JP2021032662A5 - - Google Patents
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- JP2021032662A5 JP2021032662A5 JP2019152239A JP2019152239A JP2021032662A5 JP 2021032662 A5 JP2021032662 A5 JP 2021032662A5 JP 2019152239 A JP2019152239 A JP 2019152239A JP 2019152239 A JP2019152239 A JP 2019152239A JP 2021032662 A5 JP2021032662 A5 JP 2021032662A5
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- JP
- Japan
- Prior art keywords
- reference mark
- angle
- calculating
- center position
- substrate center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019152239A JP7344047B2 (ja) | 2019-08-22 | 2019-08-22 | 基板の位置合わせ方法 |
| PCT/JP2020/019236 WO2021033377A1 (ja) | 2019-08-22 | 2020-05-14 | 基板の位置合わせ方法 |
| CN202080058556.XA CN114258474B (zh) | 2019-08-22 | 2020-05-14 | 基板的位置对准方法 |
| KR1020227007495A KR102717443B1 (ko) | 2019-08-22 | 2020-05-14 | 기판의 위치 맞춤 방법 |
| US17/636,764 US12487082B2 (en) | 2019-08-22 | 2020-05-14 | Method for positioning substrate |
| TW109117818A TWI758737B (zh) | 2019-08-22 | 2020-05-28 | 基板之對準方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019152239A JP7344047B2 (ja) | 2019-08-22 | 2019-08-22 | 基板の位置合わせ方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021032662A JP2021032662A (ja) | 2021-03-01 |
| JP2021032662A5 true JP2021032662A5 (enExample) | 2022-08-16 |
| JP7344047B2 JP7344047B2 (ja) | 2023-09-13 |
Family
ID=74661037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019152239A Active JP7344047B2 (ja) | 2019-08-22 | 2019-08-22 | 基板の位置合わせ方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12487082B2 (enExample) |
| JP (1) | JP7344047B2 (enExample) |
| KR (1) | KR102717443B1 (enExample) |
| CN (1) | CN114258474B (enExample) |
| TW (1) | TWI758737B (enExample) |
| WO (1) | WO2021033377A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025084133A1 (ja) * | 2023-10-17 | 2025-04-24 | シンフォニアテクノロジー株式会社 | アライナ及び基板処理システム |
| WO2025085391A1 (en) * | 2023-10-18 | 2025-04-24 | Gpd Optoelectronics Corp. | Optical detector system having a ring photodetector and an annular beam lens design |
| WO2025126960A1 (ja) * | 2023-12-11 | 2025-06-19 | 株式会社東京精密 | 形状測定装置及び形状測定方法並びにウェーハ加工システム |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3634487B2 (ja) * | 1996-02-09 | 2005-03-30 | キヤノン株式会社 | 位置合せ方法、位置合せ装置、および露光装置 |
| JP4615114B2 (ja) * | 2000-11-13 | 2011-01-19 | 株式会社ダイヘン | ウェハアライナ装置 |
| JP3724720B2 (ja) | 2001-12-20 | 2005-12-07 | 住友金属工業株式会社 | 反り形状計測方法及び装置 |
| US20070258085A1 (en) * | 2006-05-02 | 2007-11-08 | Robbins Michael D | Substrate illumination and inspection system |
| WO2006066207A2 (en) * | 2004-12-19 | 2006-06-22 | Ade Corporation | System and method for inspecting a workpiece surface using combinations of light collectors |
| JP4309874B2 (ja) * | 2005-08-05 | 2009-08-05 | 株式会社ブイ・テクノロジー | 露光装置 |
| CN101021489A (zh) * | 2006-02-15 | 2007-08-22 | 奥林巴斯株式会社 | 外观检查装置 |
| US7508504B2 (en) * | 2006-05-02 | 2009-03-24 | Accretech Usa, Inc. | Automatic wafer edge inspection and review system |
| JP4853968B2 (ja) | 2007-02-08 | 2012-01-11 | 株式会社山武 | ウェハの位置決め方法および位置決め装置 |
| JP4787185B2 (ja) * | 2007-02-21 | 2011-10-05 | 株式会社トプコン | ウエハ表面検査方法及びその装置 |
| JP2008203182A (ja) | 2007-02-22 | 2008-09-04 | Yamatake Corp | エッジ検出装置 |
| WO2012029142A1 (ja) | 2010-09-01 | 2012-03-08 | 三菱電機株式会社 | レーザ加工装置および基板位置検出方法 |
| CN107742613B (zh) * | 2012-04-25 | 2021-03-09 | 应用材料公司 | 晶片边缘的测量和控制 |
| JP6394220B2 (ja) | 2014-09-17 | 2018-09-26 | 東京エレクトロン株式会社 | アライメント装置及び基板処理装置 |
| US10056224B2 (en) * | 2015-08-10 | 2018-08-21 | Kla-Tencor Corporation | Method and system for edge-of-wafer inspection and review |
| NL2017860B1 (en) * | 2015-12-07 | 2017-07-27 | Ultratech Inc | Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry |
| WO2017170393A1 (ja) * | 2016-03-28 | 2017-10-05 | 株式会社東京精密 | プローバ及びプローバの操作方法 |
| CN107367911B (zh) | 2016-05-11 | 2019-02-15 | 中芯国际集成电路制造(上海)有限公司 | 对准方法及对准系统 |
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2019
- 2019-08-22 JP JP2019152239A patent/JP7344047B2/ja active Active
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2020
- 2020-05-14 WO PCT/JP2020/019236 patent/WO2021033377A1/ja not_active Ceased
- 2020-05-14 US US17/636,764 patent/US12487082B2/en active Active
- 2020-05-14 CN CN202080058556.XA patent/CN114258474B/zh active Active
- 2020-05-14 KR KR1020227007495A patent/KR102717443B1/ko active Active
- 2020-05-28 TW TW109117818A patent/TWI758737B/zh active