JP7312077B2 - 板状ワークの研削方法 - Google Patents

板状ワークの研削方法 Download PDF

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Publication number
JP7312077B2
JP7312077B2 JP2019182035A JP2019182035A JP7312077B2 JP 7312077 B2 JP7312077 B2 JP 7312077B2 JP 2019182035 A JP2019182035 A JP 2019182035A JP 2019182035 A JP2019182035 A JP 2019182035A JP 7312077 B2 JP7312077 B2 JP 7312077B2
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Japan
Prior art keywords
grinding
plate
chuck table
work
grinding wheel
Prior art date
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Active
Application number
JP2019182035A
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English (en)
Japanese (ja)
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JP2021053790A (ja
Inventor
聡 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2019182035A priority Critical patent/JP7312077B2/ja
Priority to TW109131328A priority patent/TW202114813A/zh
Priority to KR1020200122073A priority patent/KR20210039943A/ko
Priority to CN202011051389.4A priority patent/CN112589540B/zh
Publication of JP2021053790A publication Critical patent/JP2021053790A/ja
Application granted granted Critical
Publication of JP7312077B2 publication Critical patent/JP7312077B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2019182035A 2019-10-02 2019-10-02 板状ワークの研削方法 Active JP7312077B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019182035A JP7312077B2 (ja) 2019-10-02 2019-10-02 板状ワークの研削方法
TW109131328A TW202114813A (zh) 2019-10-02 2020-09-11 板狀工件之磨削方法
KR1020200122073A KR20210039943A (ko) 2019-10-02 2020-09-22 판형 가공물의 연삭 방법
CN202011051389.4A CN112589540B (zh) 2019-10-02 2020-09-29 板状工件的磨削方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019182035A JP7312077B2 (ja) 2019-10-02 2019-10-02 板状ワークの研削方法

Publications (2)

Publication Number Publication Date
JP2021053790A JP2021053790A (ja) 2021-04-08
JP7312077B2 true JP7312077B2 (ja) 2023-07-20

Family

ID=75180271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019182035A Active JP7312077B2 (ja) 2019-10-02 2019-10-02 板状ワークの研削方法

Country Status (4)

Country Link
JP (1) JP7312077B2 (zh)
KR (1) KR20210039943A (zh)
CN (1) CN112589540B (zh)
TW (1) TW202114813A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766702B (zh) * 2021-05-26 2022-06-01 均豪精密工業股份有限公司 片狀工件研磨方法及研磨裝置
CN115431163B (zh) * 2021-06-01 2024-03-08 均豪精密工业股份有限公司 片状工件研磨方法及研磨装置
CN114434300B (zh) * 2022-01-23 2024-01-16 滁州松鼠家具有限公司 一种木质品漆面抛光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015223665A (ja) 2014-05-28 2015-12-14 株式会社ディスコ 研削装置及び矩形基板の研削方法
JP2015223666A (ja) 2014-05-28 2015-12-14 株式会社ディスコ 研削装置及び矩形基板の研削方法
JP2015223667A (ja) 2014-05-28 2015-12-14 株式会社ディスコ 研削装置及び矩形基板の研削方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001322056A (ja) * 2000-05-16 2001-11-20 Nippei Toyama Corp 片面研削装置および片面研削方法
JP6158642B2 (ja) * 2013-08-22 2017-07-05 株式会社ディスコ 研削方法
JP6292958B2 (ja) 2014-04-18 2018-03-14 株式会社ディスコ 研削装置
JP6423738B2 (ja) 2015-02-19 2018-11-14 株式会社ディスコ 研削装置
JP6537382B2 (ja) * 2015-07-14 2019-07-03 株式会社ディスコ 研削装置のアイドリング方法
JP6552924B2 (ja) * 2015-09-02 2019-07-31 株式会社ディスコ 加工装置
JP7009128B2 (ja) * 2017-09-20 2022-01-25 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2019093518A (ja) * 2017-11-27 2019-06-20 株式会社ディスコ 被加工物の加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015223665A (ja) 2014-05-28 2015-12-14 株式会社ディスコ 研削装置及び矩形基板の研削方法
JP2015223666A (ja) 2014-05-28 2015-12-14 株式会社ディスコ 研削装置及び矩形基板の研削方法
JP2015223667A (ja) 2014-05-28 2015-12-14 株式会社ディスコ 研削装置及び矩形基板の研削方法

Also Published As

Publication number Publication date
CN112589540B (zh) 2024-02-23
CN112589540A (zh) 2021-04-02
JP2021053790A (ja) 2021-04-08
KR20210039943A (ko) 2021-04-12
TW202114813A (zh) 2021-04-16

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