JP7294525B2 - アンテナモジュールおよびそれを搭載する通信装置 - Google Patents

アンテナモジュールおよびそれを搭載する通信装置 Download PDF

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Publication number
JP7294525B2
JP7294525B2 JP2022505868A JP2022505868A JP7294525B2 JP 7294525 B2 JP7294525 B2 JP 7294525B2 JP 2022505868 A JP2022505868 A JP 2022505868A JP 2022505868 A JP2022505868 A JP 2022505868A JP 7294525 B2 JP7294525 B2 JP 7294525B2
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Prior art keywords
dielectric substrate
antenna module
radiation element
conductive member
radiating element
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JP2022505868A
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English (en)
Japanese (ja)
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JPWO2021182037A5 (https=
JPWO2021182037A1 (https=
Inventor
航大 荒井
良 小村
薫 須藤
久夫 早藤
弘嗣 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of JPWO2021182037A1 publication Critical patent/JPWO2021182037A1/ja
Publication of JPWO2021182037A5 publication Critical patent/JPWO2021182037A5/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061Two dimensional planar arrays
    • H01Q21/065Patch antenna array
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30Arrangements for providing operation on different wavebands
    • H01Q5/378Combination of fed elements with parasitic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0442Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular tuning means
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B7/00Radio transmission systems, i.e. using radiation field
    • H04B7/02Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/0413MIMO systems
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B7/00Radio transmission systems, i.e. using radiation field
    • H04B7/02Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/06Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Aerials With Secondary Devices (AREA)
JP2022505868A 2020-03-09 2021-02-17 アンテナモジュールおよびそれを搭載する通信装置 Active JP7294525B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020039703 2020-03-09
JP2020039703 2020-03-09
PCT/JP2021/005805 WO2021182037A1 (ja) 2020-03-09 2021-02-17 アンテナモジュールおよびそれを搭載する通信装置

Publications (3)

Publication Number Publication Date
JPWO2021182037A1 JPWO2021182037A1 (https=) 2021-09-16
JPWO2021182037A5 JPWO2021182037A5 (https=) 2022-10-25
JP7294525B2 true JP7294525B2 (ja) 2023-06-20

Family

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Family Applications (1)

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JP2022505868A Active JP7294525B2 (ja) 2020-03-09 2021-02-17 アンテナモジュールおよびそれを搭載する通信装置

Country Status (4)

Country Link
US (1) US12283761B2 (https=)
JP (1) JP7294525B2 (https=)
CN (1) CN115280598B (https=)
WO (1) WO2021182037A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12469975B2 (en) * 2022-11-30 2025-11-11 Zebra Technologies Corporation Patch antenna assembly with parasitic patch and capacitive loading elements
WO2024171710A1 (ja) * 2023-02-16 2024-08-22 株式会社村田製作所 アンテナ部品
EP4447224A1 (en) * 2023-04-11 2024-10-16 Nxp B.V. Antenna package
WO2026038411A1 (ja) * 2024-08-14 2026-02-19 株式会社村田製作所 アンテナモジュールおよび通信装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138525A (ja) 1998-10-30 2000-05-16 Mitsubishi Electric Corp マイクロストリップアンテナおよびマイクロストリップアンテナ基板

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199503A (ja) * 1987-02-13 1988-08-18 Nippon Hoso Kyokai <Nhk> マイクロストリツプアンテナ
JPH01176970A (ja) 1988-01-06 1989-07-13 Mitsubishi Electric Corp 三次元計測機
JPH1075116A (ja) * 1996-06-28 1998-03-17 Toshiba Corp アンテナ、接続装置、カップラ及び基板積層方法
JP4053486B2 (ja) * 2003-09-29 2008-02-27 株式会社ヨコオ マイクロストリップアンテナ
JP3981089B2 (ja) * 2004-02-18 2007-09-26 株式会社東芝 半導体装置とその製造方法
US7379135B2 (en) * 2004-05-28 2008-05-27 Fujitsu Limited Transflective liquid crystal display
US7812767B2 (en) * 2004-09-07 2010-10-12 Nippon Telegraph And Telephone Corporation Antenna device, array antenna device using the antenna device, module, module array and package module
WO2006046361A1 (ja) * 2004-10-26 2006-05-04 Murata Manufacturing Co., Ltd. セラミック原料組成物、セラミック基板および非可逆回路素子
US7226856B1 (en) * 2004-11-15 2007-06-05 Kla-Tencor Technologies Corporation Nano-electrode-array for integrated circuit interconnects
WO2006071798A1 (en) * 2004-12-23 2006-07-06 Touchsensor Technologies, Llc Track position sensor and method
JP5018488B2 (ja) * 2008-01-15 2012-09-05 Tdk株式会社 アンテナモジュール
IL218625A (en) * 2012-03-14 2017-10-31 Israel Aerospace Ind Ltd An antenna array
US9577314B2 (en) * 2012-09-12 2017-02-21 International Business Machines Corporation Hybrid on-chip and package antenna
CN102904009A (zh) * 2012-09-13 2013-01-30 上海交通大学 一种小型宽带宽波束圆极化微带天线
JP6288294B2 (ja) 2014-10-31 2018-03-07 株式会社村田製作所 アンテナモジュール及び回路モジュール
CN105024157A (zh) * 2015-08-20 2015-11-04 广州中海达卫星导航技术股份有限公司 空气测量型天线装置
CN108370078B (zh) * 2015-11-20 2020-10-27 古野电气株式会社 多层基板及雷达装置
JP2017183653A (ja) * 2016-03-31 2017-10-05 スナップトラック・インコーポレーテッド 高周波用多層配線基板とその製造方法
CN109845034B (zh) * 2016-10-19 2020-07-31 株式会社村田制作所 天线元件、天线模块以及通信装置
CN207398350U (zh) * 2017-11-21 2018-05-22 成都锐芯盛通电子科技有限公司 一种幅度加权微带天线及其构成的阵列天线
JP6556273B2 (ja) * 2018-01-19 2019-08-07 株式会社フジクラ アンテナ
CN110401008B (zh) * 2018-04-25 2022-02-25 华为技术有限公司 带有封装天线的封装架构及通信设备
US11037891B2 (en) * 2018-09-21 2021-06-15 Advanced Semiconductor Engineering, Inc. Device package
CN110620291B (zh) * 2019-08-29 2021-02-05 电子科技大学 一种用于卫星通信的圆极化偶极子天线

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138525A (ja) 1998-10-30 2000-05-16 Mitsubishi Electric Corp マイクロストリップアンテナおよびマイクロストリップアンテナ基板

Also Published As

Publication number Publication date
US12283761B2 (en) 2025-04-22
WO2021182037A1 (ja) 2021-09-16
CN115280598A (zh) 2022-11-01
CN115280598B (zh) 2026-04-03
US20230006350A1 (en) 2023-01-05
JPWO2021182037A1 (https=) 2021-09-16

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