JP7241100B2 - 加工装置及び加工方法 - Google Patents
加工装置及び加工方法 Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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Description
先ず、本実施形態にかかる加工装置の構成について説明する。図4は、加工装置1の構成の概略を模式的に示す平面図である。
次に、以上のように構成された加工装置1を用いて行われる加工処理について、図8に示すフローチャートに沿って説明する。
上述したように、加工装置1による研削加工において発生した研削屑Dは、ポーラス部32によるウェハWの吸引の影響で、基板保持面31aの外縁部に入り込み、特にノッチ部Wnにおいて堆積しやすく、これにより研削加工におけるTTVが悪化する場合がある。ここで、特にノッチ部Wnにおいて研削屑Dが堆積しやすいのは、図11に示すように平面視においてノッチ部Wnが形成された部分においては、ウェハWの搬送精度やアライメント精度によってはポーラス部32が露出する場合があり、当該露出部に研削屑Dが積極的に吸引されてしまうことに起因すると考えられる。
なお、基板保持部31に保持されるウェハWの水平方向の向きを、処理するウェハWの1枚毎に変更するように制御してもよい。
31 基板保持部
31a 基板保持面
140 第1の外縁洗浄ユニット
150 第2の外縁洗浄ユニット
W ウェハ
Wa 表面
Wb 裏面
Claims (14)
- 基板を加工する加工装置であって、
前記基板を吸着保持する基板保持面を有する基板保持部と、
前記基板保持部の全面を洗浄する保持部全面洗浄部と、
前記基板保持面の外縁部を洗浄する外縁洗浄部を備え、
前記基板保持部は、前記基板の受け渡しを行う受渡位置と、前記基板に研削加工を施す加工位置と、の間で移動自在に構成され、
前記受渡位置には、前記外縁洗浄部と前記保持部全面洗浄部と、が配置される、加工装置。 - 基板を加工する加工装置であって、
前記基板を吸着保持する基板保持面を有する基板保持部と、
前記基板の全面を洗浄する全面洗浄部と、
前記基板保持面の外縁部を洗浄する外縁洗浄部を備え、
前記基板保持部は、前記基板の受け渡しを行う受渡位置と、前記基板に研削加工を施す加工位置と、の間で移動自在に構成され、
前記受渡位置には、前記外縁洗浄部と前記全面洗浄部と、が配置される、加工装置。 - 前記外縁洗浄部は、
前記基板保持部の上方に設けられ、少なくとも、前記外縁部に当接することにより洗浄を行う洗浄用ブラシ、または前記外縁部に流体を供給することにより洗浄を行うノズル、を備える、請求項1または2に記載の加工装置。 - 基板を加工する加工装置であって、
前記基板を吸着保持する基板保持面を有する基板保持部と、
前記基板保持部に保持された前記基板に洗浄液を供給する洗浄液供給部と、
前記基板保持面の外縁部を洗浄する外縁洗浄部を備え、
前記基板保持部は、前記基板の受け渡しを行う受渡位置と、前記基板に研削加工を施す加工位置と、の間で移動自在に構成され、
前記加工位置には、前記洗浄液供給部と前記外縁洗浄部と、が配置される、加工装置。 - 前記外縁洗浄部は前記外縁部の径方向外側に設けられ、前記外縁部に流体を供給することにより洗浄を行うノズルを有する、請求項4に記載の加工装置。
- 前記外縁洗浄部は、前記基板保持面の接線方向へ流体を供給する、請求項5に記載の加工装置。
- 前記外縁洗浄部が複数設けられる、請求項5または6に記載の加工装置。
- 前記基板の周縁部にはノッチが形成され、
前記基板保持面には、前記基板保持部に前記基板を保持した際に、平面視において前記ノッチと対応する位置に切欠きが形成される、請求項1~7のいずれか一項に記載の加工装置。 - 前記基板の周縁部にはノッチが形成され、
前記外縁洗浄部は、前記基板保持面の外縁部のうち前記ノッチに対応する部分の洗浄を行う、請求項1~8のいずれか一項に記載の加工装置。 - 前記基板の円周方向の位置を調節する位置調節部と、
前記位置調節部の動作を制御する制御部と、を備え、
前記加工位置においては、複数の前記基板に対して連続的に研削加工が施され、
複数の前記基板の各々の周縁部にはノッチが形成され、
前記制御部は、前記基板保持部で連続的に保持される複数の前記基板のうち、一の前記基板に形成された前記ノッチの位置と、次に加工される他の前記基板に形成された前記ノッチの位置とを平面視において一致させず、前記基板保持面に対する一の前記基板の前記ノッチの位置に対応する研削屑の堆積位置と、他の前記基板の前記ノッチの位置に対応する研削屑の堆積位置を変更するように、前記基板の円周方向の位置を制御する、請求項1~7のいずれか一項に記載の加工装置。 - 基板を加工する加工方法であって、
基板保持部の基板保持面で前記基板を吸着保持した状態で前記基板を研削加工することと、
前記基板保持部に保持された前記基板が搬出された後、当該基板保持部の全面と前記基板保持面の外縁部とを洗浄することと、を含む、加工方法。 - 前記基板の周縁部にはノッチが形成され、
前記基板保持部は、平面視において前記基板保持面に形成された切欠きと前記ノッチとが対応するように、前記基板を保持する、請求項11に記載の加工方法。 - 前記基板の周縁部にはノッチが形成され、
前記基板保持面の外縁部の洗浄においては、前記外縁部のうち前記ノッチに対応する部分の洗浄が行われる、請求項11または12に記載の加工方法。 - 前記基板の円周方向の位置を調節することを含み、
連続的に研削加工が施される複数の前記基板の各々の周縁部にはノッチが形成され、
前記基板保持部で連続的に保持され、前記研削加工が行われる複数の前記基板において、一の前記基板に形成された前記ノッチの位置と、次に加工される他の前記基板に形成された前記ノッチの位置とを平面視において一致させず、前記基板保持面に対する一の前記基板の前記ノッチの位置に対応する研削屑の堆積位置と、他の前記基板の前記ノッチの位置に対応する研削屑の堆積位置を変更するように、前記基板の円周方向の位置を調節する、請求項11に記載の加工方法。
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