JP7251719B2 - スティフナ及びこれを含むパッケージ基板 - Google Patents

スティフナ及びこれを含むパッケージ基板 Download PDF

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Publication number
JP7251719B2
JP7251719B2 JP2018131955A JP2018131955A JP7251719B2 JP 7251719 B2 JP7251719 B2 JP 7251719B2 JP 2018131955 A JP2018131955 A JP 2018131955A JP 2018131955 A JP2018131955 A JP 2018131955A JP 7251719 B2 JP7251719 B2 JP 7251719B2
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Prior art keywords
circuit board
printed circuit
stiffener
coupled
package substrate
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JP2018131955A
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Japanese (ja)
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JP2019080040A (ja
Inventor
ヤン、ウー－ソク
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サムソン エレクトロ－メカニックス カンパニーリミテッド．
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2018131955A 2017-10-19 2018-07-12 スティフナ及びこれを含むパッケージ基板 Active JP7251719B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0135986 2017-10-19
KR1020170135986A KR102516767B1 (ko) 2017-10-19 2017-10-19 스티프너 및 이를 포함하는 패키지 기판

Publications (2)

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JP2019080040A JP2019080040A (ja) 2019-05-23
JP7251719B2 true JP7251719B2 (ja) 2023-04-04

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ID=66282478

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JP2018131955A Active JP7251719B2 (ja) 2017-10-19 2018-07-12 スティフナ及びこれを含むパッケージ基板

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JP (1) JP7251719B2 (ko)
KR (1) KR102516767B1 (ko)
TW (1) TWI793140B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102596757B1 (ko) 2020-03-27 2023-11-02 삼성전자주식회사 스티프너를 갖는 반도체 패키지
KR102557352B1 (ko) 2020-12-31 2023-07-19 스노우화이트팩토리(주) 생열귀나무 추출물을 유효성분으로 포함하는 치주 질환의 예방 또는 치료용 조성물
CN117295252A (zh) * 2022-06-20 2023-12-26 华为技术有限公司 电路板组件、电子设备及电路板组件的制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004342811A (ja) 2003-05-15 2004-12-02 Toyo Commun Equip Co Ltd 電子部品用パッケージ及びこれを用いた圧電発振器
JP2006330260A (ja) 2005-05-25 2006-12-07 Fujikura Ltd 光コネクタ
JP2011066027A (ja) 2009-09-15 2011-03-31 Nec Corp 矯正キャップ
US20110215463A1 (en) 2010-03-05 2011-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Compressive ring structure for flip chip packaging
US20110235304A1 (en) 2010-03-23 2011-09-29 Alcatel-Lucent Canada, Inc. Ic package stiffener with beam
US20160073493A1 (en) 2014-09-05 2016-03-10 Andrew KW Leung Stiffener ring for circuit board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2814966B2 (ja) * 1995-09-29 1998-10-27 日本電気株式会社 半導体装置
US6655788B1 (en) * 2002-05-17 2003-12-02 Viztec Inc. Composite structure for enhanced flexibility of electro-optic displays with sliding layers
KR20100134338A (ko) 2009-06-15 2010-12-23 (주)인터플렉스 인쇄회로기판용 보강판 및 이를 구비한 인쇄회로기판
KR20130068901A (ko) * 2011-12-16 2013-06-26 삼성전자주식회사 단말기의 쉴드캔 장치 및 이의 조립 방법
TWI516664B (zh) * 2013-06-04 2016-01-11 坴賦佳金屬有限公司 綠建材多層次防火複合鋼板結構
KR20150046491A (ko) * 2013-10-22 2015-04-30 엘지이노텍 주식회사 고정 장치 및 이를 구비한 전자 장치
KR20150113725A (ko) * 2014-03-31 2015-10-08 삼성전자주식회사 쉴드캔 고정구조
KR20160087470A (ko) * 2015-01-13 2016-07-22 삼성디스플레이 주식회사 액정 표시 장치
TW201709776A (zh) * 2015-08-28 2017-03-01 斐成企業股份有限公司 電路板、電子元件的殼體及濾波器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004342811A (ja) 2003-05-15 2004-12-02 Toyo Commun Equip Co Ltd 電子部品用パッケージ及びこれを用いた圧電発振器
JP2006330260A (ja) 2005-05-25 2006-12-07 Fujikura Ltd 光コネクタ
JP2011066027A (ja) 2009-09-15 2011-03-31 Nec Corp 矯正キャップ
US20110215463A1 (en) 2010-03-05 2011-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Compressive ring structure for flip chip packaging
US20110235304A1 (en) 2010-03-23 2011-09-29 Alcatel-Lucent Canada, Inc. Ic package stiffener with beam
US20160073493A1 (en) 2014-09-05 2016-03-10 Andrew KW Leung Stiffener ring for circuit board

Also Published As

Publication number Publication date
KR102516767B1 (ko) 2023-03-31
KR20190043902A (ko) 2019-04-29
JP2019080040A (ja) 2019-05-23
TWI793140B (zh) 2023-02-21
TW201918130A (zh) 2019-05-01

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