CN 114258474 B CN114258474 B CN 114258474B CN 202080058556 A CN202080058556 A CN 202080058556A CN 114258474 B CN114258474 B CN 114258474B
Authority
CN
China
Prior art keywords
substrate
edge
stage
position data
warpage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080058556.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN114258474A (zh
Inventor
古林刚
结城彻
平田树里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JEL Corp
Original Assignee
JEL Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JEL Corp filed Critical JEL Corp
Publication of CN114258474A publication Critical patent/CN114258474A/zh
Application granted granted Critical
Publication of CN114258474B publication Critical patent/CN114258474B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN202080058556.XA 2019-08-22 2020-05-14 基板的位置对准方法 Active CN114258474B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法
JP2019-152239 2019-08-22
PCT/JP2020/019236 WO2021033377A1 (ja) 2019-08-22 2020-05-14 基板の位置合わせ方法

Publications (2)

Publication Number Publication Date
CN114258474A CN114258474A (zh) 2022-03-29
CN114258474B true CN114258474B (zh) 2024-08-09

Family

ID=74661037

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080058556.XA Active CN114258474B (zh) 2019-08-22 2020-05-14 基板的位置对准方法

Country Status (6)

Country Link
US (1) US12487082B2 (enExample)
JP (1) JP7344047B2 (enExample)
KR (1) KR102717443B1 (enExample)
CN (1) CN114258474B (enExample)
TW (1) TWI758737B (enExample)
WO (1) WO2021033377A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025084133A1 (ja) * 2023-10-17 2025-04-24 シンフォニアテクノロジー株式会社 アライナ及び基板処理システム
WO2025085391A1 (en) * 2023-10-18 2025-04-24 Gpd Optoelectronics Corp. Optical detector system having a ring photodetector and an annular beam lens design
WO2025126960A1 (ja) * 2023-12-11 2025-06-19 株式会社東京精密 形状測定装置及び形状測定方法並びにウェーハ加工システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008196855A (ja) * 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634487B2 (ja) * 1996-02-09 2005-03-30 キヤノン株式会社 位置合せ方法、位置合せ装置、および露光装置
JP4615114B2 (ja) * 2000-11-13 2011-01-19 株式会社ダイヘン ウェハアライナ装置
JP3724720B2 (ja) 2001-12-20 2005-12-07 住友金属工業株式会社 反り形状計測方法及び装置
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
WO2006066207A2 (en) * 2004-12-19 2006-06-22 Ade Corporation System and method for inspecting a workpiece surface using combinations of light collectors
JP4309874B2 (ja) * 2005-08-05 2009-08-05 株式会社ブイ・テクノロジー 露光装置
CN101021489A (zh) * 2006-02-15 2007-08-22 奥林巴斯株式会社 外观检查装置
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
JP4787185B2 (ja) * 2007-02-21 2011-10-05 株式会社トプコン ウエハ表面検査方法及びその装置
JP2008203182A (ja) 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
WO2012029142A1 (ja) 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
CN107742613B (zh) * 2012-04-25 2021-03-09 应用材料公司 晶片边缘的测量和控制
JP6394220B2 (ja) 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
US10056224B2 (en) * 2015-08-10 2018-08-21 Kla-Tencor Corporation Method and system for edge-of-wafer inspection and review
NL2017860B1 (en) * 2015-12-07 2017-07-27 Ultratech Inc Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry
WO2017170393A1 (ja) * 2016-03-28 2017-10-05 株式会社東京精密 プローバ及びプローバの操作方法
CN107367911B (zh) 2016-05-11 2019-02-15 中芯国际集成电路制造(上海)有限公司 对准方法及对准系统

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008196855A (ja) * 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置

Also Published As

Publication number Publication date
US12487082B2 (en) 2025-12-02
WO2021033377A1 (ja) 2021-02-25
KR102717443B1 (ko) 2024-10-15
US20220299317A1 (en) 2022-09-22
JP7344047B2 (ja) 2023-09-13
CN114258474A (zh) 2022-03-29
KR20220073733A (ko) 2022-06-03
TW202109724A (zh) 2021-03-01
JP2021032662A (ja) 2021-03-01
TWI758737B (zh) 2022-03-21

Similar Documents

Publication Publication Date Title
CN105345254B (zh) 旁轴式视觉系统与激光振镜加工系统位置关系的标定方法
CN114258474B (zh) 基板的位置对准方法
CN103348376B (zh) 图像处理装置
CN108700409B (zh) 三维测量装置
CN107025670A (zh) 一种远心相机标定方法
CN110296667A (zh) 基于线结构光多角度投影的高反射表面三维测量方法
TW201523760A (zh) 工件處理裝置、工件輸送系統
US8810799B2 (en) Height-measuring method and height-measuring device
CN103399015A (zh) 病理切片扫描仪及其载片平台定位精度测量方法及装置
CN110044262B (zh) 基于图像超分辨率重建的非接触式精密测量仪及测量方法
CN104034259B (zh) 一种影像测量仪校正方法
CN109493418A (zh) 一种基于LabVIEW的三维点云获取方法
JP2007071769A (ja) モアレ縞を用いたずれ、パタ−ンの回転、ゆがみ、位置ずれ検出方法
JP2010281778A (ja) 三次元形状計測装置
WO2024174944A1 (zh) 一种用于大尺寸晶圆的厚度和弯曲度的检测系统和方法
WO2021135044A1 (zh) 一种缺陷检查的装置和方法
TW201929116A (zh) 工件處理裝置、工件輸送系統
TWI638239B (zh) 位置偏移檢測方法、位置偏移檢測裝置、描繪裝置及基板檢查裝置
CN108317958A (zh) 一种图像测量方法及测量仪
CN113109259B (zh) 一种图像的智能导航方法及装置
JP2009079915A (ja) 微小寸法測定方法および測定装置
CN110702001A (zh) 非接触式光学测量方法与系统
CN112132905B (zh) 一种对位相机与光学装置之间位置关系的确定方法及系统
JP4003274B2 (ja) 距離測定装置
JP4760072B2 (ja) Ｘ線検査装置及びｘ線検査方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant