TWI864381B - 氮化硼粉末及樹脂組成物 - Google Patents

氮化硼粉末及樹脂組成物 Download PDF

Info

Publication number
TWI864381B
TWI864381B TW111110960A TW111110960A TWI864381B TW I864381 B TWI864381 B TW I864381B TW 111110960 A TW111110960 A TW 111110960A TW 111110960 A TW111110960 A TW 111110960A TW I864381 B TWI864381 B TW I864381B
Authority
TW
Taiwan
Prior art keywords
boron nitride
boron
less
nitride powder
particles
Prior art date
Application number
TW111110960A
Other languages
English (en)
Chinese (zh)
Other versions
TW202300445A (zh
Inventor
佐佐木祐輔
宮田建治
久保渕啓
宮崎智成
Original Assignee
日商電化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司
Publication of TW202300445A publication Critical patent/TW202300445A/zh
Application granted granted Critical
Publication of TWI864381B publication Critical patent/TWI864381B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0646—Preparation by pyrolysis of boron and nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/583—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on boron nitride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/16—Pore diameter
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/21—Attrition-index or crushing strength of granulates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ceramic Products (AREA)
TW111110960A 2021-03-25 2022-03-24 氮化硼粉末及樹脂組成物 TWI864381B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-051877 2021-03-25
JP2021051877 2021-03-25

Publications (2)

Publication Number Publication Date
TW202300445A TW202300445A (zh) 2023-01-01
TWI864381B true TWI864381B (zh) 2024-12-01

Family

ID=83395845

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111110960A TWI864381B (zh) 2021-03-25 2022-03-24 氮化硼粉末及樹脂組成物

Country Status (6)

Country Link
US (1) US20240174908A1 (https=)
JP (1) JP7289019B2 (https=)
KR (1) KR102935933B1 (https=)
CN (1) CN117098721A (https=)
TW (1) TWI864381B (https=)
WO (1) WO2022202824A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025137039A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016092952A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2020196679A1 (ja) * 2019-03-28 2020-10-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01179763A (ja) * 1988-01-05 1989-07-17 Showa Denko Kk 窒化ホウ素と窒化ケイ素の複合焼結体の製造方法
CN102574684B (zh) 2009-10-09 2015-04-29 水岛合金铁株式会社 六方氮化硼粉末及其制备方法
MY170639A (en) * 2011-11-29 2019-08-21 Mitsubishi Chem Corp Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
CN104470873B (zh) * 2012-06-27 2016-11-02 水岛合金铁株式会社 带凹部的bn球状烧结粒子及其制造方法以及高分子材料
US9656868B2 (en) * 2013-03-07 2017-05-23 Denka Company Limited Boron-nitride powder and resin composition containing same
JP6493226B2 (ja) * 2014-02-05 2019-04-03 三菱ケミカル株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート
JP6256158B2 (ja) * 2014-03-31 2018-01-10 三菱ケミカル株式会社 放熱シートおよび放熱シート製造方法、放熱シート用スラリー、並びにパワーデバイス装置
WO2016092951A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
FR3037579B1 (fr) * 2015-06-17 2017-06-16 Saint-Gobain Centre De Rech Et D'Etudes Europeen Poudre d'agregats a base de nitrure de bore
CN107848801B (zh) * 2015-09-03 2021-01-12 昭和电工株式会社 六方晶氮化硼粉末、其制造方法、树脂组合物及树脂片
JP6816920B2 (ja) * 2016-02-22 2021-01-20 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
US10487013B2 (en) * 2016-03-10 2019-11-26 Denka Company Limited Ceramic resin composite body
EP3257810B1 (en) * 2016-06-16 2019-11-13 3M Innovative Properties Company Formed hexagonal boron nitride body, hexagonal boron nitride granulates for making the same, and process for producing the same
WO2018181605A1 (ja) * 2017-03-29 2018-10-04 株式会社キュアテックス 和紙糸の編物又は織物を含む農園芸用資材
KR102438540B1 (ko) * 2017-03-29 2022-08-30 덴카 주식회사 전열 부재 및 이것을 포함하는 방열 구조체
JP7104503B2 (ja) * 2017-10-13 2022-07-21 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
JP7069314B2 (ja) * 2018-06-29 2022-05-17 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
US20220154059A1 (en) * 2019-03-27 2022-05-19 Denka Company Limited Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016092952A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2020196679A1 (ja) * 2019-03-28 2020-10-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

Also Published As

Publication number Publication date
KR20230156791A (ko) 2023-11-14
WO2022202824A1 (ja) 2022-09-29
JPWO2022202824A1 (https=) 2022-09-29
JP7289019B2 (ja) 2023-06-08
KR102935933B1 (ko) 2026-03-06
TW202300445A (zh) 2023-01-01
CN117098721A (zh) 2023-11-21
US20240174908A1 (en) 2024-05-30

Similar Documents

Publication Publication Date Title
JP7069314B2 (ja) 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
TWI869662B (zh) 氮化硼粉末及樹脂組成物
KR102400206B1 (ko) 질화붕소 응집 입자, 질화붕소 응집 입자의 제조 방법, 그 질화붕소 응집 입자 함유 수지 조성물, 성형체, 및 시트
TWI838500B (zh) 塊狀氮化硼粒子、熱傳導樹脂組成物、以及散熱構件
EP3696140B1 (en) Boron nitride powder, method for producing same, and heat-dissipating member produced using same
JP7786500B2 (ja) 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス
JP7273587B2 (ja) 窒化ホウ素粉末及び樹脂組成物
TW201927689A (zh) 六方晶氮化硼粉末及其製造方法以及使用其之組成物及散熱材
US20230220263A1 (en) Heat-conductive resin composition and heat dissipation sheet
TWI862955B (zh) 樹脂組合物及電子零件
JP7289020B2 (ja) 窒化ホウ素粒子、その製造方法、及び樹脂組成物
TWI864381B (zh) 氮化硼粉末及樹脂組成物
US20230142330A1 (en) Boron nitride sintered body, composite body, method for producing said boron nitride sintered body, method for producing said composite body, and heat dissipation member
JP7124249B1 (ja) 放熱シート及び放熱シートの製造方法
US20230085806A1 (en) Boron nitride sintered body, composite body, and manufacturing methods therefor, and heat dissipation member