JP7250690B2 - 素子の移載方法およびそれに用いる移載版 - Google Patents
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Description
そして、その小型ユニットを必要な数だけ縦横に接続して、上記ディスプレイが形成される。
〔1〕複数個の素子が、それぞれ独立した状態で剥離可能に粘着されている第1の粘着性フィルムを準備する工程と、
上記第1の粘着性フィルムよりも粘着力が大きい移載版を、上記複数個の素子の少なくとも一部に密着させ、上記第1の粘着性フィルムと上記移載版との粘着力の差を利用して、上記第1の粘着性フィルムに粘着している複数個の素子の少なくとも一部を、その第1の粘着性フィルムから剥離し、上記移載版に剥離可能に粘着する工程と、
上記移載版よりも粘着力が大きい第2の粘着性フィルムを準備し、上記移載版に粘着している複数個の素子の少なくとも一部を上記第2の粘着性フィルムに密着させ、上記移載版と上記第2の粘着性フィルムとの粘着力の差を利用して、上記移載版に粘着している複数個の素子の少なくとも一部を、その移載版から剥離し、上記第2の粘着性フィルムに剥離可能に粘着する工程と、
を備えている素子の移載方法。
〔2〕上記移載版を、円筒状ないし円柱状の版胴の外周面に装着した状態で、その版胴を回転させながら、上記第1の粘着性フィルム上の素子および上記第2の粘着性フィルムの少なくとも一方に密着させる上記〔1〕に記載の素子の移載方法。
〔3〕上記移載版の、上記素子との密着面に、複数の凸条が所定ピッチで並設され、上記凸条の頂面が、上記素子との密着面に形成されている上記〔1〕または〔2〕に記載の素子の移載方法。
〔4〕上記素子が、赤,緑,青のいずれか1色を発光する発光素子であり、複数個の単色の上記発光素子がそれぞれ独立した状態で剥離可能に粘着されている第1の粘着性フィルムを各色準備し、各色の発光素子を順に、上記移載版への粘着を経て、1枚の上記第2の粘着性フィルムに粘着し、その第2の粘着性フィルム上に、赤,緑,青の発光素子を、隣接させる上記〔1〕~〔3〕のいずれかに記載の素子の移載方法。
〔5〕上記〔1〕~〔4〕のいずれかに記載の素子の移載方法に用いる移載版であって、上記素子との密着面の粘着力が、150~250mN/mm2 の範囲内である移載版。
なお、図1では、上記移載版1の構成をわかりやすくするために、各構成を模式的に示すとともに、各構成の大きさの縮尺を変えて図示している。
なお、図2では、上記マイクロLEDの移載方法をわかりやすく説明するために、その移載方法に関わる各構成を模式的に示すとともに、各構成の大きさの縮尺を変えて図示している。以降の図3~図9でも同様である。
〈移載版〉
移載版の形成材料として、ポリブタジエン系液状光硬化性樹脂を用い、フォトリソグラフィ法により、図1に示す、複数の凸条1aが形成された移載版1を作製した。この移載版1は、長方形板状(縦276mm×横185mm×厚み2.84mm)とし、上記移載版1の吸着有効部位に配置される上記凸条1aは、ピッチ4.035mmで15本形成し、各凸条1aの大きさは、高さ0.791mm×幅1.1mm×長さ80mmとした。そして、その移載版1の粘着力を、レスカ社製タック試験機(TAC-1000、測定プローブの面積78.54mm2 )を用いて測定すると、192.6mN/mm2 であった。なお、その粘着力の測定は、測定位置を変えて3回測定し、その平均値をとった。
上記移載版1を用い、上記実施の形態と同様にして、6000万個のマイクロLED2aを移載した。上記移載版1は、1000個のマイクロLED2aを一括して粘着することができるものとなっている。そのため、上記6000万個のマイクロLED2aの移載には、6万回の移載が必要であった。1回の移載に5秒間を要したため、上記6000万個のマイクロLED2aの移載は、30万秒間(約83時間)で完了した。なお、この実施例では、第1の粘着フィルムとして粘着力が75mN/mm2のダイシングフィルム(リンテック社製、D175)を紫外線照射により粘着力を弱めて用い(紫外線照射後の粘着力:7.5mN/mm2)、第2の粘着フィルムとして粘着力が650mN/mm2のダイシングフィルム(ヒューグルエレクトロニクス社製、HUG-PT)を用いている。
