TWI661988B - 運輸輥及其用途、含有運輸輥之水平運輸系統、用於溼處理之處理裝置、及處理一基板之方法 - Google Patents

運輸輥及其用途、含有運輸輥之水平運輸系統、用於溼處理之處理裝置、及處理一基板之方法 Download PDF

Info

Publication number
TWI661988B
TWI661988B TW106136031A TW106136031A TWI661988B TW I661988 B TWI661988 B TW I661988B TW 106136031 A TW106136031 A TW 106136031A TW 106136031 A TW106136031 A TW 106136031A TW I661988 B TWI661988 B TW I661988B
Authority
TW
Taiwan
Prior art keywords
transport roller
transport
contact
substrate
roller
Prior art date
Application number
TW106136031A
Other languages
English (en)
Chinese (zh)
Other versions
TW201819269A (zh
Inventor
Ferdinand Wiener
菲德納 溫諾
Stefan Gruessner
史黛芬 格魯尼爾
Original Assignee
Atotech Deutschland Gmbh
德商德國艾托特克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh, 德商德國艾托特克公司 filed Critical Atotech Deutschland Gmbh
Publication of TW201819269A publication Critical patent/TW201819269A/zh
Application granted granted Critical
Publication of TWI661988B publication Critical patent/TWI661988B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • B65H5/06—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers
    • B65H5/062—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers between rollers or balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
TW106136031A 2016-11-16 2017-10-20 運輸輥及其用途、含有運輸輥之水平運輸系統、用於溼處理之處理裝置、及處理一基板之方法 TWI661988B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??16199129.4 2016-11-16
EP16199129.4A EP3324426B1 (en) 2016-11-16 2016-11-16 Transport roller

Publications (2)

Publication Number Publication Date
TW201819269A TW201819269A (zh) 2018-06-01
TWI661988B true TWI661988B (zh) 2019-06-11

Family

ID=57348489

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106136031A TWI661988B (zh) 2016-11-16 2017-10-20 運輸輥及其用途、含有運輸輥之水平運輸系統、用於溼處理之處理裝置、及處理一基板之方法

Country Status (9)

Country Link
US (1) US11097913B2 (https=)
EP (1) EP3324426B1 (https=)
JP (1) JP7308752B2 (https=)
KR (1) KR102413016B1 (https=)
CN (1) CN109937472B (https=)
MY (1) MY193744A (https=)
PH (1) PH12019501083A1 (https=)
TW (1) TWI661988B (https=)
WO (1) WO2018091174A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115885374A (zh) * 2020-08-21 2023-03-31 应用材料公司 真空沉积系统、基板运输系统和运输基板通过真空腔室的方法
CN113003223B (zh) * 2021-04-23 2023-06-30 成都京东方显示科技有限公司 传送装置
WO2025038243A1 (en) * 2023-08-15 2025-02-20 Parata Systems, Llc Roller used in device for pharmaceutical pouch packaging

