JP7287606B2 - 鉛フリーはんだ合金 - Google Patents

鉛フリーはんだ合金 Download PDF

Info

Publication number
JP7287606B2
JP7287606B2 JP2018181045A JP2018181045A JP7287606B2 JP 7287606 B2 JP7287606 B2 JP 7287606B2 JP 2018181045 A JP2018181045 A JP 2018181045A JP 2018181045 A JP2018181045 A JP 2018181045A JP 7287606 B2 JP7287606 B2 JP 7287606B2
Authority
JP
Japan
Prior art keywords
lead
mass
free solder
solder alloy
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018181045A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020025982A5 (enExample
JP2020025982A (ja
Inventor
哲郎 西村
貴利 西村
徹哉 赤岩
将一 末永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Superior Sha Co Ltd
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Priority to CN201980062723.5A priority Critical patent/CN112752630A/zh
Priority to KR1020217011906A priority patent/KR102853795B1/ko
Priority to PCT/JP2019/037903 priority patent/WO2020067307A1/ja
Publication of JP2020025982A publication Critical patent/JP2020025982A/ja
Publication of JP2020025982A5 publication Critical patent/JP2020025982A5/ja
Application granted granted Critical
Publication of JP7287606B2 publication Critical patent/JP7287606B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2018181045A 2018-08-10 2018-09-26 鉛フリーはんだ合金 Active JP7287606B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201980062723.5A CN112752630A (zh) 2018-08-10 2019-09-26 无铅焊料合金
KR1020217011906A KR102853795B1 (ko) 2018-08-10 2019-09-26 무연땜납합금
PCT/JP2019/037903 WO2020067307A1 (ja) 2018-08-10 2019-09-26 鉛フリーはんだ合金

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018151991 2018-08-10
JP2018151991 2018-08-10

Publications (3)

Publication Number Publication Date
JP2020025982A JP2020025982A (ja) 2020-02-20
JP2020025982A5 JP2020025982A5 (enExample) 2022-01-11
JP7287606B2 true JP7287606B2 (ja) 2023-06-06

Family

ID=69620807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018181045A Active JP7287606B2 (ja) 2018-08-10 2018-09-26 鉛フリーはんだ合金

Country Status (4)

Country Link
JP (1) JP7287606B2 (enExample)
KR (1) KR102853795B1 (enExample)
CN (1) CN112752630A (enExample)
WO (1) WO2020067307A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007623B1 (ja) 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手
JP2023060639A (ja) * 2021-10-18 2023-04-28 Tdk株式会社 はんだ組成物および電子部品
CN114055010A (zh) * 2021-11-05 2022-02-18 安徽工业大学 一种含微量Ge的铜基合金钎料、制备方法及其钎焊方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016129908A (ja) 2014-04-30 2016-07-21 株式会社日本スペリア社 鉛フリーはんだ合金
JP2017087248A (ja) 2015-11-08 2017-05-25 株式会社日本スペリア社 はんだペースト組成物
JP2018043265A (ja) 2016-09-13 2018-03-22 千住金属工業株式会社 はんだ合金、はんだボールおよびはんだ継手
WO2018174162A1 (ja) 2017-03-23 2018-09-27 株式会社日本スペリア社 はんだ継手
JP2019141881A (ja) 2018-02-21 2019-08-29 千住金属工業株式会社 鉛フリーはんだ合金

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69918758T2 (de) * 1998-03-26 2004-11-25 Nihon Superior Sha Co., Ltd., Suita Bleifreie Lötlegierung
CN101288923A (zh) * 2008-02-27 2008-10-22 重庆机电职业技术学院 一种低铜亚共晶Sn-Cu无铅钎料
KR101184234B1 (ko) * 2008-04-23 2012-09-19 센주긴조쿠고교 가부시키가이샤 납프리 땜납
JP2011156558A (ja) * 2010-01-30 2011-08-18 Nihon Superior Co Ltd 鉛フリーはんだ合金
WO2012131861A1 (ja) * 2011-03-28 2012-10-04 千住金属工業株式会社 鉛フリーはんだボール
GR1009565B (el) 2016-07-14 2019-08-06 Galenica Α.Ε. Νεα παραγωγα 1,2,4-τριαζολο-[3,4-b]-1,3,4-θειαδιαζολιων

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016129908A (ja) 2014-04-30 2016-07-21 株式会社日本スペリア社 鉛フリーはんだ合金
JP2017087248A (ja) 2015-11-08 2017-05-25 株式会社日本スペリア社 はんだペースト組成物
JP2018043265A (ja) 2016-09-13 2018-03-22 千住金属工業株式会社 はんだ合金、はんだボールおよびはんだ継手
WO2018174162A1 (ja) 2017-03-23 2018-09-27 株式会社日本スペリア社 はんだ継手
JP2019141881A (ja) 2018-02-21 2019-08-29 千住金属工業株式会社 鉛フリーはんだ合金

Also Published As

Publication number Publication date
KR102853795B1 (ko) 2025-09-01
KR20210062060A (ko) 2021-05-28
WO2020067307A1 (ja) 2020-04-02
JP2020025982A (ja) 2020-02-20
CN112752630A (zh) 2021-05-04

Similar Documents

Publication Publication Date Title
RU2662176C2 (ru) Бессвинцовый припой
TWI742813B (zh) 高溫超高可靠性合金
TWI383052B (zh) Low silver solder alloy and solder paste composition
CN103561903B (zh) 无铅焊料合金
JP6145164B2 (ja) 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路
JP2013252548A (ja) 微細部品接合用のソルダペースト
JPWO2004089573A1 (ja) ソルダペーストおよびプリント基板
JPWO2018174162A1 (ja) はんだ継手
JP2002018589A (ja) 鉛フリーはんだ合金
JP7287606B2 (ja) 鉛フリーはんだ合金
JP2011156558A (ja) 鉛フリーはんだ合金
JP2004298931A (ja) 高温鉛フリーはんだ合金および電子部品
JP4135268B2 (ja) 無鉛はんだ合金
JP5140644B2 (ja) はんだ付け組成物および電子部品
CN106715040B (zh) 焊料合金以及使用其的安装结构体
JP2019136776A (ja) はんだ接合方法
JP3423387B2 (ja) 電子部品用はんだ合金
JP3597607B2 (ja) はんだ合金及びペ−スト状はんだ
KR101142814B1 (ko) 저은 땜납 합금 및 땜납 페이스트 조성물
WO2007014530A1 (fr) Alliage de brasage sans plomb contenant un systeme sn-ag-cu-ni-al
JP4979120B2 (ja) 鉛フリー半田合金
WO2019053866A1 (ja) 鉛フリーはんだ合金、電子回路基板及び電子制御装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181015

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191108

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210922

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221025

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221223

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230418

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230515

R150 Certificate of patent or registration of utility model

Ref document number: 7287606

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150