冒頭に述べたように、6000万個のマイクロLED2aを1個ずつ、チップマウンタを用いて移載した。1回の移載に0.1秒を要したため、上記6000万個のマイクロLED2aの移載に、600万秒間(約69日間)を要した。
2a マイクロLED
F1 第1の粘着性フィルム
Claims (3)
- 複数個の素子が、それぞれ独立した状態で剥離可能に粘着されている第1の粘着性フィルムを準備する工程と、
上記第1の粘着性フィルムよりも粘着力が大きい移載版を、上記複数個の素子の少なくとも一部に密着させ、上記第1の粘着性フィルムと上記移載版との粘着力の差を利用して、上記第1の粘着性フィルムに粘着している複数個の素子の少なくとも一部を、その第1の粘着性フィルムから剥離し、上記移載版に剥離可能に粘着する工程と、
上記移載版よりも粘着力が大きい第2の粘着性フィルムを準備し、上記移載版に粘着している複数個の素子の少なくとも一部を上記第2の粘着性フィルムに密着させ、上記移載版と上記第2の粘着性フィルムとの粘着力の差を利用して、上記移載版に粘着している複数個の素子の少なくとも一部を、その移載版から剥離し、上記第2の粘着性フィルムに剥離可能に粘着する工程と、
を備え、上記移載版を、円筒状ないし円柱状の版胴の外周面に装着した状態で、その版胴を回転させながら、上記第1の粘着性フィルム上の素子および上記第2の粘着性フィルムの少なくとも一方に密着させる素子の移載方法であって、
上記移載版の、上記素子との密着面に、複数の凸条が所定ピッチで並設され、上記凸条の頂面が、上記素子との密着面に形成され、上記凸条の長手方向が上記版胴の回転方向になっていることを特徴とする素子の移載方法。 - 上記素子が、赤,緑,青のいずれか1色を発光する発光素子であり、複数個の単色の上記発光素子がそれぞれ独立した状態で剥離可能に粘着されている第1の粘着性フィルムを各色準備し、各色の発光素子を順に、上記移載版への粘着を経て、1枚の上記第2の粘着性フィルムに粘着し、その第2の粘着性フィルム上に、赤,緑,青の発光素子を、隣接させる請求項1記載の素子の移載方法。
- 上記請求項1または2記載の素子の移載方法に用いる移載版であって、上記素子との密着面に、複数の凸条が所定ピッチで並設され、上記凸条の頂面が、上記素子との密着面に形成され、上記凸条の長手方向が上記版胴の回転方向になっており、上記素子との密着面の粘着力が、150~250mN/mm2の範囲内であることを特徴とする移載版。
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KR20220077601A (ko) * | 2020-12-02 | 2022-06-09 | 엘지디스플레이 주식회사 | 발광 소자의 전사 방법 및 이를 이용한 표시 장치의 제조 방법 |
JP6978129B1 (ja) * | 2021-03-18 | 2021-12-08 | 株式会社写真化学 | デバイスチップの移載機構 |
TWI812417B (zh) * | 2022-08-19 | 2023-08-11 | 萬潤科技股份有限公司 | 電子元件移載方法及電子元件背膜設備 |
JP7254394B1 (ja) | 2022-12-02 | 2023-04-10 | 株式会社写真化学 | 電子部品移載ロール及び電子部品移載方法 |
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US20160240516A1 (en) | 2015-02-17 | 2016-08-18 | Chun-Yen Chang | Method of manufacturing semiconductor device array |
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