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012193A (en) * 1997-05-21 2000-01-11 Speedfam Co., Ltd. Apparatus for washing disc-shaped workpieces
JP2004299984A (ja) * 2003-03-31 2004-10-28 Nichias Corp ディスクロール及びその製造方法
CN101742980A (zh) * 2007-08-06 2010-06-16 花王株式会社 液体涂敷装置
CN101868204A (zh) * 2007-11-19 2010-10-20 宝洁公司 用于一次性吸收制品的外覆盖件
CN202606424U (zh) * 2012-03-30 2012-12-19 明基材料有限公司 清洁装置
TW201531584A (zh) * 2013-12-20 2015-08-16 Atotech Deutschland Gmbh 在用於電流或溼式化學金屬沉積之水平處理裝置之處理區域內積聚處理液之裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708605A1 (de) * 1987-03-17 1988-09-29 Boettcher Gmbh & Co Felix Presswalze fuer die entwaesserung von stoffbahnen
JPH04129218A (ja) * 1990-09-19 1992-04-30 Mitsubishi Electric Corp 水切り装置
JPH08102582A (ja) * 1994-09-30 1996-04-16 Mitsubishi Paper Mills Ltd プリント配線基板処理装置
EP0993023A1 (en) * 1998-10-05 2000-04-12 Agfa-Gevaert N.V. Method for transferring a web-or sheet-like material into a clean room
WO2000074114A1 (en) * 1999-05-27 2000-12-07 Oliver Design, Inc. Disk cascade scrubber
DE102005062528A1 (de) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten
DE102007061581A1 (de) * 2007-12-18 2009-06-25 Felix Kunze-Concewitz Vorrichtung und Verfahren zum Reinigen von Substraten für mikroelektronische Anwendungen durch rotierende Walzen
JP5431863B2 (ja) * 2009-10-19 2014-03-05 大日本スクリーン製造株式会社 基板処理装置
US8684169B2 (en) * 2010-08-31 2014-04-01 Itoh Denki Co., Ltd. Transfer device
JP5712589B2 (ja) * 2010-12-07 2015-05-07 セイコーエプソン株式会社 印刷装置
KR20130006987A (ko) * 2011-06-28 2013-01-18 삼성전기주식회사 기판 이송용 롤러
EP2886685A1 (en) * 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition
GB201509080D0 (en) 2015-05-27 2015-07-08 Landa Labs 2012 Ltd Coating apparatus
DE102016210883A1 (de) * 2016-06-17 2017-12-21 Singulus Technologies Ag Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012193A (en) * 1997-05-21 2000-01-11 Speedfam Co., Ltd. Apparatus for washing disc-shaped workpieces
JP2004299984A (ja) * 2003-03-31 2004-10-28 Nichias Corp ディスクロール及びその製造方法
CN101742980A (zh) * 2007-08-06 2010-06-16 花王株式会社 液体涂敷装置
CN101868204A (zh) * 2007-11-19 2010-10-20 宝洁公司 用于一次性吸收制品的外覆盖件
CN202606424U (zh) * 2012-03-30 2012-12-19 明基材料有限公司 清洁装置
TW201531584A (zh) * 2013-12-20 2015-08-16 Atotech Deutschland Gmbh 在用於電流或溼式化學金屬沉積之水平處理裝置之處理區域內積聚處理液之裝置

Also Published As

Publication number Publication date
JP2019536715A (ja) 2019-12-19
JP7308752B2 (ja) 2023-07-14
EP3324426A1 (en) 2018-05-23
CN109937472A (zh) 2019-06-25
WO2018091174A1 (en) 2018-05-24
PH12019501083A1 (en) 2019-08-19
KR102413016B1 (ko) 2022-06-23
EP3324426B1 (en) 2021-05-05
MY193744A (en) 2022-10-27
CN109937472B (zh) 2023-03-31
US11097913B2 (en) 2021-08-24
KR20190082838A (ko) 2019-07-10
US20200055684A1 (en) 2020-02-20
TW201819269A (zh) 2018-06-01

Similar Documents

Publication Publication Date Title
TWI661988B (zh) 運輸輥及其用途、含有運輸輥之水平運輸系統、用於溼處理之處理裝置、及處理一基板之方法
CN105408029B (zh) 凹版辊及间隔件的制造方法以及间隔件
US11062929B2 (en) Device and method for treating substrates using a support roller having a porous material
US10751736B2 (en) Cleaning apparatus, spherical object cleaning system, and method for cleaning spherical object
US10892173B2 (en) Substrate cleaning roll, substrate cleaning apparatus, and substrate cleaning method
WO2013011471A1 (en) Contact cleaning roller assembly
TW201110838A (en) Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid
TW201446467A (zh) 掃刷輥及使用該掃刷輥之塑膠薄膜的製造裝置以及製造方法
JP2017513210A (ja) 目標とする高い洗浄性能を得るためのこぶの比率
KR102155009B1 (ko) 도포장치, 도포방법 및 도막을 가진 수지 필름의 제조방법
KR102314858B1 (ko) 필름 이물 제거 장치 및 모듈
JP2019536715A5 (https=)
TW201323094A (zh) 基板表面處理之裝置
Gao et al. Boiling water treatment for wettability improvement of aluminum fin surfaces
JP2017070927A (ja) ダイリップエッジガイド
TW201008989A (en) Hydrophilic fluoropolymer materials and methods
JP2017054680A (ja) 電極の製造方法
JP6227373B2 (ja) ゴムシートへの離型剤塗布装置
JP2006255611A (ja) グラビア塗布方法及び装置
KR102026000B1 (ko) 인라인 습식 벤치 장치 및 반도체 웨이퍼들의 습식용액 처리를 위한 방법
KR20180001805U (ko) 이송 롤러, 이송 장치 및 기판 처리 시스템