TWI758737B - 基板之對準方法 - Google Patents

基板之對準方法 Download PDF

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Publication number
TWI758737B
TWI758737B TW109117818A TW109117818A TWI758737B TW I758737 B TWI758737 B TW I758737B TW 109117818 A TW109117818 A TW 109117818A TW 109117818 A TW109117818 A TW 109117818A TW I758737 B TWI758737 B TW I758737B
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TW
Taiwan
Prior art keywords
substrate
edge
position data
ratio
optical magnification
Prior art date
Application number
TW109117818A
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English (en)
Chinese (zh)
Other versions
TW202109724A (zh
Inventor
古林剛
結城徹
平田樹里
Original Assignee
日商Ｊｅｌ股份有限公司
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Publication of TW202109724A publication Critical patent/TW202109724A/zh
Application granted granted Critical
Publication of TWI758737B publication Critical patent/TWI758737B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW109117818A 2019-08-22 2020-05-28 基板之對準方法 TWI758737B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-152239 2019-08-22
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法

Publications (2)

Publication Number Publication Date
TW202109724A TW202109724A (zh) 2021-03-01
TWI758737B true TWI758737B (zh) 2022-03-21

Family

ID=74661037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109117818A TWI758737B (zh) 2019-08-22 2020-05-28 基板之對準方法

Country Status (6)

Country Link
US (1) US12487082B2 (enExample)
JP (1) JP7344047B2 (enExample)
KR (1) KR102717443B1 (enExample)
CN (1) CN114258474B (enExample)
TW (1) TWI758737B (enExample)
WO (1) WO2021033377A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025084133A1 (ja) * 2023-10-17 2025-04-24 シンフォニアテクノロジー株式会社 アライナ及び基板処理システム
WO2025085391A1 (en) * 2023-10-18 2025-04-24 Gpd Optoelectronics Corp. Optical detector system having a ring photodetector and an annular beam lens design
WO2025126960A1 (ja) * 2023-12-11 2025-06-19 株式会社東京精密 形状測定装置及び形状測定方法並びにウェーハ加工システム

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150042987A1 (en) * 2004-12-19 2015-02-12 Kla-Tencor Corporation Front Quartersphere Scattered Light Analysis
TW201715225A (zh) * 2015-08-10 2017-05-01 克萊譚克公司 用於晶圓邊緣檢測及查核之方法及系統
TW201723421A (zh) * 2015-12-07 2017-07-01 精微超科技公司 用於使用cgs干涉儀進行處理控制的特徵化處理誘導晶圓形狀之系統及方法
US20170329241A1 (en) * 2016-05-11 2017-11-16 Semiconductor Manufacturing International (Shanghai) Corporation Alignment method and alignment system thereof
US20180033667A1 (en) * 2012-04-25 2018-02-01 Applied Materials, Inc. Wafer edge measurement and control

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634487B2 (ja) 1996-02-09 2005-03-30 キヤノン株式会社 位置合せ方法、位置合せ装置、および露光装置
JP4615114B2 (ja) * 2000-11-13 2011-01-19 株式会社ダイヘン ウェハアライナ装置
JP3724720B2 (ja) 2001-12-20 2005-12-07 住友金属工業株式会社 反り形状計測方法及び装置
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
JP4309874B2 (ja) 2005-08-05 2009-08-05 株式会社ブイ・テクノロジー 露光装置
CN101021489A (zh) * 2006-02-15 2007-08-22 奥林巴斯株式会社 外观检查装置
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
JP4853968B2 (ja) 2007-02-08 2012-01-11 株式会社山武 ウェハの位置決め方法および位置決め装置
JP4787185B2 (ja) * 2007-02-21 2011-10-05 株式会社トプコン ウエハ表面検査方法及びその装置
JP2008203182A (ja) 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
KR101435352B1 (ko) 2010-09-01 2014-08-28 미쓰비시덴키 가부시키가이샤 레이저 가공장치 및 기판위치 검출방법
JP6394220B2 (ja) 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
WO2017170393A1 (ja) * 2016-03-28 2017-10-05 株式会社東京精密 プローバ及びプローバの操作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150042987A1 (en) * 2004-12-19 2015-02-12 Kla-Tencor Corporation Front Quartersphere Scattered Light Analysis
US20180033667A1 (en) * 2012-04-25 2018-02-01 Applied Materials, Inc. Wafer edge measurement and control
TW201715225A (zh) * 2015-08-10 2017-05-01 克萊譚克公司 用於晶圓邊緣檢測及查核之方法及系統
TW201723421A (zh) * 2015-12-07 2017-07-01 精微超科技公司 用於使用cgs干涉儀進行處理控制的特徵化處理誘導晶圓形狀之系統及方法
US20170329241A1 (en) * 2016-05-11 2017-11-16 Semiconductor Manufacturing International (Shanghai) Corporation Alignment method and alignment system thereof

Also Published As

Publication number Publication date
KR102717443B1 (ko) 2024-10-15
CN114258474B (zh) 2024-08-09
CN114258474A (zh) 2022-03-29
JP2021032662A (ja) 2021-03-01
JP7344047B2 (ja) 2023-09-13
WO2021033377A1 (ja) 2021-02-25
KR20220073733A (ko) 2022-06-03
US12487082B2 (en) 2025-12-02
US20220299317A1 (en) 2022-09-22
TW202109724A (zh) 2021-03-01

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