JP7308752B2 - 搬送ローラー - Google Patents

搬送ローラー Download PDF

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Publication number
JP7308752B2
JP7308752B2 JP2019546975A JP2019546975A JP7308752B2 JP 7308752 B2 JP7308752 B2 JP 7308752B2 JP 2019546975 A JP2019546975 A JP 2019546975A JP 2019546975 A JP2019546975 A JP 2019546975A JP 7308752 B2 JP7308752 B2 JP 7308752B2
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JP
Japan
Prior art keywords
transport
transport roller
contact
roller
rollers
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JP2019546975A
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English (en)
Japanese (ja)
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JP2019536715A (ja
JP2019536715A5 (https=
Inventor
フェルディナント・ヴィーナー
シュテファン・グリュスナー
Original Assignee
アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー
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Publication of JP2019536715A5 publication Critical patent/JP2019536715A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • B65H5/06—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers
    • B65H5/062—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers between rollers or balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2019546975A 2016-11-16 2017-09-21 搬送ローラー Active JP7308752B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16199129.4A EP3324426B1 (en) 2016-11-16 2016-11-16 Transport roller
EP16199129.4 2016-11-16
PCT/EP2017/073933 WO2018091174A1 (en) 2016-11-16 2017-09-21 Transport roller

Publications (3)

Publication Number Publication Date
JP2019536715A JP2019536715A (ja) 2019-12-19
JP2019536715A5 JP2019536715A5 (https=) 2020-10-15
JP7308752B2 true JP7308752B2 (ja) 2023-07-14

Family

ID=57348489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019546975A Active JP7308752B2 (ja) 2016-11-16 2017-09-21 搬送ローラー

Country Status (9)

Country Link
US (1) US11097913B2 (https=)
EP (1) EP3324426B1 (https=)
JP (1) JP7308752B2 (https=)
KR (1) KR102413016B1 (https=)
CN (1) CN109937472B (https=)
MY (1) MY193744A (https=)
PH (1) PH12019501083A1 (https=)
TW (1) TWI661988B (https=)
WO (1) WO2018091174A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115885374A (zh) * 2020-08-21 2023-03-31 应用材料公司 真空沉积系统、基板运输系统和运输基板通过真空腔室的方法
CN113003223B (zh) * 2021-04-23 2023-06-30 成都京东方显示科技有限公司 传送装置
WO2025038243A1 (en) * 2023-08-15 2025-02-20 Parata Systems, Llc Roller used in device for pharmaceutical pouch packaging

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708605A1 (de) * 1987-03-17 1988-09-29 Boettcher Gmbh & Co Felix Presswalze fuer die entwaesserung von stoffbahnen
JPH04129218A (ja) * 1990-09-19 1992-04-30 Mitsubishi Electric Corp 水切り装置
JPH08102582A (ja) * 1994-09-30 1996-04-16 Mitsubishi Paper Mills Ltd プリント配線基板処理装置
JPH10314684A (ja) * 1997-05-21 1998-12-02 Speedfam Co Ltd ディスク形ワークの洗浄方法及び装置
EP0993023A1 (en) * 1998-10-05 2000-04-12 Agfa-Gevaert N.V. Method for transferring a web-or sheet-like material into a clean room
WO2000074114A1 (en) * 1999-05-27 2000-12-07 Oliver Design, Inc. Disk cascade scrubber
JP2004299984A (ja) * 2003-03-31 2004-10-28 Nichias Corp ディスクロール及びその製造方法
DE102005062528A1 (de) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten
US8535474B2 (en) * 2007-08-06 2013-09-17 Kao Corporation Liquid applicator
US8377024B2 (en) * 2007-11-19 2013-02-19 The Procter & Gamble Company Outer cover for a disposable absorbent article
DE102007061581A1 (de) * 2007-12-18 2009-06-25 Felix Kunze-Concewitz Vorrichtung und Verfahren zum Reinigen von Substraten für mikroelektronische Anwendungen durch rotierende Walzen
JP5431863B2 (ja) * 2009-10-19 2014-03-05 大日本スクリーン製造株式会社 基板処理装置
US8684169B2 (en) * 2010-08-31 2014-04-01 Itoh Denki Co., Ltd. Transfer device
JP5712589B2 (ja) * 2010-12-07 2015-05-07 セイコーエプソン株式会社 印刷装置
KR20130006987A (ko) * 2011-06-28 2013-01-18 삼성전기주식회사 기판 이송용 롤러
CN202606424U (zh) * 2012-03-30 2012-12-19 明基材料有限公司 清洁装置
TW201531584A (zh) * 2013-12-20 2015-08-16 Atotech Deutschland Gmbh 在用於電流或溼式化學金屬沉積之水平處理裝置之處理區域內積聚處理液之裝置
EP2886685A1 (en) * 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition
GB201509080D0 (en) 2015-05-27 2015-07-08 Landa Labs 2012 Ltd Coating apparatus
DE102016210883A1 (de) * 2016-06-17 2017-12-21 Singulus Technologies Ag Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material

Also Published As

Publication number Publication date
JP2019536715A (ja) 2019-12-19
EP3324426A1 (en) 2018-05-23
CN109937472A (zh) 2019-06-25
WO2018091174A1 (en) 2018-05-24
PH12019501083A1 (en) 2019-08-19
KR102413016B1 (ko) 2022-06-23
EP3324426B1 (en) 2021-05-05
MY193744A (en) 2022-10-27
CN109937472B (zh) 2023-03-31
US11097913B2 (en) 2021-08-24
KR20190082838A (ko) 2019-07-10
US20200055684A1 (en) 2020-02-20
TW201819269A (zh) 2018-06-01
TWI661988B (zh) 2019-06-11

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