JP7237421B2 - 被加工物の加工方法 - Google Patents
被加工物の加工方法 Download PDFInfo
- Publication number
- JP7237421B2 JP7237421B2 JP2019003111A JP2019003111A JP7237421B2 JP 7237421 B2 JP7237421 B2 JP 7237421B2 JP 2019003111 A JP2019003111 A JP 2019003111A JP 2019003111 A JP2019003111 A JP 2019003111A JP 7237421 B2 JP7237421 B2 JP 7237421B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting blade
- workpiece
- cutting
- outer diameter
- wear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Description
13 テープ(ダイシングテープ)
15 フレーム
2 切削装置
4 基台
6 X軸移動機構
8 X軸ガイドレール
10 X軸移動テーブル
12 X軸ボールねじ
14 X軸パルスモータ
16 テーブルベース
18 チャックテーブル(保持テーブル)
18a 保持面
20 クランプ
22 ウォーターケース
24 支持構造
26 移動ユニット(移動機構)
28 Y軸ガイドレール
30 Y軸移動プレート
32 Y軸ボールねじ
34 Y軸パルスモータ
36 Z軸ガイドレール
38 Z軸移動プレート
40 Z軸ボールねじ
42 Z軸パルスモータ
44 切削ユニット
46 撮像ユニット(カメラ)
48 ハウジング
50 スピンドル
52 切削ブレード
52a 摩耗前の切削ブレード
52b 摩耗後の切削ブレード
54 ノズル
56 制御ユニット(制御部)
60 回転制御システム
62 センサ部
64 検出器
64a 支持部
64b 投光部
64c 受光部
66 光源
68 光電変換部
70 位置検出部
72 外径算出部
74 回転数算出部
76 記憶部
78 回転制御部
Claims (1)
- 切削ブレードで被加工物を切削する被加工物の加工方法であって、
所定の周速で回転する該切削ブレードを該被加工物に切り込ませて該被加工物を切削することにより摩耗した該切削ブレードの外径を算出する外径算出ステップと、
該外径算出ステップで算出された該切削ブレードの外径に基づき、該所定の周速と摩耗後の該切削ブレードの周速との差を所定の値以下とする摩耗後の該切削ブレードの回転数を算出する回転数算出ステップと、
該回転数算出ステップで算出された回転数に対応する回転数で摩耗後の該切削ブレードを回転させて該被加工物に切り込ませ、該被加工物を切削する切削ステップと、を備え、
該外径算出ステップと、該回転数算出ステップと、該切削ステップと、を複数回実施して該被加工物を加工することを特徴とする被加工物の加工方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019003111A JP7237421B2 (ja) | 2019-01-11 | 2019-01-11 | 被加工物の加工方法 |
CN202010016707.7A CN111435640A (zh) | 2019-01-11 | 2020-01-08 | 被加工物的加工方法 |
KR1020200002508A KR20200087699A (ko) | 2019-01-11 | 2020-01-08 | 피가공물의 가공 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019003111A JP7237421B2 (ja) | 2019-01-11 | 2019-01-11 | 被加工物の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020110865A JP2020110865A (ja) | 2020-07-27 |
JP7237421B2 true JP7237421B2 (ja) | 2023-03-13 |
Family
ID=71581069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019003111A Active JP7237421B2 (ja) | 2019-01-11 | 2019-01-11 | 被加工物の加工方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7237421B2 (ja) |
KR (1) | KR20200087699A (ja) |
CN (1) | CN111435640A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016186958A (ja) | 2015-03-27 | 2016-10-27 | 株式会社東京精密 | ダイシング装置及びダイシング装置によるダイシング方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07156059A (ja) * | 1993-12-03 | 1995-06-20 | Kubota Corp | 管切断装置 |
JPH07299744A (ja) * | 1994-04-28 | 1995-11-14 | Kubota Corp | 管の切断方法 |
US5718615A (en) * | 1995-10-20 | 1998-02-17 | Boucher; John N. | Semiconductor wafer dicing method |
JP2010129623A (ja) | 2008-11-26 | 2010-06-10 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2013184276A (ja) * | 2012-03-09 | 2013-09-19 | Disco Corp | バイト切削方法 |
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2019
- 2019-01-11 JP JP2019003111A patent/JP7237421B2/ja active Active
-
2020
- 2020-01-08 CN CN202010016707.7A patent/CN111435640A/zh active Pending
- 2020-01-08 KR KR1020200002508A patent/KR20200087699A/ko active Search and Examination
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016186958A (ja) | 2015-03-27 | 2016-10-27 | 株式会社東京精密 | ダイシング装置及びダイシング装置によるダイシング方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20200087699A (ko) | 2020-07-21 |
CN111435640A (zh) | 2020-07-21 |
JP2020110865A (ja) | 2020-07-27 |
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