JP7326003B2 - 液体供給装置、洗浄ユニット、基板処理装置 - Google Patents

液体供給装置、洗浄ユニット、基板処理装置 Download PDF

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Publication number
JP7326003B2
JP7326003B2 JP2019074141A JP2019074141A JP7326003B2 JP 7326003 B2 JP7326003 B2 JP 7326003B2 JP 2019074141 A JP2019074141 A JP 2019074141A JP 2019074141 A JP2019074141 A JP 2019074141A JP 7326003 B2 JP7326003 B2 JP 7326003B2
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Japan
Prior art keywords
valve
control device
pure water
liquid
chemical
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Active
Application number
JP2019074141A
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English (en)
Japanese (ja)
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JP2020174086A (ja
JP2020174086A5 (cg-RX-API-DMAC7.html
Inventor
富士彦 豊増
淳次 國澤
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Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2019074141A priority Critical patent/JP7326003B2/ja
Priority to KR1020217026608A priority patent/KR102784538B1/ko
Priority to PCT/JP2020/013257 priority patent/WO2020209064A1/ja
Priority to US17/599,324 priority patent/US12140980B2/en
Publication of JP2020174086A publication Critical patent/JP2020174086A/ja
Publication of JP2020174086A5 publication Critical patent/JP2020174086A5/ja
Application granted granted Critical
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0623—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the set value given to the control element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • B08B9/0325—Control mechanisms therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00—Control of flow ratio
    • G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/131—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
    • G05D11/132—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G05D7/0652—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged in parallel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2019074141A 2019-04-09 2019-04-09 液体供給装置、洗浄ユニット、基板処理装置 Active JP7326003B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019074141A JP7326003B2 (ja) 2019-04-09 2019-04-09 液体供給装置、洗浄ユニット、基板処理装置
KR1020217026608A KR102784538B1 (ko) 2019-04-09 2020-03-25 액체 공급 장치, 세정 유닛, 기판 처리 장치
PCT/JP2020/013257 WO2020209064A1 (ja) 2019-04-09 2020-03-25 液体供給装置、洗浄ユニット、基板処理装置
US17/599,324 US12140980B2 (en) 2019-04-09 2020-03-25 Apparatus for supplying liquid, cleaning unit, and apparatus for processing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019074141A JP7326003B2 (ja) 2019-04-09 2019-04-09 液体供給装置、洗浄ユニット、基板処理装置

Publications (3)

Publication Number Publication Date
JP2020174086A JP2020174086A (ja) 2020-10-22
JP2020174086A5 JP2020174086A5 (cg-RX-API-DMAC7.html) 2022-01-06
JP7326003B2 true JP7326003B2 (ja) 2023-08-15

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JP2019074141A Active JP7326003B2 (ja) 2019-04-09 2019-04-09 液体供給装置、洗浄ユニット、基板処理装置

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Country Link
US (1) US12140980B2 (cg-RX-API-DMAC7.html)
JP (1) JP7326003B2 (cg-RX-API-DMAC7.html)
KR (1) KR102784538B1 (cg-RX-API-DMAC7.html)
WO (1) WO2020209064A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7509657B2 (ja) * 2020-10-29 2024-07-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
AT526426B1 (de) * 2023-01-26 2024-03-15 Siconnex Customized Solutions Gmbh Behandlungsvorrichtung und Verfahren zur Behandlung von Halbleiterobjekten
JP2025003021A (ja) * 2023-06-23 2025-01-09 サーパス工業株式会社 流量調整装置および流量調整装置の制御方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001271188A (ja) 2000-03-24 2001-10-02 Ses Co Ltd 基板処理装置
JP2004193329A (ja) 2002-12-11 2004-07-08 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2005302571A (ja) 2004-04-13 2005-10-27 Toyota Motor Corp 燃料電池の制御装置
JP2010147212A (ja) 2008-12-18 2010-07-01 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2012222237A (ja) 2011-04-12 2012-11-12 Tokyo Electron Ltd 液処理方法及び液処理装置
JP2016009818A (ja) 2014-06-26 2016-01-18 株式会社荏原製作所 洗浄ユニット
JP2016015469A (ja) 2014-06-09 2016-01-28 株式会社荏原製作所 洗浄薬液供給装置、洗浄薬液供給方法、及び洗浄ユニット
JP2017177303A (ja) 2016-03-31 2017-10-05 株式会社荏原製作所 基板研磨装置、その洗浄方法および基板研磨装置への液体供給装置
JP2018098452A (ja) 2016-12-16 2018-06-21 株式会社荏原製作所 洗浄薬液供給装置、洗浄ユニット、及びプログラムを格納した記憶媒体
JP2018181883A (ja) 2017-04-03 2018-11-15 株式会社荏原製作所 液体供給装置及び液体供給方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11627A (ja) 1997-06-13 1999-01-06 Urutora Clean Technol Kaihatsu Kenkyusho:Kk 洗浄液供給系及び供給方法
JP6059087B2 (ja) * 2013-05-31 2017-01-11 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
US10340159B2 (en) 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
JP6669560B2 (ja) 2016-03-30 2020-03-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102433049B1 (ko) 2016-12-16 2022-08-17 가부시키가이샤 에바라 세이사꾸쇼 세정 유닛 및 프로그램을 저장한 기억 매체
JP6925872B2 (ja) * 2017-05-31 2021-08-25 東京エレクトロン株式会社 基板液処理装置、処理液供給方法及び記憶媒体

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001271188A (ja) 2000-03-24 2001-10-02 Ses Co Ltd 基板処理装置
JP2004193329A (ja) 2002-12-11 2004-07-08 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2005302571A (ja) 2004-04-13 2005-10-27 Toyota Motor Corp 燃料電池の制御装置
JP2010147212A (ja) 2008-12-18 2010-07-01 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2012222237A (ja) 2011-04-12 2012-11-12 Tokyo Electron Ltd 液処理方法及び液処理装置
JP2016015469A (ja) 2014-06-09 2016-01-28 株式会社荏原製作所 洗浄薬液供給装置、洗浄薬液供給方法、及び洗浄ユニット
JP2016009818A (ja) 2014-06-26 2016-01-18 株式会社荏原製作所 洗浄ユニット
JP2017177303A (ja) 2016-03-31 2017-10-05 株式会社荏原製作所 基板研磨装置、その洗浄方法および基板研磨装置への液体供給装置
JP2018098452A (ja) 2016-12-16 2018-06-21 株式会社荏原製作所 洗浄薬液供給装置、洗浄ユニット、及びプログラムを格納した記憶媒体
JP2018181883A (ja) 2017-04-03 2018-11-15 株式会社荏原製作所 液体供給装置及び液体供給方法

Also Published As

Publication number Publication date
KR20210146286A (ko) 2021-12-03
JP2020174086A (ja) 2020-10-22
WO2020209064A1 (ja) 2020-10-15
US20220187856A1 (en) 2022-06-16
US12140980B2 (en) 2024-11-12
KR102784538B1 (ko) 2025-03-21

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