JP7263060B2 - 電気的接続装置 - Google Patents

電気的接続装置 Download PDF

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Publication number
JP7263060B2
JP7263060B2 JP2019043733A JP2019043733A JP7263060B2 JP 7263060 B2 JP7263060 B2 JP 7263060B2 JP 2019043733 A JP2019043733 A JP 2019043733A JP 2019043733 A JP2019043733 A JP 2019043733A JP 7263060 B2 JP7263060 B2 JP 7263060B2
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JP
Japan
Prior art keywords
connector
electrode
liquid metal
electrode region
contact
Prior art date
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Active
Application number
JP2019043733A
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English (en)
Japanese (ja)
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JP2020148479A5 (enExample
JP2020148479A (ja
Inventor
翔 原子
昇 小田部
浩 神谷
美行 深見
正吾 水谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2019043733A priority Critical patent/JP7263060B2/ja
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to PCT/JP2019/048940 priority patent/WO2020183832A1/ja
Priority to CN201980093681.1A priority patent/CN113544519B/zh
Priority to KR1020217029622A priority patent/KR102622884B1/ko
Priority to US17/432,550 priority patent/US12244083B2/en
Priority to TW108147511A priority patent/TWI718826B/zh
Publication of JP2020148479A publication Critical patent/JP2020148479A/ja
Publication of JP2020148479A5 publication Critical patent/JP2020148479A5/ja
Application granted granted Critical
Publication of JP7263060B2 publication Critical patent/JP7263060B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/91—Coupling devices allowing relative movement between coupling parts, e.g. floating or self aligning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R3/00—Electrically-conductive connections not otherwise provided for
    • H01R3/08—Electrically-conductive connections not otherwise provided for for making connection to a liquid

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2019043733A 2019-03-11 2019-03-11 電気的接続装置 Active JP7263060B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019043733A JP7263060B2 (ja) 2019-03-11 2019-03-11 電気的接続装置
CN201980093681.1A CN113544519B (zh) 2019-03-11 2019-12-13 电性连接装置
KR1020217029622A KR102622884B1 (ko) 2019-03-11 2019-12-13 전기적 접속장치
US17/432,550 US12244083B2 (en) 2019-03-11 2019-12-13 Electrical connecting apparatus
PCT/JP2019/048940 WO2020183832A1 (ja) 2019-03-11 2019-12-13 電気的接続装置
TW108147511A TWI718826B (zh) 2019-03-11 2019-12-25 電性連接裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019043733A JP7263060B2 (ja) 2019-03-11 2019-03-11 電気的接続装置

Publications (3)

Publication Number Publication Date
JP2020148479A JP2020148479A (ja) 2020-09-17
JP2020148479A5 JP2020148479A5 (enExample) 2022-02-28
JP7263060B2 true JP7263060B2 (ja) 2023-04-24

Family

ID=72426375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019043733A Active JP7263060B2 (ja) 2019-03-11 2019-03-11 電気的接続装置

Country Status (6)

Country Link
US (1) US12244083B2 (enExample)
JP (1) JP7263060B2 (enExample)
KR (1) KR102622884B1 (enExample)
CN (1) CN113544519B (enExample)
TW (1) TWI718826B (enExample)
WO (1) WO2020183832A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7142225B2 (ja) 2020-09-03 2022-09-27 パナソニックＩｐマネジメント株式会社 食品管理システム、及び冷蔵庫
CN113410219A (zh) * 2021-07-17 2021-09-17 北京梦之墨科技有限公司 一种led贴膜屏及其制作方法
US20240297119A1 (en) * 2021-12-22 2024-09-05 Intel Corporation Liquid metal connection device and method
US12635564B2 (en) * 2022-07-02 2026-05-19 Intel Corporation Liquid metal based first level interconnects
US12431260B2 (en) * 2022-09-23 2025-09-30 Caterpillar Inc. High-velocity air-fuel coatings for conductor corrosion resistance
US20240363520A1 (en) * 2023-04-25 2024-10-31 Intel Corporation Self-healing cap for liquid metal containment in socket applications
CN119485917B (zh) 2023-08-09 2025-12-16 宏启胜精密电子(秦皇岛)有限公司 具有内埋电阻的电路板及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000036657A (ja) 1998-07-21 2000-02-02 Fujitsu Ltd 電子装置およびその製造方法
US20090193652A1 (en) 2005-08-01 2009-08-06 Salmon Peter C Scalable subsystem architecture having integrated cooling channels
JP2009295707A (ja) 2008-06-04 2009-12-17 Hide Jinbo プローブ検査方法
JP2012249155A (ja) 2011-05-30 2012-12-13 Nikon Corp 電子機器

