JP7258414B2 - 光デバイスウェーハの加工方法 - Google Patents
光デバイスウェーハの加工方法 Download PDFInfo
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- JP7258414B2 JP7258414B2 JP2018159593A JP2018159593A JP7258414B2 JP 7258414 B2 JP7258414 B2 JP 7258414B2 JP 2018159593 A JP2018159593 A JP 2018159593A JP 2018159593 A JP2018159593 A JP 2018159593A JP 7258414 B2 JP7258414 B2 JP 7258414B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Description
繰り返し周波数 :50kHzから200kHz
パルスエネルギー:0.5μJから10μJ
平均出力 :0.1Wから2W
パルス幅 :1psから20ps
スポット径 :10μmから50μm
11a 表面
11b 裏面
13 分割予定ライン(ストリート)
15 光デバイス
17 バッファ層
19 光デバイス層
19a p型GaN層
19b n型GaN層
19c 表面
20 ドライエッチング装置
21 光デバイスウェーハ
22 真空チャンバ
23a デバイス領域
23b 外周余剰領域
24a 下部電極
24b 上部電極
24c ブロッキングコンデンサ
25 レジスト膜
26 高周波電源
27 分割溝
28a ガス導入口
28b ガス排出口
31 移設部材
31a 表面
31b 裏面
33 複合基板
34 静電チャック
40 レーザー加工装置
42 チャックテーブル
42a 保持面
44 レーザー発振器
46 調整器
48 ガルバノスキャナー
50 Xスキャンミラー
50a 第1の回転軸
50b 第1のモーター
52 Yスキャンミラー
52a 第2の回転軸
52b 第2のモーター
54 集光器
56 テレセントリックfθレンズ
60 剥離装置
62 チャックテーブル
62a 保持面
64 発振器
66 超音波ホーン
66a 先端
T 厚さ
L1 パルスレーザービーム
L2 パルスレーザービーム
Claims (3)
- 複数の分割予定ラインで区画された複数の領域の各々に光デバイスが設けられた光デバイス層が1枚の円盤状の結晶性基板の表面にバッファ層を介して積層されている光デバイスウェーハの該光デバイス層を、移設部材に移し替える光デバイスウェーハの加工方法であって、
該光デバイスウェーハの該バッファ層を完全には分断しない分割溝を分割予定ラインに沿って該光デバイス層側に形成する分割溝形成ステップと、
該分割溝形成ステップの後、該光デバイス層の表面に該移設部材を接合する移設部材接合ステップと、
該移設部材が接合された光デバイスウェーハの該移設部材とは反対側に位置する該1枚の円盤状の結晶性基板の裏面側から、該1枚の円盤状の結晶性基板に対しては透過性を有し該バッファ層に対しては吸収性を有する波長のパルスレーザービームを照射するレーザービーム照射ステップと、
該レーザービーム照射ステップの後に、超音波振動を利用することで該1枚の円盤状の結晶性基板を該光デバイス層から剥離して該光デバイス層を該移設部材に移設する結晶性基板剥離ステップと、
を含み、
該レーザービーム照射ステップでは、該分割溝形成ステップで分断されずに残った該バッファ層と該光デバイス層の一部とを変質させることを特徴とする光デバイスウェーハの加工方法。 - 該分割溝形成ステップでは、エッチングにより該分割溝が形成され、
該分割溝形成ステップの前に、該光デバイス層の該表面側に位置し該分割予定ラインを除く領域を、レジスト膜で被覆するレジスト膜被覆ステップを更に含むことを特徴とする請求項1に記載の光デバイスウェーハの加工方法。 - 該レーザービーム照射ステップで該パルスレーザービームが照射される該バッファ層と該光デバイス層の一部との合計の厚さは、1μm以下であることを特徴とする請求項1又は2に記載の光デバイスウェーハの加工方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2018159593A JP7258414B2 (ja) | 2018-08-28 | 2018-08-28 | 光デバイスウェーハの加工方法 |
KR1020190086370A KR20200024706A (ko) | 2018-08-28 | 2019-07-17 | 광 디바이스 웨이퍼의 가공 방법 |
CN201910751839.1A CN110911530A (zh) | 2018-08-28 | 2019-08-15 | 光器件晶片的加工方法 |
US16/546,955 US10916679B2 (en) | 2018-08-28 | 2019-08-21 | Optical device wafer processing method |
TW108130350A TWI811437B (zh) | 2018-08-28 | 2019-08-23 | 光元件晶圓加工方法 |
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JP2018159593A JP7258414B2 (ja) | 2018-08-28 | 2018-08-28 | 光デバイスウェーハの加工方法 |
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JP2020035829A JP2020035829A (ja) | 2020-03-05 |
JP7258414B2 true JP7258414B2 (ja) | 2023-04-17 |
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US (1) | US10916679B2 (ja) |
JP (1) | JP7258414B2 (ja) |
KR (1) | KR20200024706A (ja) |
CN (1) | CN110911530A (ja) |
TW (1) | TWI811437B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7287982B2 (ja) * | 2018-12-21 | 2023-06-06 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
US20220040799A1 (en) * | 2018-12-21 | 2022-02-10 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
JP7333192B2 (ja) * | 2019-04-23 | 2023-08-24 | 株式会社ディスコ | 移設方法 |
