JP7276348B2 - シルセスキオキサン誘導体組成物及びその利用 - Google Patents

シルセスキオキサン誘導体組成物及びその利用 Download PDF

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JP7276348B2
JP7276348B2 JP2020553021A JP2020553021A JP7276348B2 JP 7276348 B2 JP7276348 B2 JP 7276348B2 JP 2020553021 A JP2020553021 A JP 2020553021A JP 2020553021 A JP2020553021 A JP 2020553021A JP 7276348 B2 JP7276348 B2 JP 7276348B2
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silsesquioxane derivative
polymerizable functional
carbon atoms
oxygen storage
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JPWO2020080081A1 (ja
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賢明 岩瀬
武士 藤田
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Toagosei Co Ltd
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Toagosei Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F30/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F30/04—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F30/08—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2020553021A 2018-10-18 2019-09-30 シルセスキオキサン誘導体組成物及びその利用 Active JP7276348B2 (ja)

Applications Claiming Priority (3)

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JP2018196951 2018-10-18
JP2018196951 2018-10-18
PCT/JP2019/038571 WO2020080081A1 (ja) 2018-10-18 2019-09-30 シルセスキオキサン誘導体組成物及びその利用

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JPWO2020080081A1 JPWO2020080081A1 (ja) 2021-09-02
JP7276348B2 true JP7276348B2 (ja) 2023-05-18

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JP (1) JP7276348B2 (zh)
KR (1) KR102640556B1 (zh)
CN (1) CN112888715B (zh)
TW (1) TW202035570A (zh)
WO (1) WO2020080081A1 (zh)

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Publication number Priority date Publication date Assignee Title
JP7500899B2 (ja) * 2020-10-29 2024-06-18 サカタインクス株式会社 活性エネルギー線硬化型組成物
WO2022168804A1 (ja) * 2021-02-05 2022-08-11 東亞合成株式会社 無機物質層積層用アンダーコート剤組成物、その硬化物及びその製造方法

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JP2011148784A (ja) 2009-12-24 2011-08-04 Dow Corning Toray Co Ltd 化粧料用粉体表面処理剤、及び、当該化粧料用粉体表面処理剤によって表面処理された粉体を含む化粧料
WO2011155482A1 (ja) 2010-06-08 2011-12-15 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP2013544902A (ja) 2010-09-29 2013-12-19 ワッカー ケミー アクチエンゲゼルシャフト 硬化性オルガノポリシロキサン組成物
WO2015072540A1 (ja) 2013-11-15 2015-05-21 株式会社コーセー テアニンを用いた表面処理粉体及びそれを含有する化粧料
JP2015515529A (ja) 2012-07-27 2015-05-28 エルジー・ケム・リミテッド 硬化性組成物
WO2015079677A1 (ja) 2013-11-29 2015-06-04 東レ・ダウコーニング株式会社 光学材料
CN106739277A (zh) 2016-11-16 2017-05-31 苏州大学 带有磁控溅射类金刚石碳膜的金属型材的制备方法与应用
WO2017150589A1 (ja) 2016-03-02 2017-09-08 Jnc株式会社 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法
CN107722828A (zh) 2017-09-29 2018-02-23 广东冠能电力科技发展有限公司 电抗器专用防污湿涂料及其制造方法

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WO2009054995A1 (en) * 2007-10-22 2009-04-30 Flexible Ceramics, Inc. Fire resistant flexible ceramic resin blend and composite products formed therefrom
WO2009066608A1 (ja) 2007-11-19 2009-05-28 Toagosei Co., Ltd. ポリシロキサンおよびその製造方法ならびに硬化物の製造方法
JP2009256662A (ja) * 2008-03-26 2009-11-05 Nagase Chemtex Corp シルセスキオキサン誘導体及びその製造方法
US20120225127A1 (en) * 2009-05-12 2012-09-06 Council Of Scientific & Industrial Research Clay nanocomposite forming microcapsule useful for guest encapsulation and process thereof
JP2015516417A (ja) * 2012-05-09 2015-06-11 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ シルセスキオキサン樹脂ワックス及び固体微粒子を含む、皮膚への適用のための組成物
JP6021605B2 (ja) * 2012-11-19 2016-11-09 新日鉄住金化学株式会社 かご型シルセスキオキサン化合物、それを用いた硬化性樹脂組成物及び樹脂硬化物
CN103305036B (zh) * 2013-06-18 2016-09-14 武汉绿凯科技有限公司 一种含poss减反射膜镀膜液及其制备方法与应用
JP6514427B2 (ja) * 2013-06-28 2019-05-15 サムスン エスディアイ カンパニー，リミテッドＳａｍｓｕｎｇ Ｓｄｉ Ｃｏ．，Ｌｔｄ． 樹脂膜、樹脂膜の製造方法、及び塗工液
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004002653A (ja) 2002-04-22 2004-01-08 Shin Kobe Electric Mach Co Ltd プリント基板用プリプレグ及びその製造法とプリント基板
JP2011148784A (ja) 2009-12-24 2011-08-04 Dow Corning Toray Co Ltd 化粧料用粉体表面処理剤、及び、当該化粧料用粉体表面処理剤によって表面処理された粉体を含む化粧料
WO2011155482A1 (ja) 2010-06-08 2011-12-15 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP2013544902A (ja) 2010-09-29 2013-12-19 ワッカー ケミー アクチエンゲゼルシャフト 硬化性オルガノポリシロキサン組成物
JP2015515529A (ja) 2012-07-27 2015-05-28 エルジー・ケム・リミテッド 硬化性組成物
WO2015072540A1 (ja) 2013-11-15 2015-05-21 株式会社コーセー テアニンを用いた表面処理粉体及びそれを含有する化粧料
WO2015079677A1 (ja) 2013-11-29 2015-06-04 東レ・ダウコーニング株式会社 光学材料
WO2017150589A1 (ja) 2016-03-02 2017-09-08 Jnc株式会社 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法
CN106739277A (zh) 2016-11-16 2017-05-31 苏州大学 带有磁控溅射类金刚石碳膜的金属型材的制备方法与应用
CN107722828A (zh) 2017-09-29 2018-02-23 广东冠能电力科技发展有限公司 电抗器专用防污湿涂料及其制造方法

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KR102640556B1 (ko) 2024-02-27
WO2020080081A1 (ja) 2020-04-23
CN112888715A (zh) 2021-06-01
JPWO2020080081A1 (ja) 2021-09-02
TW202035570A (zh) 2020-10-01
CN112888715B (zh) 2023-11-03
KR20210068108A (ko) 2021-06-08

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