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JPS53112484A (en) * 1977-03-11 1978-09-30 Daiden Co Ltd Device for connecting electric wire
JPS59111341A (ja) * 1982-12-17 1984-06-27 Hitachi Ltd Ｉｃ素子試験用治工具
JPS61124071A (ja) * 1984-11-20 1986-06-11 富士通株式会社 電気的接続装置
JPS62105379A (ja) * 1985-11-01 1987-05-15 株式会社日立製作所 コネクタ装置
JPS62295371A (ja) * 1986-06-13 1987-12-22 株式会社日立製作所 コネクタ
JPS6314274A (ja) 1986-07-03 1988-01-21 Nec Corp 患者予約最適化方式
JPS63141274A (ja) * 1986-12-01 1988-06-13 株式会社日立製作所 コネクタ装置
JPH01221877A (ja) * 1988-02-29 1989-09-05 Toshiba Corp 検査用ソケット
SU1758740A1 (ru) * 1989-12-05 1992-08-30 Львовский политехнический институт им.Ленинского комсомола Жидкостное токосъемное устройство
JPH03241851A (ja) * 1990-02-20 1991-10-29 Sumitomo Electric Ind Ltd 半導体装置用保存治具
JPH0495845A (ja) * 1990-08-10 1992-03-27 Matsushita Electric Ind Co Ltd 配向膜の液晶配向能評価方法
JPH04127066A (ja) * 1990-09-18 1992-04-28 Fujitsu Ltd 信号端子接続方法および信号端子接続装置
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JPH08236179A (ja) * 1995-02-27 1996-09-13 Fujitsu Ltd 電気的接続装置及びその形成方法
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CN203466320U (zh) * 2013-09-20 2014-03-05 番禺得意精密电子工业有限公司 电连接器
TWI603089B (zh) 2016-08-04 2017-10-21 創意電子股份有限公司 測試裝置與其探針連接器
JP2018064063A (ja) * 2016-10-14 2018-04-19 イリソ電子工業株式会社 回路基板及び回路装置
CN107104298B (zh) * 2017-04-28 2019-06-11 番禺得意精密电子工业有限公司 电连接器及其制造方法
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000036657A (ja) 1998-07-21 2000-02-02 Fujitsu Ltd 電子装置およびその製造方法
US20090193652A1 (en) 2005-08-01 2009-08-06 Salmon Peter C Scalable subsystem architecture having integrated cooling channels
JP2009295707A (ja) 2008-06-04 2009-12-17 Hide Jinbo プローブ検査方法
JP2012249155A (ja) 2011-05-30 2012-12-13 Nikon Corp 電子機器

Also Published As

Publication number Publication date
CN113544519B (zh) 2024-09-10
WO2020183832A1 (ja) 2020-09-17
US20220149549A1 (en) 2022-05-12
KR102622884B1 (ko) 2024-01-09
JP2020148479A (ja) 2020-09-17
US12244083B2 (en) 2025-03-04
KR20210126717A (ko) 2021-10-20
TW202040136A (zh) 2020-11-01
TWI718826B (zh) 2021-02-11
CN113544519A (zh) 2021-10-22

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