JP7323508B2 - ディスプレイ装置、ディスプレイ装置用基板およびディスプレイ装置の修理方法 - Google Patents

ディスプレイ装置、ディスプレイ装置用基板およびディスプレイ装置の修理方法 Download PDF

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JP7323508B2
JP7323508B2 JP2020505413A JP2020505413A JP7323508B2 JP 7323508 B2 JP7323508 B2 JP 7323508B2 JP 2020505413 A JP2020505413 A JP 2020505413A JP 2020505413 A JP2020505413 A JP 2020505413A JP 7323508 B2 JP7323508 B2 JP 7323508B2
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wiring
mounting
emitting diode
light emitting
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JP2020529630A (ja
JP2020529630A5 (enExample
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ソン シク ホン，
ソン ス ソン，
元伸 竹谷
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Seoul Semiconductor Co Ltd
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Seoul Semiconductor Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2020505413A 2017-08-02 2018-08-01 ディスプレイ装置、ディスプレイ装置用基板およびディスプレイ装置の修理方法 Active JP7323508B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0098212 2017-08-02
KR20170098212 2017-08-02
PCT/KR2018/008732 WO2019027248A1 (ko) 2017-08-02 2018-08-01 디스플레이 장치, 디스플레이 장치용 기판 및 디스플레이 장치의 수리 방법

Publications (3)

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JP2020529630A JP2020529630A (ja) 2020-10-08
JP2020529630A5 JP2020529630A5 (enExample) 2021-09-09
JP7323508B2 true JP7323508B2 (ja) 2023-08-08

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JP2020505413A Active JP7323508B2 (ja) 2017-08-02 2018-08-01 ディスプレイ装置、ディスプレイ装置用基板およびディスプレイ装置の修理方法

Country Status (7)

Country Link
US (4) US11063175B2 (enExample)
EP (1) EP3664134A4 (enExample)
JP (1) JP7323508B2 (enExample)
KR (1) KR102581010B1 (enExample)
CN (1) CN110168723B (enExample)
MY (1) MY205321A (enExample)
WO (1) WO2019027248A1 (enExample)

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KR102330553B1 (ko) * 2019-03-27 2021-11-24 엘지전자 주식회사 마이크로 엘이디를 이용한 디스플레이 장치 및 그 제조방법
US11538852B2 (en) * 2019-04-23 2022-12-27 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
KR102719903B1 (ko) * 2019-05-29 2024-10-18 삼성디스플레이 주식회사 표시 장치
KR102766414B1 (ko) * 2019-08-09 2025-02-13 삼성전자주식회사 디스플레이 장치 및 그 제조방법
KR102802033B1 (ko) * 2019-10-15 2025-04-30 삼성전자주식회사 디스플레이 장치의 제조 방법, 중계 기판 및 기록 매체에 저장된 컴퓨터 프로그램
CN112928123B (zh) * 2019-11-21 2024-10-15 京东方科技集团股份有限公司 一种驱动背板及其制作方法、显示面板、显示装置
KR102880048B1 (ko) * 2020-11-30 2025-11-03 삼성전자주식회사 디스플레이 모듈 및 그 제조 방법
TWI807544B (zh) * 2021-12-17 2023-07-01 友達光電股份有限公司 顯示面板及其製造方法
TWI855473B (zh) * 2022-12-23 2024-09-11 友達光電股份有限公司 發光顯示面板
WO2025003399A1 (en) * 2023-06-29 2025-01-02 Ams-Osram International Gmbh Method of repairing an electronic component and electronic component
TWI881804B (zh) * 2024-04-18 2025-04-21 大陸商北京集創北方科技股份有限公司 一體式led顯示模組及透明led顯示裝置

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JP2001094003A (ja) 1999-09-22 2001-04-06 Nec Corp 半導体装置及びその製造方法
JP2002118209A (ja) 2000-08-01 2002-04-19 Nec Corp 半導体装置の実装方法及び実装構造体
JP2005500672A (ja) 2001-03-28 2005-01-06 インテル・コーポレーション フラックスのないフリップ・チップ相互接続
US20060228878A1 (en) 2005-04-06 2006-10-12 Samsung Electronics Co., Ltd. Semiconductor package repair method
CN105023522A (zh) 2015-06-01 2015-11-04 友达光电股份有限公司 显示面板及其修补方法
US20150371585A1 (en) 2014-06-18 2015-12-24 X-Celeprint Limited Micro assembled led displays and lighting elements
JP2016512347A (ja) 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法

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JPH06120417A (ja) * 1992-10-08 1994-04-28 Sharp Corp マルチチップモジュールの実装構造及びその製造方法
JP3462282B2 (ja) * 1994-11-29 2003-11-05 株式会社東芝 樹脂封止型半導体装置、電子回路装置およびこの製造方法
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KR102203103B1 (ko) * 2014-04-11 2021-01-15 삼성디스플레이 주식회사 유기 발광 표시 패널, 유기 발광 표시 장치 및 유기 발광 표시 패널의 리페어 방법
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Publication number Priority date Publication date Assignee Title
JP2001094003A (ja) 1999-09-22 2001-04-06 Nec Corp 半導体装置及びその製造方法
JP2002118209A (ja) 2000-08-01 2002-04-19 Nec Corp 半導体装置の実装方法及び実装構造体
JP2005500672A (ja) 2001-03-28 2005-01-06 インテル・コーポレーション フラックスのないフリップ・チップ相互接続
US20060228878A1 (en) 2005-04-06 2006-10-12 Samsung Electronics Co., Ltd. Semiconductor package repair method
JP2016512347A (ja) 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
US20150371585A1 (en) 2014-06-18 2015-12-24 X-Celeprint Limited Micro assembled led displays and lighting elements
CN105023522A (zh) 2015-06-01 2015-11-04 友达光电股份有限公司 显示面板及其修补方法

Also Published As

Publication number Publication date
KR20190014480A (ko) 2019-02-12
US11063175B2 (en) 2021-07-13
JP2020529630A (ja) 2020-10-08
US11605755B2 (en) 2023-03-14
US20210328098A1 (en) 2021-10-21
CN110168723A (zh) 2019-08-23
MY205321A (en) 2024-10-12
US20230215971A1 (en) 2023-07-06
EP3664134A1 (en) 2020-06-10
KR102581010B1 (ko) 2023-09-22
US20240088324A1 (en) 2024-03-14
US20210135047A1 (en) 2021-05-06
US11978823B2 (en) 2024-05-07
CN110168723B (zh) 2024-01-30
EP3664134A4 (en) 2021-04-21
WO2019027248A1 (ko) 2019-02-07

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