KR102581010B1 - 디스플레이 장치, 디스플레이 장치용 기판 및 디스플레이 장치의 수리 방법 - Google Patents

디스플레이 장치, 디스플레이 장치용 기판 및 디스플레이 장치의 수리 방법 Download PDF

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KR102581010B1
KR102581010B1 KR1020180089688A KR20180089688A KR102581010B1 KR 102581010 B1 KR102581010 B1 KR 102581010B1 KR 1020180089688 A KR1020180089688 A KR 1020180089688A KR 20180089688 A KR20180089688 A KR 20180089688A KR 102581010 B1 KR102581010 B1 KR 102581010B1
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wiring
mounting
light emitting
emitting diode
unit
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KR20190014480A (ko
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홍승식
손성수
모토노부 타케야
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서울반도체 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H01L33/36—
    • H01L33/48—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020180089688A 2017-08-02 2018-08-01 디스플레이 장치, 디스플레이 장치용 기판 및 디스플레이 장치의 수리 방법 Active KR102581010B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20170098212 2017-08-02
KR1020170098212 2017-08-02

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KR20190014480A KR20190014480A (ko) 2019-02-12
KR102581010B1 true KR102581010B1 (ko) 2023-09-22

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Country Status (7)

Country Link
US (4) US11063175B2 (enExample)
EP (1) EP3664134A4 (enExample)
JP (1) JP7323508B2 (enExample)
KR (1) KR102581010B1 (enExample)
CN (1) CN110168723B (enExample)
MY (1) MY205321A (enExample)
WO (1) WO2019027248A1 (enExample)

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KR102330553B1 (ko) * 2019-03-27 2021-11-24 엘지전자 주식회사 마이크로 엘이디를 이용한 디스플레이 장치 및 그 제조방법
US11538852B2 (en) * 2019-04-23 2022-12-27 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
KR102719903B1 (ko) * 2019-05-29 2024-10-18 삼성디스플레이 주식회사 표시 장치
KR102766414B1 (ko) * 2019-08-09 2025-02-13 삼성전자주식회사 디스플레이 장치 및 그 제조방법
KR102802033B1 (ko) 2019-10-15 2025-04-30 삼성전자주식회사 디스플레이 장치의 제조 방법, 중계 기판 및 기록 매체에 저장된 컴퓨터 프로그램
CN112928123B (zh) * 2019-11-21 2024-10-15 京东方科技集团股份有限公司 一种驱动背板及其制作方法、显示面板、显示装置
KR102880048B1 (ko) * 2020-11-30 2025-11-03 삼성전자주식회사 디스플레이 모듈 및 그 제조 방법
TWI807544B (zh) * 2021-12-17 2023-07-01 友達光電股份有限公司 顯示面板及其製造方法
TWI855473B (zh) * 2022-12-23 2024-09-11 友達光電股份有限公司 發光顯示面板
WO2025003399A1 (en) * 2023-06-29 2025-01-02 Ams-Osram International Gmbh Method of repairing an electronic component and electronic component
TWI881804B (zh) * 2024-04-18 2025-04-21 大陸商北京集創北方科技股份有限公司 一體式led顯示模組及透明led顯示裝置

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JP3462282B2 (ja) * 1994-11-29 2003-11-05 株式会社東芝 樹脂封止型半導体装置、電子回路装置およびこの製造方法
JPH09307225A (ja) * 1996-05-13 1997-11-28 Hitachi Ltd プリント基板
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KR102156774B1 (ko) * 2013-12-30 2020-09-17 엘지디스플레이 주식회사 유기발광 표시장치의 리페어 방법
KR102203103B1 (ko) * 2014-04-11 2021-01-15 삼성디스플레이 주식회사 유기 발광 표시 패널, 유기 발광 표시 장치 및 유기 발광 표시 패널의 리페어 방법
CN113437054B (zh) * 2014-06-18 2025-01-28 艾克斯展示公司技术有限公司 微组装led显示器
TWI557702B (zh) 2015-06-01 2016-11-11 友達光電股份有限公司 顯示面板及其修補方法
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Publication number Publication date
US11978823B2 (en) 2024-05-07
JP7323508B2 (ja) 2023-08-08
US20210328098A1 (en) 2021-10-21
US11605755B2 (en) 2023-03-14
KR20190014480A (ko) 2019-02-12
WO2019027248A1 (ko) 2019-02-07
US20210135047A1 (en) 2021-05-06
EP3664134A4 (en) 2021-04-21
EP3664134A1 (en) 2020-06-10
US20230215971A1 (en) 2023-07-06
MY205321A (en) 2024-10-12
CN110168723B (zh) 2024-01-30
US11063175B2 (en) 2021-07-13
CN110168723A (zh) 2019-08-23
US20240088324A1 (en) 2024-03-14
JP2020529630A (ja) 2020-10-08

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