MY205321A - Display device, substrate for display device and method for repairing display device - Google Patents
Display device, substrate for display device and method for repairing display deviceInfo
- Publication number
- MY205321A MY205321A MYPI2020000525A MYPI2020000525A MY205321A MY 205321 A MY205321 A MY 205321A MY PI2020000525 A MYPI2020000525 A MY PI2020000525A MY PI2020000525 A MYPI2020000525 A MY PI2020000525A MY 205321 A MY205321 A MY 205321A
- Authority
- MY
- Malaysia
- Prior art keywords
- display device
- wiring parts
- substrate
- base
- repairing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20170098212 | 2017-08-02 | ||
| PCT/KR2018/008732 WO2019027248A1 (ko) | 2017-08-02 | 2018-08-01 | 디스플레이 장치, 디스플레이 장치용 기판 및 디스플레이 장치의 수리 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY205321A true MY205321A (en) | 2024-10-12 |
Family
ID=65232891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2020000525A MY205321A (en) | 2017-08-02 | 2018-08-01 | Display device, substrate for display device and method for repairing display device |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US11063175B2 (enExample) |
| EP (1) | EP3664134A4 (enExample) |
| JP (1) | JP7323508B2 (enExample) |
| KR (1) | KR102581010B1 (enExample) |
| CN (1) | CN110168723B (enExample) |
| MY (1) | MY205321A (enExample) |
| WO (1) | WO2019027248A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102330553B1 (ko) * | 2019-03-27 | 2021-11-24 | 엘지전자 주식회사 | 마이크로 엘이디를 이용한 디스플레이 장치 및 그 제조방법 |
| US11538852B2 (en) * | 2019-04-23 | 2022-12-27 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
| KR102719903B1 (ko) * | 2019-05-29 | 2024-10-18 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102766414B1 (ko) * | 2019-08-09 | 2025-02-13 | 삼성전자주식회사 | 디스플레이 장치 및 그 제조방법 |
| KR102802033B1 (ko) * | 2019-10-15 | 2025-04-30 | 삼성전자주식회사 | 디스플레이 장치의 제조 방법, 중계 기판 및 기록 매체에 저장된 컴퓨터 프로그램 |
| CN112928123B (zh) * | 2019-11-21 | 2024-10-15 | 京东方科技集团股份有限公司 | 一种驱动背板及其制作方法、显示面板、显示装置 |
| KR102880048B1 (ko) * | 2020-11-30 | 2025-11-03 | 삼성전자주식회사 | 디스플레이 모듈 및 그 제조 방법 |
| TWI807544B (zh) * | 2021-12-17 | 2023-07-01 | 友達光電股份有限公司 | 顯示面板及其製造方法 |
| TWI855473B (zh) * | 2022-12-23 | 2024-09-11 | 友達光電股份有限公司 | 發光顯示面板 |
| WO2025003399A1 (en) * | 2023-06-29 | 2025-01-02 | Ams-Osram International Gmbh | Method of repairing an electronic component and electronic component |
| TWI881804B (zh) * | 2024-04-18 | 2025-04-21 | 大陸商北京集創北方科技股份有限公司 | 一體式led顯示模組及透明led顯示裝置 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01302829A (ja) * | 1988-05-31 | 1989-12-06 | Canon Inc | 電気回路装置 |
| JPH06120417A (ja) * | 1992-10-08 | 1994-04-28 | Sharp Corp | マルチチップモジュールの実装構造及びその製造方法 |
| JP3462282B2 (ja) * | 1994-11-29 | 2003-11-05 | 株式会社東芝 | 樹脂封止型半導体装置、電子回路装置およびこの製造方法 |
| JPH09307225A (ja) * | 1996-05-13 | 1997-11-28 | Hitachi Ltd | プリント基板 |
| JP3450236B2 (ja) * | 1999-09-22 | 2003-09-22 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| US6546620B1 (en) * | 2000-06-29 | 2003-04-15 | Amkor Technology, Inc. | Flip chip integrated circuit and passive chip component package fabrication method |
