KR102853795B1 - 무연땜납합금 - Google Patents
무연땜납합금Info
- Publication number
- KR102853795B1 KR102853795B1 KR1020217011906A KR20217011906A KR102853795B1 KR 102853795 B1 KR102853795 B1 KR 102853795B1 KR 1020217011906 A KR1020217011906 A KR 1020217011906A KR 20217011906 A KR20217011906 A KR 20217011906A KR 102853795 B1 KR102853795 B1 KR 102853795B1
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- lead
- free solder
- solder alloy
- addition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018151991 | 2018-08-10 | ||
| JPJP-P-2018-181045 | 2018-09-26 | ||
| JP2018181045A JP7287606B2 (ja) | 2018-08-10 | 2018-09-26 | 鉛フリーはんだ合金 |
| PCT/JP2019/037903 WO2020067307A1 (ja) | 2018-08-10 | 2019-09-26 | 鉛フリーはんだ合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210062060A KR20210062060A (ko) | 2021-05-28 |
| KR102853795B1 true KR102853795B1 (ko) | 2025-09-01 |
Family
ID=69620807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217011906A Active KR102853795B1 (ko) | 2018-08-10 | 2019-09-26 | 무연땜납합금 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7287606B2 (enExample) |
| KR (1) | KR102853795B1 (enExample) |
| CN (1) | CN112752630A (enExample) |
| WO (1) | WO2020067307A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7007623B1 (ja) | 2021-08-27 | 2022-01-24 | 千住金属工業株式会社 | はんだ合金及びはんだ継手 |
| JP2023060639A (ja) * | 2021-10-18 | 2023-04-28 | Tdk株式会社 | はんだ組成物および電子部品 |
| CN114055010A (zh) * | 2021-11-05 | 2022-02-18 | 安徽工业大学 | 一种含微量Ge的铜基合金钎料、制备方法及其钎焊方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101288923A (zh) * | 2008-02-27 | 2008-10-22 | 重庆机电职业技术学院 | 一种低铜亚共晶Sn-Cu无铅钎料 |
| JP5872114B1 (ja) * | 2014-04-30 | 2016-03-01 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ID22854A (id) * | 1998-03-26 | 1999-12-09 | Nihon Superior Sha Co Ltd | Campuran solder bebas timbel |
| JP4968381B2 (ja) * | 2008-04-23 | 2012-07-04 | 千住金属工業株式会社 | 鉛フリーはんだ |
| JP2011156558A (ja) * | 2010-01-30 | 2011-08-18 | Nihon Superior Co Ltd | 鉛フリーはんだ合金 |
| WO2012131861A1 (ja) * | 2011-03-28 | 2012-10-04 | 千住金属工業株式会社 | 鉛フリーはんだボール |
| JP2017087248A (ja) * | 2015-11-08 | 2017-05-25 | 株式会社日本スペリア社 | はんだペースト組成物 |
| GR1009565B (el) | 2016-07-14 | 2019-08-06 | Galenica Α.Ε. | Νεα παραγωγα 1,2,4-τριαζολο-[3,4-b]-1,3,4-θειαδιαζολιων |
| JP6119912B1 (ja) * | 2016-09-13 | 2017-04-26 | 千住金属工業株式会社 | はんだ合金、はんだボールおよびはんだ継手 |
| WO2018174162A1 (ja) * | 2017-03-23 | 2018-09-27 | 株式会社日本スペリア社 | はんだ継手 |
| JP2019141881A (ja) * | 2018-02-21 | 2019-08-29 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
-
2018
- 2018-09-26 JP JP2018181045A patent/JP7287606B2/ja active Active
-
2019
- 2019-09-26 KR KR1020217011906A patent/KR102853795B1/ko active Active
- 2019-09-26 WO PCT/JP2019/037903 patent/WO2020067307A1/ja not_active Ceased
- 2019-09-26 CN CN201980062723.5A patent/CN112752630A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101288923A (zh) * | 2008-02-27 | 2008-10-22 | 重庆机电职业技术学院 | 一种低铜亚共晶Sn-Cu无铅钎料 |
| JP5872114B1 (ja) * | 2014-04-30 | 2016-03-01 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112752630A (zh) | 2021-05-04 |
| KR20210062060A (ko) | 2021-05-28 |
| WO2020067307A1 (ja) | 2020-04-02 |
| JP7287606B2 (ja) | 2023-06-06 |
| JP2020025982A (ja) | 2020-02-20 |
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| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| T11-X000 | Administrative time limit extension requested |
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St.27 status event code: A-2-2-P10-P11-nap-X000 |
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