CN117098721A - 氮化硼粉末及树脂组合物 - Google Patents

氮化硼粉末及树脂组合物 Download PDF

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Publication number
CN117098721A
CN117098721A CN202280022941.8A CN202280022941A CN117098721A CN 117098721 A CN117098721 A CN 117098721A CN 202280022941 A CN202280022941 A CN 202280022941A CN 117098721 A CN117098721 A CN 117098721A
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China
Prior art keywords
boron nitride
boron
less
nitride powder
particles
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Pending
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CN202280022941.8A
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English (en)
Chinese (zh)
Inventor
佐佐木祐辅
宫田建治
久保渊启
宫崎智成
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Denka Co Ltd
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Denka Co Ltd
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Publication of CN117098721A publication Critical patent/CN117098721A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0646—Preparation by pyrolysis of boron and nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/583—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on boron nitride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/16—Pore diameter
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/21—Attrition-index or crushing strength of granulates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ceramic Products (AREA)
CN202280022941.8A 2021-03-25 2022-03-22 氮化硼粉末及树脂组合物 Pending CN117098721A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-051877 2021-03-25
JP2021051877 2021-03-25
PCT/JP2022/013230 WO2022202824A1 (ja) 2021-03-25 2022-03-22 窒化ホウ素粉末及び樹脂組成物

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CN117098721A true CN117098721A (zh) 2023-11-21

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Country Status (6)

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US (1) US20240174908A1 (https=)
JP (1) JP7289019B2 (https=)
KR (1) KR102935933B1 (https=)
CN (1) CN117098721A (https=)
TW (1) TWI864381B (https=)
WO (1) WO2022202824A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025137039A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (6)

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WO2016092952A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2016092951A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
CN106029561A (zh) * 2014-02-05 2016-10-12 三菱化学株式会社 氮化硼凝集颗粒、氮化硼凝集颗粒的制造方法、含该氮化硼凝集颗粒的树脂组合物、成型体、和片
CN108473308A (zh) * 2016-02-22 2018-08-31 昭和电工株式会社 六方晶氮化硼粉末、其制造方法、树脂组合物及树脂片
JP2019073409A (ja) * 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
CN112334408A (zh) * 2018-06-29 2021-02-05 电化株式会社 块状氮化硼粒子、氮化硼粉末、氮化硼粉末的制造方法、树脂组合物、及散热构件

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JPH01179763A (ja) * 1988-01-05 1989-07-17 Showa Denko Kk 窒化ホウ素と窒化ケイ素の複合焼結体の製造方法
CN102574684B (zh) 2009-10-09 2015-04-29 水岛合金铁株式会社 六方氮化硼粉末及其制备方法
MY170639A (en) * 2011-11-29 2019-08-21 Mitsubishi Chem Corp Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
CN104470873B (zh) * 2012-06-27 2016-11-02 水岛合金铁株式会社 带凹部的bn球状烧结粒子及其制造方法以及高分子材料
US9656868B2 (en) * 2013-03-07 2017-05-23 Denka Company Limited Boron-nitride powder and resin composition containing same
JP6256158B2 (ja) * 2014-03-31 2018-01-10 三菱ケミカル株式会社 放熱シートおよび放熱シート製造方法、放熱シート用スラリー、並びにパワーデバイス装置
FR3037579B1 (fr) * 2015-06-17 2017-06-16 Saint-Gobain Centre De Rech Et D'Etudes Europeen Poudre d'agregats a base de nitrure de bore
CN107848801B (zh) * 2015-09-03 2021-01-12 昭和电工株式会社 六方晶氮化硼粉末、其制造方法、树脂组合物及树脂片
US10487013B2 (en) * 2016-03-10 2019-11-26 Denka Company Limited Ceramic resin composite body
EP3257810B1 (en) * 2016-06-16 2019-11-13 3M Innovative Properties Company Formed hexagonal boron nitride body, hexagonal boron nitride granulates for making the same, and process for producing the same
WO2018181605A1 (ja) * 2017-03-29 2018-10-04 株式会社キュアテックス 和紙糸の編物又は織物を含む農園芸用資材
KR102438540B1 (ko) * 2017-03-29 2022-08-30 덴카 주식회사 전열 부재 및 이것을 포함하는 방열 구조체
US20220154059A1 (en) * 2019-03-27 2022-05-19 Denka Company Limited Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member
JP7079378B2 (ja) * 2019-03-28 2022-06-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材

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CN106029561A (zh) * 2014-02-05 2016-10-12 三菱化学株式会社 氮化硼凝集颗粒、氮化硼凝集颗粒的制造方法、含该氮化硼凝集颗粒的树脂组合物、成型体、和片
WO2016092952A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
WO2016092951A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
CN108473308A (zh) * 2016-02-22 2018-08-31 昭和电工株式会社 六方晶氮化硼粉末、其制造方法、树脂组合物及树脂片
JP2019073409A (ja) * 2017-10-13 2019-05-16 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
CN112334408A (zh) * 2018-06-29 2021-02-05 电化株式会社 块状氮化硼粒子、氮化硼粉末、氮化硼粉末的制造方法、树脂组合物、及散热构件

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TWI864381B (zh) 2024-12-01
KR20230156791A (ko) 2023-11-14
WO2022202824A1 (ja) 2022-09-29
JPWO2022202824A1 (https=) 2022-09-29
JP7289019B2 (ja) 2023-06-08
KR102935933B1 (ko) 2026-03-06
TW202300445A (zh) 2023-01-01
US20240174908A1 (en) 2024-05-30

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