DE112022007071B4 - Vorrichtung zum Ändern der numerischen Apertur, Laservorrichtung und Laserstrahlmaschine - Google Patents

Vorrichtung zum Ändern der numerischen Apertur, Laservorrichtung und Laserstrahlmaschine

Info

Publication number
DE112022007071B4
DE112022007071B4 DE112022007071.4T DE112022007071T DE112022007071B4 DE 112022007071 B4 DE112022007071 B4 DE 112022007071B4 DE 112022007071 T DE112022007071 T DE 112022007071T DE 112022007071 B4 DE112022007071 B4 DE 112022007071B4
Authority
DE
Germany
Prior art keywords
laser
changing
laser beams
numerical aperture
transmission fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112022007071.4T
Other languages
German (de)
English (en)
Other versions
DE112022007071T5 (de
Inventor
Tomohiro Kyoto
Hiroshi Kikuchi
Kyohei ISHIKAWA
Masato Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112022007071T5 publication Critical patent/DE112022007071T5/de
Application granted granted Critical
Publication of DE112022007071B4 publication Critical patent/DE112022007071B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE112022007071.4T 2022-08-02 2022-08-02 Vorrichtung zum Ändern der numerischen Apertur, Laservorrichtung und Laserstrahlmaschine Active DE112022007071B4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/029624 WO2024028972A1 (ja) 2022-08-02 2022-08-02 開口数可変装置、レーザ装置およびレーザ加工機

Publications (2)

Publication Number Publication Date
DE112022007071T5 DE112022007071T5 (de) 2025-03-06
DE112022007071B4 true DE112022007071B4 (de) 2026-04-23

Family

ID=85503266

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022007071.4T Active DE112022007071B4 (de) 2022-08-02 2022-08-02 Vorrichtung zum Ändern der numerischen Apertur, Laservorrichtung und Laserstrahlmaschine

Country Status (5)

Country Link
US (1) US20250170672A1 (https=)
JP (1) JP7237261B1 (https=)
CN (1) CN119317506B (https=)
DE (1) DE112022007071B4 (https=)
WO (1) WO2024028972A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008096863A1 (ja) * 2007-02-09 2008-08-14 Fujikura Ltd. ファイバレーザ
DE102008045778A1 (de) * 2007-09-18 2009-03-19 Hamamatsu Photonics K.K., Hamamatsu Laserstrahlanlage
WO2015130920A1 (en) 2014-02-26 2015-09-03 Bien Chann Systems and methods for multiple-beam laser arrangements with variable beam parameter product
DE112015004718T5 (de) * 2014-10-14 2017-07-06 Amada Holdings Co., Ltd. Direktdiodenlaseroszillator, Direktdiodenlaser-Bearbeitungsvorrichtung und Ermittlungsverfahren für reflektiertes Licht
US10901162B2 (en) * 2014-08-01 2021-01-26 Nlight, Inc. Back-reflection protection and monitoring in fiber and fiber-delivered lasers
US20220072655A1 (en) * 2019-05-29 2022-03-10 Panasonic Intellectual Property Management Co., Ltd. Laser processing device and laser processing method using same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3531199B2 (ja) * 1994-02-22 2004-05-24 三菱電機株式会社 光伝送装置
JP5064778B2 (ja) * 2006-12-11 2012-10-31 オリンパス株式会社 レーザ加工装置
DE102017210350B3 (de) * 2017-06-21 2018-03-29 Trumpf Laser Gmbh Vorrichtung zur Auskopplung von Strahlung aus einer Lichtleitfaser, Lichtleitkabel und Bearbeitungskopf damit
WO2019176502A1 (ja) * 2018-03-15 2019-09-19 パナソニックＩｐマネジメント株式会社 レーザ発振器、それを用いたレーザ加工装置及びレーザ発振方法
JP2020199513A (ja) * 2019-06-07 2020-12-17 株式会社アマダ レーザ加工機及びレーザ加工機の制御方法
JP7437745B2 (ja) * 2020-03-13 2024-02-26 パナソニックＩｐマネジメント株式会社 レーザ発振器及びレーザ加工装置
JP7579112B2 (ja) * 2020-11-11 2024-11-07 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、及び半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008096863A1 (ja) * 2007-02-09 2008-08-14 Fujikura Ltd. ファイバレーザ
DE102008045778A1 (de) * 2007-09-18 2009-03-19 Hamamatsu Photonics K.K., Hamamatsu Laserstrahlanlage
WO2015130920A1 (en) 2014-02-26 2015-09-03 Bien Chann Systems and methods for multiple-beam laser arrangements with variable beam parameter product
DE112015000994T5 (de) 2014-02-26 2016-11-03 Bien Chann Systeme und Verfahren für Mehrstrahl-Laseranordnungen mit veränderbarem Strahlparameterprodukt
US10901162B2 (en) * 2014-08-01 2021-01-26 Nlight, Inc. Back-reflection protection and monitoring in fiber and fiber-delivered lasers
DE112015004718T5 (de) * 2014-10-14 2017-07-06 Amada Holdings Co., Ltd. Direktdiodenlaseroszillator, Direktdiodenlaser-Bearbeitungsvorrichtung und Ermittlungsverfahren für reflektiertes Licht
US20220072655A1 (en) * 2019-05-29 2022-03-10 Panasonic Intellectual Property Management Co., Ltd. Laser processing device and laser processing method using same

Also Published As

Publication number Publication date
CN119317506B (zh) 2025-11-18
CN119317506A (zh) 2025-01-14
US20250170672A1 (en) 2025-05-29
WO2024028972A1 (ja) 2024-02-08
DE112022007071T5 (de) 2025-03-06
JP7237261B1 (ja) 2023-03-10
JPWO2024028972A1 (https=) 2024-02-08

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R016 Response to examination communication
R018 Grant decision by examination section/examining division