JP7237261B1 - 開口数可変装置、レーザ装置およびレーザ加工機 - Google Patents

開口数可変装置、レーザ装置およびレーザ加工機 Download PDF

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Publication number
JP7237261B1
JP7237261B1 JP2022579057A JP2022579057A JP7237261B1 JP 7237261 B1 JP7237261 B1 JP 7237261B1 JP 2022579057 A JP2022579057 A JP 2022579057A JP 2022579057 A JP2022579057 A JP 2022579057A JP 7237261 B1 JP7237261 B1 JP 7237261B1
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Prior art keywords
laser
numerical aperture
laser beams
transmission fiber
transmission
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JP2022579057A
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Japanese (ja)
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JPWO2024028972A5 (https=
JPWO2024028972A1 (https=
Inventor
友博 京藤
弘 菊池
恭平 石川
正人 河▲崎▼
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2022579057A 2022-08-02 2022-08-02 開口数可変装置、レーザ装置およびレーザ加工機 Active JP7237261B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/029624 WO2024028972A1 (ja) 2022-08-02 2022-08-02 開口数可変装置、レーザ装置およびレーザ加工機

Publications (3)

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JP7237261B1 true JP7237261B1 (ja) 2023-03-10
JPWO2024028972A1 JPWO2024028972A1 (https=) 2024-02-08
JPWO2024028972A5 JPWO2024028972A5 (https=) 2024-07-09

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JP2022579057A Active JP7237261B1 (ja) 2022-08-02 2022-08-02 開口数可変装置、レーザ装置およびレーザ加工機

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Country Link
US (1) US20250170672A1 (https=)
JP (1) JP7237261B1 (https=)
CN (1) CN119317506B (https=)
DE (1) DE112022007071B4 (https=)
WO (1) WO2024028972A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07227686A (ja) * 1994-02-22 1995-08-29 Mitsubishi Electric Corp 光伝送装置及び光照射方法
WO2008096863A1 (ja) * 2007-02-09 2008-08-14 Fujikura Ltd. ファイバレーザ
JP2017506769A (ja) * 2014-02-26 2017-03-09 ビエン チャン， 可変ビームパラメータ積を有するマルチビームレーザ配列のためのシステムおよび方法
WO2019176502A1 (ja) * 2018-03-15 2019-09-19 パナソニックＩｐマネジメント株式会社 レーザ発振器、それを用いたレーザ加工装置及びレーザ発振方法
JP2020199513A (ja) * 2019-06-07 2020-12-17 株式会社アマダ レーザ加工機及びレーザ加工機の制御方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5064778B2 (ja) * 2006-12-11 2012-10-31 オリンパス株式会社 レーザ加工装置
JP2009072789A (ja) * 2007-09-18 2009-04-09 Hamamatsu Photonics Kk レーザ加工装置
CN105720463B (zh) * 2014-08-01 2021-05-14 恩耐公司 光纤和光纤传输的激光器中的背向反射保护与监控
JP5909537B1 (ja) * 2014-10-14 2016-04-26 株式会社アマダホールディングス ダイレクトダイオードレーザ発振器、ダイレクトダイオードレーザ加工装置及び反射光検出方法
DE102017210350B3 (de) * 2017-06-21 2018-03-29 Trumpf Laser Gmbh Vorrichtung zur Auskopplung von Strahlung aus einer Lichtleitfaser, Lichtleitkabel und Bearbeitungskopf damit
JP7382553B2 (ja) * 2019-05-29 2023-11-17 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びそれを用いたレーザ加工方法
JP7437745B2 (ja) * 2020-03-13 2024-02-26 パナソニックＩｐマネジメント株式会社 レーザ発振器及びレーザ加工装置
JP7579112B2 (ja) * 2020-11-11 2024-11-07 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、及び半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07227686A (ja) * 1994-02-22 1995-08-29 Mitsubishi Electric Corp 光伝送装置及び光照射方法
WO2008096863A1 (ja) * 2007-02-09 2008-08-14 Fujikura Ltd. ファイバレーザ
JP2017506769A (ja) * 2014-02-26 2017-03-09 ビエン チャン， 可変ビームパラメータ積を有するマルチビームレーザ配列のためのシステムおよび方法
WO2019176502A1 (ja) * 2018-03-15 2019-09-19 パナソニックＩｐマネジメント株式会社 レーザ発振器、それを用いたレーザ加工装置及びレーザ発振方法
JP2020199513A (ja) * 2019-06-07 2020-12-17 株式会社アマダ レーザ加工機及びレーザ加工機の制御方法

Also Published As

Publication number Publication date
CN119317506B (zh) 2025-11-18
CN119317506A (zh) 2025-01-14
US20250170672A1 (en) 2025-05-29
WO2024028972A1 (ja) 2024-02-08
DE112022007071T5 (de) 2025-03-06
DE112022007071B4 (de) 2026-04-23
JPWO2024028972A1 (https=) 2024-02-08

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