JP7289019B2 - 窒化ホウ素粉末及び樹脂組成物 - Google Patents

窒化ホウ素粉末及び樹脂組成物 Download PDF

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JP7289019B2
JP7289019B2 JP2022575455A JP2022575455A JP7289019B2 JP 7289019 B2 JP7289019 B2 JP 7289019B2 JP 2022575455 A JP2022575455 A JP 2022575455A JP 2022575455 A JP2022575455 A JP 2022575455A JP 7289019 B2 JP7289019 B2 JP 7289019B2
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boron nitride
boron
less
nitride powder
particles
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JPWO2022202824A5 (https=
JPWO2022202824A1 (https=
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祐輔 佐々木
建治 宮田
啓 久保渕
智成 宮崎
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0646—Preparation by pyrolysis of boron and nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/583—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on boron nitride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
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    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
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    • C01P2004/50—Agglomerated particles
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    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
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    • C08K2201/00—Specific properties of additives
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  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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JP2022575455A 2021-03-25 2022-03-22 窒化ホウ素粉末及び樹脂組成物 Active JP7289019B2 (ja)

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JP2021051877 2021-03-25
JP2021051877 2021-03-25
PCT/JP2022/013230 WO2022202824A1 (ja) 2021-03-25 2022-03-22 窒化ホウ素粉末及び樹脂組成物

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JPWO2022202824A1 JPWO2022202824A1 (https=) 2022-09-29
JPWO2022202824A5 JPWO2022202824A5 (https=) 2023-02-21
JP7289019B2 true JP7289019B2 (ja) 2023-06-08

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US (1) US20240174908A1 (https=)
JP (1) JP7289019B2 (https=)
KR (1) KR102935933B1 (https=)
CN (1) CN117098721A (https=)
TW (1) TWI864381B (https=)
WO (1) WO2022202824A1 (https=)

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JP2025137039A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014003193A1 (ja) 2012-06-27 2014-01-03 水島合金鉄株式会社 凹部付きｂｎ球状焼結粒子およびその製造方法ならびに高分子材料
WO2014136959A1 (ja) 2013-03-07 2014-09-12 電気化学工業株式会社 窒化ホウ素粉末及びこれを含有する樹脂組成物
WO2016092951A1 (ja) 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2017155110A1 (ja) 2016-03-10 2017-09-14 デンカ株式会社 セラミックス樹脂複合体
WO2018181606A1 (ja) 2017-03-29 2018-10-04 デンカ株式会社 伝熱部材及びこれを含む放熱構造体
JP2019073409A (ja) 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
JP2019519460A (ja) 2016-06-16 2019-07-11 スリーエム イノベイティブ プロパティズ カンパニー 六方晶窒化ホウ素成形体、それを製造するための六方晶窒化ホウ素造粒物及びその製造方法
WO2020004600A1 (ja) 2018-06-29 2020-01-02 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
WO2020196643A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
WO2020196679A1 (ja) 2019-03-28 2020-10-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

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JPH01179763A (ja) * 1988-01-05 1989-07-17 Showa Denko Kk 窒化ホウ素と窒化ケイ素の複合焼結体の製造方法
CN102574684B (zh) 2009-10-09 2015-04-29 水岛合金铁株式会社 六方氮化硼粉末及其制备方法
MY170639A (en) * 2011-11-29 2019-08-21 Mitsubishi Chem Corp Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
JP6493226B2 (ja) * 2014-02-05 2019-04-03 三菱ケミカル株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート
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WO2014003193A1 (ja) 2012-06-27 2014-01-03 水島合金鉄株式会社 凹部付きｂｎ球状焼結粒子およびその製造方法ならびに高分子材料
WO2014136959A1 (ja) 2013-03-07 2014-09-12 電気化学工業株式会社 窒化ホウ素粉末及びこれを含有する樹脂組成物
WO2016092951A1 (ja) 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2017155110A1 (ja) 2016-03-10 2017-09-14 デンカ株式会社 セラミックス樹脂複合体
JP2019519460A (ja) 2016-06-16 2019-07-11 スリーエム イノベイティブ プロパティズ カンパニー 六方晶窒化ホウ素成形体、それを製造するための六方晶窒化ホウ素造粒物及びその製造方法
WO2018181606A1 (ja) 2017-03-29 2018-10-04 デンカ株式会社 伝熱部材及びこれを含む放熱構造体
JP2019073409A (ja) 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
WO2020004600A1 (ja) 2018-06-29 2020-01-02 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
WO2020196643A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 塊状窒化ホウ素粒子、熱伝導樹脂組成物及び放熱部材
WO2020196679A1 (ja) 2019-03-28 2020-10-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

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TWI864381B (zh) 2024-12-01
KR20230156791A (ko) 2023-11-14
WO2022202824A1 (ja) 2022-09-29
JPWO2022202824A1 (https=) 2022-09-29
KR102935933B1 (ko) 2026-03-06
TW202300445A (zh) 2023-01-01
CN117098721A (zh) 2023-11-21
US20240174908A1 (en) 2024-05-30

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