JP7477835B2 (ja) * | 2020-04-15 | 2024-05-02 | 株式会社デンソー | 半導体チップの製造方法 |
JP7458910B2 (ja) | 2020-06-18 | 2024-04-01 | 株式会社ディスコ | デバイスの製造方法 |
WO2022185906A1 (ja) | 2021-03-04 | 2022-09-09 | 信越半導体株式会社 | 紫外線発光素子用エピタキシャルウェーハの製造方法、紫外線発光素子用基板の製造方法、紫外線発光素子用エピタキシャルウェーハ及び紫外線発光素子用基板 |
TWI808471B (zh) * | 2021-08-19 | 2023-07-11 | 歆熾電氣技術股份有限公司 | 用於轉移電子元件的裝置及轉移電子元件之方法 |
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JP2007165858A (ja) | 2005-12-09 | 2007-06-28 | Samsung Electro Mech Co Ltd | 垂直構造の窒化物半導体素子の製造方法 |
JP2007207981A (ja) | 2006-02-01 | 2007-08-16 | Rohm Co Ltd | 窒化物半導体発光素子の製造方法 |
JP2013106020A (ja) | 2011-11-17 | 2013-05-30 | Stanley Electric Co Ltd | 半導体発光装置および半導体発光装置の製造方法 |
JP2013149717A (ja) | 2012-01-18 | 2013-08-01 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
JP2014007179A (ja) | 2012-06-21 | 2014-01-16 | Panasonic Corp | 縦型構造発光素子の製造方法 |
JP2017103405A (ja) | 2015-12-04 | 2017-06-08 | 株式会社ディスコ | ウエーハの加工方法 |
JP2017123400A (ja) | 2016-01-07 | 2017-07-13 | 株式会社ディスコ | チャックテーブル |
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JPH10305420A (ja) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法 |
JP2004072052A (ja) | 2002-08-09 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US7202141B2 (en) * | 2004-03-29 | 2007-04-10 | J.P. Sercel Associates, Inc. | Method of separating layers of material |
CN103620742B (zh) * | 2011-07-01 | 2016-05-25 | 古河电气工业株式会社 | 粘接膜、切割芯片接合膜及使用该切割芯片接合膜的半导体加工方法 |
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- 2018-08-28 JP JP2018159593A patent/JP7258414B2/ja active Active
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2019
- 2019-07-17 KR KR1020190086370A patent/KR20200024706A/ko not_active Application Discontinuation
- 2019-08-15 CN CN201910751839.1A patent/CN110911530A/zh active Pending
- 2019-08-21 US US16/546,955 patent/US10916679B2/en active Active
- 2019-08-23 TW TW108130350A patent/TWI811437B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004363532A (ja) | 2003-06-03 | 2004-12-24 | Samsung Electro Mech Co Ltd | 垂直構造窒化ガリウム系発光ダイオードの製造方法 |
JP2007165858A (ja) | 2005-12-09 | 2007-06-28 | Samsung Electro Mech Co Ltd | 垂直構造の窒化物半導体素子の製造方法 |
JP2007207981A (ja) | 2006-02-01 | 2007-08-16 | Rohm Co Ltd | 窒化物半導体発光素子の製造方法 |
JP2013106020A (ja) | 2011-11-17 | 2013-05-30 | Stanley Electric Co Ltd | 半導体発光装置および半導体発光装置の製造方法 |
JP2013149717A (ja) | 2012-01-18 | 2013-08-01 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
JP2014007179A (ja) | 2012-06-21 | 2014-01-16 | Panasonic Corp | 縦型構造発光素子の製造方法 |
JP2017103405A (ja) | 2015-12-04 | 2017-06-08 | 株式会社ディスコ | ウエーハの加工方法 |
JP2017123400A (ja) | 2016-01-07 | 2017-07-13 | 株式会社ディスコ | チャックテーブル |
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Publication number | Publication date |
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TWI811437B (zh) | 2023-08-11 |
CN110911530A (zh) | 2020-03-24 |
JP2020035829A (ja) | 2020-03-05 |
KR20200024706A (ko) | 2020-03-09 |
US10916679B2 (en) | 2021-02-09 |
US20200075796A1 (en) | 2020-03-05 |
TW202010010A (zh) | 2020-03-01 |
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