| JP4609617B2 (ja) * | 2000-08-01 | 2011-01-12 | 日本電気株式会社 | 半導体装置の実装方法及び実装構造体 |
| US6495397B2 (en) * | 2001-03-28 | 2002-12-17 | Intel Corporation | Fluxless flip chip interconnection |
| KR100690245B1 (ko) * | 2005-04-06 | 2007-03-12 | 삼성전자주식회사 | 저융점 솔더를 이용한 솔더 접합 방법 및 이를 이용한 볼그리드 어레이 패키지의 수리 방법 |
| JP2007156338A (ja) * | 2005-12-08 | 2007-06-21 | Sharp Corp | ディスプレイパネルの修理方法 |
| JP2007298791A (ja) * | 2006-05-01 | 2007-11-15 | Mitsubishi Electric Corp | 液晶表示装置及びその欠陥修復方法 |
| JP4466755B2 (ja) * | 2007-11-01 | 2010-05-26 | ソニー株式会社 | アクティブマトリックス型表示装置 |
| KR20090045023A (ko) | 2007-11-01 | 2009-05-07 | 소니 가부시끼 가이샤 | 액티브 매트릭스형 표시 장치 |
| US8491816B2 (en) * | 2008-02-07 | 2013-07-23 | Mitsubishi Chemical Corporation | Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them |
| WO2013175926A1 (ja) * | 2012-05-24 | 2013-11-28 | シャープ株式会社 | 回路基板及び表示装置 |
| CN105144387B (zh) * | 2013-03-15 | 2018-03-13 | 苹果公司 | 具有冗余方案的发光二极管显示器和利用集成的缺陷检测测试来制造发光二极管显示器的方法 |
| KR102156774B1 (ko) | 2013-12-30 | 2020-09-17 | 엘지디스플레이 주식회사 | 유기발광 표시장치의 리페어 방법 |
| KR102203103B1 (ko) * | 2014-04-11 | 2021-01-15 | 삼성디스플레이 주식회사 | 유기 발광 표시 패널, 유기 발광 표시 장치 및 유기 발광 표시 패널의 리페어 방법 |
| CN107155373B (zh) | 2014-06-18 | 2019-01-15 | 艾克斯瑟乐普林特有限公司 | 微组装led显示器 |
| TWI557702B (zh) * | 2015-06-01 | 2016-11-11 | 友達光電股份有限公司 | 顯示面板及其修補方法 |
| US10133426B2 (en) * | 2015-06-18 | 2018-11-20 | X-Celeprint Limited | Display with micro-LED front light |
| GB2541970B (en) | 2015-09-02 | 2020-08-19 | Facebook Tech Llc | Display manufacture |
| KR102687577B1 (ko) * | 2016-12-30 | 2024-07-22 | 엘지디스플레이 주식회사 | 발광 다이오드 표시 장치 및 이를 이용한 멀티 스크린 표시 장치 |
-
2018
- 2018-08-01 EP EP18842262.0A patent/EP3664134A4/en active Pending
- 2018-08-01 US US16/635,717 patent/US11063175B2/en active Active
- 2018-08-01 MY MYPI2020000525A patent/MY205321A/en unknown
- 2018-08-01 JP JP2020505413A patent/JP7323508B2/ja active Active
- 2018-08-01 KR KR1020180089688A patent/KR102581010B1/ko active Active
- 2018-08-01 CN CN201880005633.8A patent/CN110168723B/zh active Active
- 2018-08-01 WO PCT/KR2018/008732 patent/WO2019027248A1/ko not_active Ceased
-
2021
- 2021-06-30 US US17/363,014 patent/US11605755B2/en active Active
-
2023
- 2023-03-10 US US18/119,932 patent/US11978823B2/en active Active
- 2023-11-22 US US18/518,379 patent/US20240088324A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190014480A (ko) | 2019-02-12 |
| US11063175B2 (en) | 2021-07-13 |
| JP2020529630A (ja) | 2020-10-08 |
| US11605755B2 (en) | 2023-03-14 |
| JP7323508B2 (ja) | 2023-08-08 |
| US20210328098A1 (en) | 2021-10-21 |
| CN110168723A (zh) | 2019-08-23 |
| US20230215971A1 (en) | 2023-07-06 |
| EP3664134A1 (en) | 2020-06-10 |
| KR102581010B1 (ko) | 2023-09-22 |
| US20240088324A1 (en) | 2024-03-14 |
| US20210135047A1 (en) | 2021-05-06 |
| US11978823B2 (en) | 2024-05-07 |
| CN110168723B (zh) | 2024-01-30 |
| EP3664134A4 (en) | 2021-04-21 |
| WO2019027248A1 (ko) | 2019-02-07 |
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